Tag Archives: White Paper

White Paper: RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

AWR published a new white paper about the design flow and its essential features for most PA design projects. The article presents a design of a simple, Class A GaAs pHEMT monolithic microwave integrated circuit (MMIC) PA using AWR’s Microwave Office high-frequency design software. The title of the technical paper is RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design.

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Ormiston Wire Publishes Heat Exchange Efficiency White Paper

Heat Exchange Efficiency White Paper

Ormiston Wire recently published a white paper on heat exchange efficiency. The article looks at the mechanics of heat exchange technology, its uses in industry and the advancements that Ormiston itself has achieved. The technical paper helps engineers in the selection and specification of heat transfer components. The white paper will benefit engineers in refrigeration, power plants, petrochemical and sewage treatments and beyond.

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eBook: Faster Firmware Debug with Intel Embedded Trace Tools

Faster Firmware Debug with Intel Embedded Trace Tools eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication discusses how hardware-assisted debugging tools are able to tap into the embedded trace resources in Intel processors to methodically and quickly track bugs through the interrelated web of software, firmware and hardware. The title of the paper is: Faster Firmware Debug with Intel Embedded Trace Tools.

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New eBook: Testing DDR3 Memory Boundary Scan JTAG

Testing DDR3 Memory Boundary Scan JTAG eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication explains how to test DDR memory with non-intrusive JTAG or boundary-scan (IEEE 1149.1) methods. The title of the paper is Testing DDR3 Memory Boundary Scan JTAG. The paper was written by Kent Zetterberg, product manager, ASSET InterTech.

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White Paper: Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?

SOR recently published a white paper about selecting the right instrumentation for the job. The article presents three questions to help the engineers determine the best instrumentation for the application. The technical paper is titled, Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?

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Five Things to Consider Before Buying Spiral Bevel Gear Drives White Paper

Five Things to Consider Before Buying Spiral Bevel Gear Drives

Lampin recently published a white paper about spiral bevel gear. The technical paper guides engineers through the specification process. It discusses variables such as lead times, costs, reliability, ordering ease, applications expertise, and customized solutions. The article is titled, Five Things To Consider Before Buying Spiral Bevel Gear Drives.

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White Paper: Efficiency Standards for External Power Supplies

Efficiency Standards for External Power Supplies white paper

CUI recently published a white paper about the efficiency standards for external power supplies. The technical paper provides an up to date summary of the most current regulations worldwide. The article was written by Jeff Schnabel, VP of Marketing of CUI.

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White Paper: Solving the Problem of Diminishing Test Coverage from In-circuit Test

Solving the problem of diminishing test coverage from in-circuit test (ICT) white paper ~ ASSET InterTech

ASSET InterTech released a new white paper that explains why test coverage from intrusive, probe-based in-circuit testers with their bed-of-nails fixtures is diminishing. The technical paper is titled, Solving the problem of diminishing test coverage from in-circuit test (ICT). The ebook was written by Adam Ley, chief technologist of non-intrusive board test for ASSET.

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White Paper Explains How Increasing Bus Speeds Degrades Throughput Performance

Bandwidth tests reveal shrinking eye diagrams and signal integrity problems

ASSET InterTech published a white paper titled: Bandwidth tests reveal shrinking eye diagrams and signal integrity problems. The paper explains how increasing bus speeds on circuit boards could create havoc for signal integrity on those buses, in turn degrading the bus’ throughput performance. Each new generation of a high-speed bus typically runs at a higher signal frequency, but this decreases the margin for error on the bus, making it more sensitive to disruptions from jitter, inter-symbol interference (ISI), crosstalk and other factors.

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White Paper: How to test high-speed memory with non-intrusive embedded instruments

How to test high-speed memory with non-intrusive embedded instruments white paper

ASSET InterTech published a new white paper about non-intrusive embedded instruments. The technical paper explains how non-intrusive software-driven embedded instruments can overcome many of the challenges of testing, validating and debugging high-speed memory buses such the DDR 3 or DDR4 (DDR3/4) buses, and others. The title of their article is “How to test high-speed memory with non-intrusive embedded instruments.”

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