According to Evans Data Corp’s new Global Development Survey, most developers working on embedded systems in North America and the Asia Pacific regions are planning to migrate to a different hardware architecture. In a worldwide survey of over 1300 software developers, Intel was identified as the maker of the hardware architecture that would be targeted by the largest pluralities in North America, 29%, and Asia Pacific 34%.
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, introduced the Cadence® SOI Design Hub, a new Web portal that lowers the barriers to adopting silicon-on-insulator (SOI) technology through comprehensive silicon-proven design enablement solutions and services. The SOI Design Hub is aimed at reducing SOI adoption start-up costs, cutting time to market for SOI intellectual property (IP), and improving design quality.
ARM, Freescale Semiconductor, IBM, Samsung, ST-Ericsson and Texas Instruments Incorporated (TI), announced the formation of Linaro, a not-for-profit open source software engineering company dedicated to enhancing open source innovation for the next wave of always-connected, always-on computing. Linaro’s work will help developers and manufacturers provide consumers with more choice, more responsive devices and more diverse applications on Linux-based systems.
Cadence Design Systems, Inc. (NASDAQ: CDNS), the global leader in EDA360, announced a joint development agreement with IBM to create high-performance integration-optimized IP that will help customers deliver leading-edge designs while reducing the risk and time associated with integrating complex SoC Designs. Under the agreement, the companies will develop DDR PHYs, memory controllers, and protocols such as PCIe and Ethernet under 32-nanometer silicon-on-insulator. The technology will be used in servers, video games and other devices and will be available through the newly announced Cadence® Open Integration Platform.
IBM scientists unveiled a significant step towards replacing electrical signals that communicate via copper wires between computer chips with tiny silicon circuits that communicate using pulses of light. As reported in the recent issue of the scientific journal Nature, this is an important advancement in changing the way computer chips talk to each other. The device, called a nanophotonic avalanche photodetector, is the fastest of its kind and could enable breakthroughs in energy-efficient computing that can have significant implications for the future of electronics.
The recent announcement by IBM of its POWER7[tm] systems reinforces the Power Architecture® technology’s leadership in supporting the development of ground-breaking solutions that set new standards in price/performance, energy efficiency and virtualization, and emphasize the technology’s role as an indispensable building block for the world’s most demanding applications.
GDA Technologies, Inc., a leading supplier of configurable, reliable and production-proven Intellectual Property (IP) solutions for communication, storage and consumer markets, has announced that it is adding IBM’s PowerPC 440T90 to its existing 405S and 460S products using TSMC 90nm process technology. Customers can take advantage of this “hardened processor” that is optimized for performance, low power dissipation and optimized die size. This gives additional dimension to GDA’s expertise in developing SoC’s utilizing Power Architecture(R).
Ravenflow, the leader in visual requirements definition software, and Prolifics, the world’s largest end-to-end systems integrator specializing in IBM technologies, announced the immediate availability of RAVEN Visual Analyzer for IBM Rational Requirements Composer, a seamless embedded plug-in for IBM Rational Requirements Composer (RRC) that improves the way stakeholders elicit, specify, and validate business requirements. By visualizing and validating requirements before developing, organizations can dramatically cut implementation time and delivery cost.