Tag Archives: RF

White Paper: RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

AWR published a new white paper about the design flow and its essential features for most PA design projects. The article presents a design of a simple, Class A GaAs pHEMT monolithic microwave integrated circuit (MMIC) PA using AWR’s Microwave Office high-frequency design software. The title of the technical paper is RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design.

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Analog Devices Debuts AD9525 Radio Frequency Clock Integrated Circuit

Analog Devices AD9525 radio frequency clock integrated circuit

Analog Devices announced their AD9525 radio frequency clock integrated circuit. The AD9525 RF clock IC offers the industry’s lowest jitter for communications and instrumentation equipment that requires high-speed data conversion and optimum SNR (signal-to-noise ratio) performance. The ADI chip is available now for $8.33 each (1000 quantity) in 48-lead LFCSP packaging. The AD9525 RF Clock complements ADI’s high-speed data converter portfolio.

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Microsemi Introduces ZL70250 Ultra Low Power Radio Frequency Transceiver

Microsemi introduced the ZL70250 ultra low power radio frequency transceiver. The ZL70250 ULP RF operates in unlicensed frequency bands between 795 and 965 megahertz (MHz) and has a data rate of 186 kilobits per second (kbps) to support a wide variety of sensor applications. All components are integrated into a single chip scale package (CSP) with the exception of a bias resistor and a supply decoupling capacitor. The radio chip is ideal for short-range wireless applications where power consumption is very importance.

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Analog Devices Unveils 14-bit AD9129 and 11-bit AD9119 RF D/A Converters

Analog Devices single-channel, 14-bit AD9129 and 11-bit AD9119 RF D/A converters

Analog Devices released their single-channel, 14-bit AD9129 and 11-bit AD9119 RF D/A converters. The two RF (radio frequency) D/A converters are able to synthesize the entire downstream (transmit) cable spectrum from a single RF port. The new devices are sampling now. Production release will be available by the end of November. The 14-bit, 2.8 GSPS AD9129 in a 160-Ball CSP-BGA Pb-free is priced at $59. The PbSn version is priced at $69. The 11-bit, 2.8 GSPS AD9119 is available now in a 160-Ball CSP-BGA packaging (Pb-free). It is priced at $49.

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Microchip Technology Debuts SST11CP16 5 GHz Power Amplifier

Microchip Technology SST11CP16 5 GHz power amplifier (PA)

Microchip Technology introduced their SST11CP16 5 GHz power amplifier (PA). The SST11CP16 provides high output power with extra-low EVM. The power amplifier extends the range of 802.11ac systems. The Microchip SST11CP16 RF power amplifier is available now in a 3x3x.45 mm, 16-pin QFN package. It is priced at $0.86 each (10,000-unit quantities). Sampling and volume production are both available now.

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Microchip Unveils SST12LF03 RF Front-End Module for WLAN IEEE 802.11b/g/n, Bluetooth

Microchip Technology introduced their SST12LF03 RF front-end module for WLAN IEEE 802.11b/g/n and Bluetooth systems. The SST12LF03 includes a transmitter power amplifier, a receiver low-noise amplifier (LNA) and a low-loss antenna switch — in one integrated, compact package. The high level of integration simplifies board design and extends the range of wireless systems. It is ideal for WLAN/BT embedded applications where small size and high performance are required. The new Microchip device is available in a 20-pin, 3mm x 3mm UQFN package for $0.61 each (10,000-unit quantities). Samples and volume-production quantities are available now.

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NVIDIA Acquires Icera, 3G and 4G Baseband Processors

NVIDIA will acquire Icera for $367 million in cash. Icera is one of the few remaining independent baseband processor providers for both 3G and 4G cellular phones, data modems, and tablets. The remaining independent suppliers are specialized in either 3G or 4G (but not both 3G and 4G). The acquisition has been approved by both companies’ boards of directors and is expected to be completed, subject to customary closing conditions, in about 30 days.

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Radio Frequency MEMS Boosts Apple iPhone 4

Help may be on the way for iPhone 4 users frustrated by dropped calls with the arrival of Radio Frequency Microelectromechanical Systems (RF MEMS), semiconductors that can improve the performance of antennas in cell phones, according to the market research firm iSuppli Corp. Long plagued by technological hurdles and other disappointing setbacks, RF MEMS are finally ready for the big time, with revenue projected to double in 2010 and more than triple in 2011. From slightly less than $4 million in 2006, global RF MEMS revenue is anticipated to climb to $8.1 million this year — and then surge to $27.9 million in 2011, according to iSuppli. By 2014, revenue will reach a whopping $223.2 million — a far cry from the industry’s extremely modest beginnings.

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AWR Connected for Cadence Allegro Enables PCB and RF Co-Design

AWR® Corporation, the innovation leader in high-frequency EDA, announced AWR Connected[tm] for Cadence® Allegro®, which enables PCB and RF co-design, simplifying the design process for high performance printed circuit board (PCB) design and significantly shortening cycle times. AWR Connected for Cadence Allegro is an interface between Cadence’s Allegro products, including both Allegro PCB and Allegro package/SiP design tools, and AWR’s Microwave Office® design software.

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Nationz Selects CustomSim Mixed-Signal, VCS Functional Verification

Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced that Nationz Technologies, Inc. has successfully achieved first-pass silicon success of a 2.5-gigahertz (GHz), 126-channel RF transceiver system-on-chip (SoC) design by using Synopsys’ CustomSim[tm] mixed-signal and VCS® functional verification solutions, part of Synopsys’ Discovery[tm] Verification Platform. These Synopsys tools delivered accurate and high-performance transient analysis of the power-up operation to within five percent of the actual silicon with 10x speed-up over Nationz’ previous tools for full-chip functional simulation. Having these capabilities shortened Nationz’ design cycle by more than two months and enabled first-pass silicon success.

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