Electronic Design Automation Revenue Grew by 12.8% in Fourth Quarter
According to the EDA Consortium Market Statistics Service, revenue for the electronic design automation industry grew to $1700.1 million in the fourth quarter of 2011. This is an increase of 12.8% compared to the fourth quarter of 2010 ($1507.7 million). Revenue continued to grow in CAE, IC Physical Design and Verification, SIP, and Services compared to the fourth quarter of 2010. Geographically, the Americas, Europe/Middle East/Africa, and Asia/Pacific posted double-digit increases.
Electronic Design Automation Revenue Grew by 12.8% in Fourth Quarter »
Suprema Introduces FaceStation Face Recognition Terminal
Suprema introduced their FaceStation face recognition terminal. FaceStation is an IP based biometric access control terminal. It features facial recognition technology that identifies individuals from their facial image features. FaceStation is the fastest face recognition access control terminal with patented adaptive IR illumination technology. Suprema is a provider of biometric technology and identity management solutions.
UMC Certifies Synopsys StarRC Parasitic Extraction Solution for 28nm Process
UMC has certified Synopsys’ StarRC parasitic extraction solution for their latest 28-nanometer (nm) process technologies. UMC’s validation of StarRC extends the benefits of Synopsys’ state-of-the-art process modeling and extraction technology to UMC’s 28-nanometer customers. This enables engineers to deliver high-performance 28-nanometer devices to market with increased confidence.
UMC Certifies Synopsys StarRC Parasitic Extraction Solution for 28nm Process »
Wireless Innovation Forum Issues Call for Contributions
The Wireless Innovation Forum (SDR Forum version 2.0) has issued a call for contributions for the Open Source Framework for Commercial Baseband Software. The project focuses on reducing cost and time to market in deploying 3G and 4G, 3G+ systems, including: Fixed WiMAX (802.16d), Mobile WiMAX (802.16e), WiMAX-Advanced (802.16m), LTE (3GPP Release 8) and LTE-Advanced (3GPP Release 10). The Wireless Innovation Forum is a non-profit organization dedicated to driving the future of radio communications and systems worldwide.
LynuxWorks, Fritz and TransLattice Create S.E.C.U.R.E Cloud Platform
LynuxWorks, TransLattice and Fritz Technologies teamed together to create a new platform for building cloud deployments in sensitive environments. The new platform is called S.E.C.U.R.E., which is short for Secure, Enterprise, Cross-Domain, Unified, Resilient Environment. The new S.E.C.U.R.E. platform solution is ideal for situations requiring secure hosting of applications, geographic redundancy of applications and data, and secure cross-domain transfer of information.
LynuxWorks, Fritz and TransLattice Create S.E.C.U.R.E Cloud Platform »
Mentor Embedded Linux Platform Supports Yocto Project
Mentor Graphics rolled out the latest release of the Mentor Embedded Linux platform. The latest version of the Mentor Embedded Linux platform supports the Yocto Project, which is an open source collaborative project established by The Linux Foundation. Mentor Graphics is a key contributor to the Yocto Project and OpenEmbedded community.
Digi International, Wind River Team on M2M Solution Builder Kit for the Clouds
Digi International and Wind River teamed together on the M2M Solution Builder kit, which is a new family of cloud-connected wireless machine-to-machine (M2M) solutions. The kit integrates iDigi Device Cloud with Wind River software. The M2M Solution Builder kits will help developers and OEM’s to quickly build connected products and cloud-enabled services. The M2M Solution Builder kit will be available in June 2012.
Digi International, Wind River Team on M2M Solution Builder Kit for the Clouds »
Analog Devices Introduces Blackfin ADSP-BF60x Processors
Analog Devices rolled out their new Blackfin ADSP-BF606, ADSP-BF607, ADSP-BF608 and ADSP-BF609 processors. The new ADI Blackfin processors all have two 500MHz cores, and have been optimized for low power operation. The ADSP-BF606, ADSP-BF607, ADSP-BF608 and ADSP-BF609 processors feature a new high-bandwidth switched fabric data movement infrastructure, a rich peripheral set and safety oriented features. The ADSP-BF60x processors are sampling now. Prices start at $15 in 1K quantities.
Synopsys Announces 3D-IC Initiative
Synopsys announced a 3D-IC initiative to accelerate the design of stacked multiple-die silicon systems. The initiative will use 3D-IC integration to meet the requirements of faster and smaller electronic products that consume less power. The Synopsys 3D-IC solution is available now in beta and is expected to be in production next quarter. As part of its 3D-IC initiative, Synopsys is working closely with IC design and manufacturing companies to deliver a comprehensive EDA solution, including enhanced versions of its IC implementation and circuit simulation products.
Cadence VIP Catalog Supports Cloud Computing, 12Gb/s SAS, NVM Express Protocol
The Cadence Verification IP (VIP) Catalog now supports the 12Gb/s SAS and NVM Express protocol standards used in cloud computing applications. By doubling the data transfer rate, 12Gb/s SAS improves the cost performance density of SAS interconnects and enables higher degrees of capacity scaling. Pre-silicon verification capabilities, such as those offered by Cadence Design Systems with their VIP products, are critical to the SAS ecosystem and reinforce the interoperability required of these pervasive storage interconnects.
Cadence VIP Catalog Supports Cloud Computing, 12Gb/s SAS, NVM Express Protocol »
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