Tag Archives: Silicon

Researchers Enable III-V Technology for High Volume Manufacturing

Researchers have made significant advances in post-epitaxial growth backside clean processing. The research will prepare III-V technology for high-volume manufacturing. The research leading to these accomplishments was conducted at SEMATECH’s facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York.

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First-Pass Silicon Success: Synopsys DesignWare 96 dB Hi-Fi Audio IP

Synopsys’ DesignWare 96 dB Hi-Fi Audio IP has achieved first-pass silicon success in 65-nanometer (nm) and 55-nm process technologies for multiple foundries. The silicon-proven audio IP is ideal for consumer electronic system-on-chip (SoC) applications such as portable media players, smart phones, CD/DVD/ Blu-Ray Disc players/recorders, digital TV and digital cameras. The Synopsys DesignWare 96 dB Hi-Fi Audio IP in 65-nm and 55-nm processes is available now for multiple foundries.

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Cadence Design Systems Expands Verification IP Catalog

Cadence Design Systems has expanded their portfolio of verification IP (VIP) and memory models for SoC, and System-level verification engineers and designers. The expanded Cadence VIP offering now supports all major third party simulators. As a result, Cadence offers designers a one-stop shop of mainstream and emerging protocols for developing and verifying advanced electronic designs.

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Fujitsu Reduces Power Consumption by Half with New Optical Switch

Fujitsu Laboratories Limited announced that it has been able to halve the power consumption of an optical waveguide switch based on silicon photonics through the world’s first use of fine-patterned silicon germanium (SiGe) for this application, rather than conventional silicon (Si). This achievement will allow for high-speed optical switches capable of operating across a wide range of wavelengths, while featuring the world’s lowest power requirements. In accordance with the constant rise of data volume being transmitted over networks, likewise, the power consumption of networking equipment shows a continuous growth trend, leading to concerns for a potentially serious energy problem in the future. Fujitsu’s newly-developed technology will help contain power consumption while supporting large-volume network traffic, thus enabling high-end services linking multiple cloud networks and ultra-high-definition videoconferencing, among other applications.

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Intel, Micron Develop 25nm 3-Bit-Per-Cell NAND Flash Memory

Intel Corporation and Micron Technology Inc. announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry’s highest capacity, smallest NAND device. The companies have sent initial product samples to select customers. Intel and Micron expect to be in full production by the end of the year.

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Power.org Reveals Power Architecture Silicon Roadmap

Power.org, the open collaborative organization that enables, develops and promotes standards for Power Architecture® technology, unveiled its new Power Architecture Silicon Roadmap, the heart of the Power Architecture ecosystem, and released data from IMS Research showing that Power Architecture technology remains the worldwide market leader.

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Apple iPhone 4 Smart Phone Teardown

Chipworks, the world’s leader in reverse engineering and patent infringement analysis for semiconductors and microelectronic systems, has done a silicon level teardown on the Apple iPhone 4. This teardown goes beyond just the package markings of the chips found inside and includes a consumer-level description of what makes the chips inside the Apple iPhone 4 so amazing. It also includes die photos and die markings where necessary to show the manufacturer of unmarked chips.

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ARM Selects Magma SiliconSmart Characterization, Modeling Software

Magma Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, announced that ARM (LSE: ARM; Nasdaq: ARMHY) has successfully utilized Magma’s SiliconSmart characterization and modeling software suite to enhance and expand ARM’s production characterization system for Physical IP products. This fast, accurate and easy-to-use characterization system will assist ARM in delivering standard cell and I/O libraries.

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Duke University Creates DNA Nanostructures for Future Logic Circuits

In a single day, a solitary grad student at a lab bench can produce more simple logic circuits than the world’s entire output of silicon chips in a month. So says a Duke University engineer, who believes that the next generation of these logic circuits at the heart of computers will be produced inexpensively in almost limitless quantities. The secret is that instead of silicon chips serving as the platform for electric circuits, computer engineers will take advantage of the unique properties of DNA, that double-helix carrier of all life’s information.

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Dow Corning, imec Team on Crystalline Silicon Solar Cells Research

Dow Corning, a global leader in silicones, silicon-based technology and innovation, signed a three-year contract with imec to perform joint research on next generations of crystalline silicon solar cells. In the framework of imec’s industrial affiliation program (IIAP) on silicon solar cells, Dow Corning has joined several program activities.

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