Microchip Technology introduced the SST12CP12 power amplifier. The SST12CP12 is a 2.4 GHz high-power and high-gain power amp. The chip supports the 256-QAM ultra-high data rate modulation. The SST12CP12 is available now for sampling and volume production, in a 3x3x0.55 mm, 16-pin QFN package. It is priced at $0.976 each, in 10,000-unit quantities.
Microsemi announced the LX5509 power amplifier. The LX5509 PA is the second in a series of devices Microsemi is introducing to accelerate the proliferation of the next-generation Wi-Fi standard. The 5 gigahertz PA is ideal for IEEE 802.11ac (also known as fifth generation Wi-Fi) wireless access points and media devices. The LX5509 is packaged in a 4 mm x 4 mm quad flat no-lead (QFN) package and is available now for sampling.
Microchip Technology introduced their SST11CP16 5 GHz power amplifier (PA). The SST11CP16 provides high output power with extra-low EVM. The power amplifier extends the range of 802.11ac systems. The Microchip SST11CP16 RF power amplifier is available now in a 3x3x.45 mm, 16-pin QFN package. It is priced at $0.86 each (10,000-unit quantities). Sampling and volume production are both available now.
Microchip Technology introduced their SST12LF03 RF front-end module for WLAN IEEE 802.11b/g/n and Bluetooth systems. The SST12LF03 includes a transmitter power amplifier, a receiver low-noise amplifier (LNA) and a low-loss antenna switch — in one integrated, compact package. The high level of integration simplifies board design and extends the range of wireless systems. It is ideal for WLAN/BT embedded applications where small size and high performance are required. The new Microchip device is available in a 20-pin, 3mm x 3mm UQFN package for $0.61 each (10,000-unit quantities). Samples and volume-production quantities are available now.