Researchers have made significant advances in post-epitaxial growth backside clean processing. The research will prepare III-V technology for high-volume manufacturing. The research leading to these accomplishments was conducted at SEMATECH’s facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York.
IDTechEx published a new report, Most-Needed Chemicals for New Disruptive Electronics and Electrics (by Dr Peter Harrop). The publication explains how aluminium, copper and silver are widely deployed, sometimes in mildly alloyed, nano, precursor, ink or other form. The research includes the twelve basic compounds most widely used in new electronics and electrics and compares them with compounds exhibiting the broadest range of appropriate electrical and optical functions for the future.
The International SEMATECH Manufacturing Initiative recently published the results of their Worldwide Fab Energy Study. The research includes benchmark data to help identify the areas to reduce energy use and improve efficiency in semiconductor manufacturing operations. According to the study, there was a big a decrease in normalized fab energy consumption from 1997 to 2011. The ISMI Worldwide Fab Energy Study was conducted at 300 mm and 200 mm semiconductor manufacturing facilities in Asia, North America, and Europe.
A research team at the University of California, Riverside Bourns College of Engineering have made a breakthrough in thermal management of Gallium Nitride (GaN) power transistors. The research group demonstrated that hot spots in GaN transistors can be lowered by as much 20 degrees Celsius through the introduction of alternative heat-escaping channels implemented with graphene multilayers. Gallium Nitride is used in wireless applications because of its high efficiency and high voltage operation. However, GaN electronics generate a lot of heat that, until now, has been difficult to remove quickly.
SEMATECH recently presented nine research papers at the International VLSI Technology, System and Applications Symposium (VLSI-TSA). The SEMATECH researchers reported on innovative materials and new transistor structures to address key aspects of transistor performance, power, and cost. The white papers outlined leading-edge research in high-k/metal gate (HKMG) materials, resistive RAM (RRAM) memory, and planar and non-planar CMOS technologies.
Li-Shiuan Peh, an associate professor of electrical engineering and computer science at MIT, will present a paper at the 2012 Design Automation Conference in June. Peh and her colleagues will present a paper that summarizes ten years of research on networks on chip. In the paper, the researcher team established theoretical limits on the efficiency of packet-switched on-chip communication networks. In addition, they also presented measurements performed on a test chip in which they came very close to reaching several of those limits.
According to research by Strategy Analytics, smartphone owners in the US and UK prefer device screens in the 4″ to 4.5″ range, as long as the device is also thin. Almost 90% of existing smartphone owners surveyed chose a prototype smartphone with a display larger than their current device. This trend is driven by increased mobile web browsing capability, and engaging video and gaming experiences. However, in order for smartphone owners to adopt larger devices, it is important for handset manufacturers to ensure that mobile devices are not too heavy and that the devices remain thin enough for purses and pockets.
A research team have made a breakthrough discovery with graphene, which is a material that could play a major role in keeping laptops and other electronic devices from overheating. A key finding is the possibility of a strong enhancement of thermal conduction properties of isotopically pure graphene without substantial alteration of electrical, optical and other physical properties. Isotopically pure graphene can be ideal for many practical applications.
VDC Research released a report on how the mounting complexity of embedded systems is increasing the use of multicore processors. According to the multicore components and tools research, the physical limitations of single core chips have forced the transition to multicore processors. Volume 5 | Track 1 of the Embedded Software Engineering Market Technologies & Statistics report is available now.
element14 revealed the results of an independent survey. The study focused on critical pain points for global electronics engineers during the four stages of design – concept, design, prototyping, and pre-production. The study revealed several design challenges, including increasing time pressures, incomplete or inaccurate information from relevant sources, and difficulty comparing options and alternatives. The research was conducted by Technology Forecasters, Inc. (TFI).