Conexant Systems introduced the CX20865 Far-Field Voice input processor SoC. The system-on-chip is designed specifically for Smart TVs. The chip is a dedicated Far-Field Voice solution with integrated Automatic Speech Recognition (ASR) engine. It is optimized for telepresence and voice control applications. The CX20865 is available in 9×9 BGA package. Prices start at $5.50 each in 100K quantities.
DIOTEK will integrate their speech recognition technology with Conexant’s CX20805 digital audio processor. DIOTEK’s speech recognition engine complements Conexant’s digital audio processor, which features a comprehensive collection of pre- and post-processing algorithms and far-field voice input technology. The integrated solution is ideal for smart home appliances, consumer electronics and educational toys.
Conexant Systems introduced their CX20805 digital audio processor. The CX20805 IC integrates high-speed USB 2.0, other key audio interfaces, advanced power management and a high-performance 800 MIPS digital signal processor. The new digital audio solution is based on the Conexant Audio Processing Engine (CAPE) architecture. Samples of the CX20805 DSP is available in a small footprint 9×9, 116 pin, dual-row QFN package. Prices start at $5.50 each (10K quantities). EVKs are available to qualified customers and partners next month.
Cavium launched the OCTEON Fusion family of processors for base stations. The new chips feature OCTEON MIPS64 based multi-core architecture, purpose-built Baseband DSP cores, LTE/3G hardware accelerators and digital front end (DFE) functionality on a single chip. The OCTEON Fusion processor family consists of two software compatible product lines: CNF71XX and CNF72XX. Samples of CNF71XX and the FusionStack software will be available in the first quarter of next. Thee CNF72XX will be available subsequently.
Texas Instruments announced their new TMS320C553x digital signal processors. There are currently four devices: C5532, C5533, C5534 and C5535. The DSP devices feature total active core power of less than 0.15 mW/MHz at 1.05V and standby power of less than 0.15 mW. Pricing of the TI C553x DSPs start at $1.95 (in quantities of 1,000 units). They are ideal for adding signal processing to consumer audio and voice applications, portable medical equipment, biometric security, voice-activated home automation and flow meters.
Conexant Systems introduced the CX2077x and CX3102x embedded audio solutions. The CX2077x USB audio integrated circuit (IC) features the functionality of an on-chip digital signal processor (DSP), tri-color LED Pulse-Width Modulator (PWM) and LED driver into a single chip package. Pricing for the CX2077x starts at $2.32 in 1K quantities. The CX3102x starts at $1.65 in 1K quantities. A complete evaluation kit with reference board and all the necessary technical documents and software is available now.
Actel Corporation (Nasdaq: ACTL) announced that its radiation-tolerant RTAX-DSP FPGAs have completed qualification in accordance with the military and aerospace industry standard MIL-STD-883 Class B specification. This qualification expands Actel’s support of high-speed signal processing applications for space payloads and exemplifies its ongoing innovation and commitment to serve designers of spaceflight systems.
Tensilica,® Inc. announced that it is the first IP (intellectual property) company with an audio core for system-on-chip (SOC) designs approved for using the Dolby® MS10 Multistream Decoder, a multi-format audio decoding technology that supports Dolby Digital Plus and Dolby Pulse in a single package for next-generation HDTVs (high-definition televisions), STBs (set-top boxes) and DMPs (digital media players).
ON Semiconductor Corporation (Nasdaq: ONNN), a premier supplier of high performance, energy efficient silicon solutions for green electronics, announced it has acquired privately held Sound Design Technologies, Ltd. (SDT) from an affiliate of Global Equity Capital, LLC, in an all cash transaction for initial consideration of approximately $22 million.
MIPS Technologies, Inc. (Nasdaq: MIPS) and Tensilica® Inc. announced they are working together to accelerate SOC (system-on-chip) design activity on the popular Android platform. Together, MIPS and Tensilica will help companies speed the design of new home entertainment and mobile consumer products based on Android. A joint demo of a MIPS32® processor core integrated with Tensilica’s HiFi 2 Audio DSP will be on display in suites that both companies have at the Consumer Electronics Show in Las Vegas, January 7-10, 2010.