Synopsys and Applied Materials Develop Technology Computer-Aided Design Models
Synopsys team with Applied Materials to create technology computer-aided design (TCAD) models for next-generation semiconductor devices. The models derived from this TCAD collaboration will enable engineers to speed up process development for 14-nanometer (nm) and 11-nm logic and new memory chip technologies. This will reduce cost and speed time-to-market.
Synopsys and Applied Materials Develop Technology Computer-Aided Design Models »
Big Surprise: Smartphone Owners Want Bigger Screens
According to research by Strategy Analytics, smartphone owners in the US and UK prefer device screens in the 4″ to 4.5″ range, as long as the device is also thin. Almost 90% of existing smartphone owners surveyed chose a prototype smartphone with a display larger than their current device. This trend is driven by increased mobile web browsing capability, and engaging video and gaming experiences. However, in order for smartphone owners to adopt larger devices, it is important for handset manufacturers to ensure that mobile devices are not too heavy and that the devices remain thin enough for purses and pockets.
Fujitsu Laboratories Speeds ARM Simulation by Factor of 100
Fujitsu Laboratories Limited has developed the world’s fastest simulation technology for systems using the ARM computing core, which is widely used in mobile phones and other electronic devices. Fujitsu’s simulation technology is able to faithfully reproduce hardware operations with cycle-for-cycle real-time accuracy. The technology will help reduce the development cycle for systems and devices using ARM cores and encourage the development of a greater diversity of ARM-based systems.
Fujitsu Laboratories Speeds ARM Simulation by Factor of 100 »
Synopsys, Arteris Team on IP Solution for MIPI Alliance Low Latency Interface
Synopsys and Arteris recently teamed on a joint analog and digital IP solution to implement the MIPI Alliance Low Latency Interface (LLI) 1.0 specification. The early integration and availability of the Arteris and Synopsys solution helps speed time to market for MIPI LLI adopters. Arteris and Synopsys’ joint MIPI LLI IP solution is available now for select early access customers. System hardware implementing the joint solution will be available in the second half of 2012.
Synopsys, Arteris Team on IP Solution for MIPI Alliance Low Latency Interface »
Logic Supply Introduces LGX AU115 Embedded System
Logic Supply recently announced the LGX AU115 embedded system. The AU115 features an Intel Atom N270 processor, two RS-232 COM ports (one of which can be used as GPIO), RS-232/422/485 port, four USB 2.0 ports, DVI-I, dual Intel Gb LAN ports, two audio jacks, 12-volt DC power jack, small footprint, and low-profile chassis (less than 1.5″ thick). The extended temperature LGX AU115 is ideal for deployment in remote monitoring, outdoor kiosks, data acquisition, and networking applications.
SMIC Introduces UHD Library for 0.11um Copper Back End of Line Process
Semiconductor Manufacturing International Corporation (SMIC) introduced an ultra high density (UHD) library solution for their 0.11um Cu-BEoL (Copper Back End of Line) manufacturing platform, which can reduce chip size by an average of 31%. SMIC’s 0.11um ultra high density IP solution helps companies lower manufacturing costs and increase market competitiveness.
SMIC Introduces UHD Library for 0.11um Copper Back End of Line Process »
Uniquify Solves Dynamic Variation Problems with Dynamic Self-Calibrating Logic
Uniquify has extended its patented self-calibrating logic (SCL) IP for double data rate (DDR) memory subsystems to solve dynamic variation problems during system operation. Dynamic Self-Calibrating Logic (DSCL) provides real-time calibration to accommodate dynamic variations in the system operating environment. Uniquify’s SCL and DSCL technologies now are included in all of their DDR memory controller IP offerings. This includes DDR1, DDR2, DDR3, DDR2/3, LPDDR1 and LPDDR2 phy and controller IP.
Uniquify Solves Dynamic Variation Problems with Dynamic Self-Calibrating Logic »
Imec Rolls Out First Process Development Kit for 14nm Logic Chips
Imec released an early version of a process development kit for 14nm logic chips. The 14nm PDK was developed as part of imec’s INSITE program, and together with all the partners involved in this collaborative affiliation program. The process development kit will be made available to imec’s partners, and will include incremental updates. In addition, imec and its partners are developing a 14nm test chip to be released in the 2nd half of 2012 using this PDK.
Imec Rolls Out First Process Development Kit for 14nm Logic Chips »
Microchip Technology Unveils I2C MCP7940M Real-Time Clock/Calendar Device
Microchip introduced their I2C MCP7940M Real-Time Clock/Calendar (RTCC) device. The stand-alone MCP79410 features 64 Bytes of SRAM and on-chip digital trimming circuit with a wide trimming range of +/-127 ppm. The digital-trimming circuit can compensate up to 11 seconds per day for crystal error. The Microchip device is ideal for home-appliance (microwaves, washing machines, dryers, ovens, thermostats), audio/video (radios, televisions, set-top boxes, digital recorders), and consumer electronics (printers, network routers, cameras).
Microchip Technology Unveils I2C MCP7940M Real-Time Clock/Calendar Device »
Embedded Wi-Fi Chipsets to Eliminate Separate Wi-Fi Combo ICs
The Qualcomm Snapdragon S4 class processors will have integrated baseband processors for Bluetooth, Wi-Fi, and 3G/4G cellular standards. According to NPD In-Stat, other processor manufacturers will soon follow suit. These companies have been acquiring both cellular and Wi-Fi intellectual property over the last two years. According to NPD In-Stat, new processors with embedded Wi-Fi baseband may eliminate the need for separate monolithic Wi-Fi combo chipsets. In-Stat expects the Wi-Fi combo chipset revenue loss could be as high as $590 million in 2015.
Embedded Wi-Fi Chipsets to Eliminate Separate Wi-Fi Combo ICs »
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