Elsevier recently published seven new titles in the area of Electrical Engineering and Communications. The titles of the books are Optical Fiber Telecommunications Volume VIA, Optical Fiber Telecommunications Volume VIB, Electromagnetic Surface Waves: A Modern Perspective, Op Amps for Everyone, Intelligent Systems for Security Informatics, Advances in Analog and RF IC Design for Wireless Communication Systems, and System Parameter Identification: Information Criteria and Algorithms.
Duke University engineers have created a new generation of lens that could greatly improve the capabilities of telecommunications or radar systems to provide a wide field of view and greater detail. But the lens they fashioned doesn’t look anything like a lens. While traditional lenses are made of clear substances – like glass or plastic – with highly polished surfaces, the new lens looks more like a miniature set of tan Venetian blinds. Yet its ability to focus the direction of electromagnetic rays passing through it dramatically surpasses that of a conventional lens, the engineers say.
Applied Micro Circuits Corporation (NASDAQ:AMCC), a global leader in energy conscious computing and communications solutions, announced its new name as AppliedMicro to reflect the company’s drive for breakthrough energy efficiency and cost optimized semiconductor devices that will propel the company into new growth markets. In keeping with the 30-year AMCC heritage as an innovator in high-speed connectivity and high performance embedded processing, AppliedMicro will remain dedicated to its customers in the telco, datacenter and enterprise markets, while increasing market share by striving to reduce the power consumption of its products by as much as 50 percent.
AMD (NYSE: AMD) is demonstrating its latest advancements for helping improve the network performance capability of industry-standard Advanced Telecommunications Computing Architecture (ATCA) blade servers at the ATCA Summit. Quad-Core AMD Opteron[tm] processors, at 50 and 71W TDP, provide a high-performance, low-power platform for the networking and telecommunications market. The new AMD server chipset featuring PCI® Express 2.0 and HyperTransport[tm] 3 technology provides a complete solution with improved I/O capabilities to increase performance over previous-generation platforms.