Tag Archives: module

APC Paper Embedded Computer Features Recycled Cardboard Case

APC Rock Board

VIA Technologies introduced APC Rock and Paper. APC Rock is a board for prototyping projects. It is a complete redesign of the original APC module. APC Paper, which features a recycled cardboard case, is an embedded computer for connecting to the Internet without the need for Windows applications. Both Rock and Paper run a custom Android system built for keyboard and mouse input.

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Radiocrafts Announces RC1700HP-MBUS4 Wireless M-Bus Module

Radiocrafts RC1700HP-MBUS4 Wireless M-Bus Module

Radiocrafts introduced the RC1700HP-MBUS4 169 MHz module. The RC1700HP-MBUS4 includes a Wireless M-Bus stack, which supports all physical layers, MAC layers and frame formats, transport and security layers. It includes the features necessary for secure two-way communication between meter and concentrator. The module handles all of the critical timing for two-way communication. The Radiocrafts RC1700HP-MBUS4 Wireless M-Bus module is ideal for long range Automatic Meter Reading (AMR).

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Gemalto Cinterion Introduces EHS5 Wireless Module

Gemalto Cinterion EHS5 Wireless Module

Cinterion introduced the EHS5 high-speed M2M communication module. The Gemalto Cinterion solution provides secure wireless connectivity for industrial applications. It features a complete client Java runtime optimized for microcontrollers and other resource-constrained devices. The compact EHS5 device measures 18.8 x 27.6 x 2.3 mm. It is available in two variants: EHS5-US (850/1900 MHz) for North America, and EHS5-E (900/2100 MHz) for global coverage.

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Bruker Announces Photoconductive Atomic Force Microscopy Module

Bruker Photoconductive Module for the Dimension Icon Atomic Force Microscope (AFM)

Bruker introduced the Photoconductive Module for the Dimension Icon Atomic Force Microscope (AFM). The Photoconductive Atomic Force Microscopy (pcAFM) enables sample illumination while performing nanoscale electrical characterization. Bruker’s pcAFM accessory transforms the Dimension Icon AFM into a solution for dedicated nanoscale organic photoelectric material research.

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WizFi630 802.11b/g/n Embedded WiFi Module Connects Devices to Internet

WIZnet WizFi630 802.11b/g/n Embedded WiFi Module

The WIZnet WizFi630 is a high-performance embedded Wi-Fi gateway module. The board transforms RS-232 and TCP/IP protocol into IEEE802.11 b/g/n wireless LAN protocol. WizFi630 enables a device with a RS-232 serial interface to connect to LAN or WLAN for remote control, measurement, and administration. WizFi630 can also operate as an IP router due to its internally embedded switch. WizFi630 WiFi modules are available now. Prices start at $35.

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Libelium Launches 3G Module for Arduino Platform

Libelium 3G module for the Arduino platform

Libelium introduced a 3G module for the Arduino platform. The 3G shield for Arduino enables the connectivity to high speed WCDMA and HSPA cellular networks. It features transfers up to 7.2Mbps, which is 20 times faster than with GPRS technology. The module also includes an internal GPS that enables the location of any Arduino both outdoors and indoors, combining standard positioning data from satellites with mobile cell triangulation in the assisted mobile mode (A-GPS).

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VIA EITX-3002 Em-ITX Board

VIA Technologies introduced the EITX-3002 Em-ITX form factor board. The VIA EITX-3002 features VIA VX900H media system processor, 1.2GHz VIA Nano X2 E-Series or 1.0GHz VIA Eden X2 dual core processor, 17cm x 12cm Em-ITX form factor, onboard DC-to-DC converter, HDMI port, VGA port, two Gigabit Ethernet ports, dual COM ports, two USB ports, two USB 3.0 ports (optional), and power and HDD activity LEDs. The VIA EITX-3002 board is ideal for medical, healthcare, industrial and building automation, digital signage, kiosk, POI/POS, gaming and surveillance applications.

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Imsys SNAP Stamp Module

Imsys introduced their Stamp module. It is the latest new member of its Simple Network Application Platform (SNAP). The SNAP Stamp module features IM3910 MCU, SDRAM, flash memory, 10/100 Ethernet PHY (plus RMII interface for a 2nd Ethernet port), 3 UARTs, SPI/I2C, RTC, 8 timers, 8-ch ADC (16 bit), 2 DAC (16 bit), and a high-speed, 83 MB/s, data channel. It contains everything needed for the intelligent control of a networked final product. SNAP Stamp will be available next quarter. It will be priced at less than $50 in moderate quantities.

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Connect One Nano WiReach SMT WiFi Module

Connect One rolled out their Nano WiReach SMT, which is a secure embedded Wireless LAN module that easily connects embedded devices to 802.11b/g Wireless LAN, 10/100BaseT wired LAN and cellular WAN. The WiFi module features iChip CO2144 IP Communication Controller chip, Marvell 88W8686 WiFi chipset, multiple hardware interfaces, extensive firmware functionality, 3G routing, WiFi client and access-point capabilities. It supports secure Internet protocols for up to eight WiFi users in its router or access point mode. Nano WiReach SMT is now available at $26 for high-volume projects.

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Habey MITX-6910 Sandy Bridge Cloud Capable Board

Habey USA introduced the MITX-6910 Sandy Bridge cloud capable board. The MITX-6910 module features Socket LGA 1155 (for Intel Sandy Bridge 2nd generation i3/i5/i7 processor), dual mini-PCI, two SO-DIMM slots (up to 8GB memory), two SATA 3.0, eight USB 2.0, six Serial ports, dual Gigabit Ethernet, HD audio, two DVI-I display output, internal LVDS, and dual independent displays support. The Habey MITX-6920 is ideal for scalable cloud computing applications like digital signage applications and storage servers.

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