INSIDE, SAETIC Team on Contactless EMV Products
INSIDE Contactless, the world leader in advanced contactless microprocessor platforms, firmly established its presence in the Spanish contactless EMV market through a partnership with SAETIC, one of Spain's leading manufacturers of plastic payment cards for the banking and public transportation industries. The two companies currently are working to incorporate Inside's next-generation MicroPass(r) contactless technology into an upcoming family of contactless EMV products from SAETIC that will be available in both plastic card and contactless sticker form factors.
Leadis Technology to Demonstrate at IIC-Taiwan
Leadis Technology, Inc. (Nasdaq: LDIS) announced its participation at IIC-Taiwan 2008 – Taiwan's largest IC application technologies exhibition taking place from September 9 – 11, 2008. In addition to prominently demonstrating its latest innovative products, Leadis also will host a display technology seminar on September 9th at the exhibition venue – Taiwan World Trade Centre.
Texas Instruments Unveils ADS5474ADX-EVM 800-MSPS Digitizer Solution
Texas Instruments Incorporated (TI) (NYSE: TXN) introduced an evaluation module (EVM) that combines TI's fastest 14-bit analog-to-digital converters (ADCs) in an interleaved fashion with a Xilinx® Virtex®-5 FPGA to create the best-performing high-speed digitizer solution in the market. The FPGA comes pre-installed with SP Devices' proprietary time-interleaving technology to eliminate interleaving spurs, which enhances performance and facilitates rapid system-level evaluation for wireless communications, military, test and measurement applications. The EVM joins TI's portfolio of support tools for customers using high-speed data converters in wide-bandwidth applications.
MuChip Develops Wireless RF SoC Designs with Cadence Virtuoso
Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced that MuChip, a leading fabless RF IC company in Taiwan, has adopted Cadence® Virtuoso technology for developing its advanced bluetooth 2.1 RF IC, 2.4GHz ISM band proprietary RF transceiver, zigbee, WiFi and GPS designs. MuChip has been developing RF IC for more than 8 years, with a commitment to provide its customers with the most sophisticated RF IC design service and unparalled design experiences. MuChip has deployed the Virtuoso-based RF design flow, which provides wireless chip designers access to improved design performance and a more predictable design cycle. For a recent bluetooth 2.1 RF IC and 2.4GHz ISM band high data rate RF transceiver tapeout, MuChip relied on the complete Cadence design flow, including Cadence Virtuoso® front-to-back products, to quickly and accurately verify, simulate and analyze its RF custom ICs.
On2 Rolls Out Hantro 7280 Register Transfer Level Encoder
On2 Technologies (AMEX: ONT), the leader in video compression solutions, announced the availability of the Hantro 7280 encoder Register Transfer Level (RTL) design. Supporting MPEG-4, H.263 and H.264 video, along with 16MP JPEG, the encoder is targeted for chipsets intended for devices with very low-power requirements such as: portable video cameras, mobile phones, remote security cameras, laptops and webcams. With a maximum resolution of 1280×1024 at 30 fps, the Hantro 7280 introduces a new level of performance and functionality.
Orchid Technologies Engineering Designs Medical Amplifer System
Orchid Technologies Engineering & Consulting designed a high-speed sensitive transconductance amplifer for detection of plaque build up in veins and arteries for their medical client. The client needed an amplifer system that could detect the smallest variations in florescent light levels inside the human body. Detecting the florescence of foreign materials inside the human body is subject to a variety of competing technical challenges. Orchid met those challenges by designing a reliable, highly repeatable, and accurate transconductance amplifer.
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