Tag Archives: technical paper

White Paper: RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

AWR published a new white paper about the design flow and its essential features for most PA design projects. The article presents a design of a simple, Class A GaAs pHEMT monolithic microwave integrated circuit (MMIC) PA using AWR’s Microwave Office high-frequency design software. The title of the technical paper is RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design.

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Ormiston Wire Publishes Heat Exchange Efficiency White Paper

Heat Exchange Efficiency White Paper

Ormiston Wire recently published a white paper on heat exchange efficiency. The article looks at the mechanics of heat exchange technology, its uses in industry and the advancements that Ormiston itself has achieved. The technical paper helps engineers in the selection and specification of heat transfer components. The white paper will benefit engineers in refrigeration, power plants, petrochemical and sewage treatments and beyond.

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eBook: Faster Firmware Debug with Intel Embedded Trace Tools

Faster Firmware Debug with Intel Embedded Trace Tools eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication discusses how hardware-assisted debugging tools are able to tap into the embedded trace resources in Intel processors to methodically and quickly track bugs through the interrelated web of software, firmware and hardware. The title of the paper is: Faster Firmware Debug with Intel Embedded Trace Tools.

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CUI Publishes App Notes on IEC 60601-1 3rd Edition, Power Factor Correction

CUI published two application notes. The first app note is titled: IEC 60601-1 Medical Design Standards-3rd Edition. The technical paper looks at the IEC 60601-1 3rd edition standard and its implications for engineers specifying power supplies for medical devices. The second app note is titled: Power Factor and Power Factor Correction. It explains power factor and its implications in today’s power systems.

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New eBook: Testing DDR3 Memory Boundary Scan JTAG

Testing DDR3 Memory Boundary Scan JTAG eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication explains how to test DDR memory with non-intrusive JTAG or boundary-scan (IEEE 1149.1) methods. The title of the paper is Testing DDR3 Memory Boundary Scan JTAG. The paper was written by Kent Zetterberg, product manager, ASSET InterTech.

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How to Debug Dead Boards in Production eBook

How to Debug Dead Boards in Production eBook

ASSET InterTech published a new ebook: How to Debug Dead Boards in Production. The new publication is a case study that will help circuit board manufacturers who want to recover their investment in assembled boards that won’t boot so called dead boards and still maintain the tight production deadlines that constantly reduce the time they can spend on board debug.

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White Paper: Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?

SOR recently published a white paper about selecting the right instrumentation for the job. The article presents three questions to help the engineers determine the best instrumentation for the application. The technical paper is titled, Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?

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White Paper: Making Industrial Touch A Reality

Making Industrial Touch A Reality

Avnet Electronics Marketing published a white paper about how to make industrial touch screen a reality. The technical paper provides design engineers with the information that they need to take industrial touch solutions from fantasy to reality. The article encapsulates that background for the design engineers who are incorporating touch screens into industrial applications. The title of the white paper is Making Industrial Touch A Reality.

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Ebook: Functional Test on I2C and SPI System Monitors with JTAG

Functional Test on I2C and SPI System Monitors with JTAG ebook

ASSET InterTech published an ebook about JTAG. The article describes how the structural test methodology based on the IEEE 1149.1 boundary scan standard can apply functional tests to I2C and SPI system monitors during prototype board bring-up and later during production of the circuit board. The title of the technical paper is: Functional Test on I2C and SPI System Monitors with JTAG.

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Five Things to Consider Before Buying Spiral Bevel Gear Drives White Paper

Five Things to Consider Before Buying Spiral Bevel Gear Drives

Lampin recently published a white paper about spiral bevel gear. The technical paper guides engineers through the specification process. It discusses variables such as lead times, costs, reliability, ordering ease, applications expertise, and customized solutions. The article is titled, Five Things To Consider Before Buying Spiral Bevel Gear Drives.

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