New Research Could Lead to Graphene Cooling Electronics in the Future
A research team have made a breakthrough discovery with graphene, which is a material that could play a major role in keeping laptops and other electronic devices from overheating. A key finding is the possibility of a strong enhancement of thermal conduction properties of isotopically pure graphene without substantial alteration of electrical, optical and other physical properties. Isotopically pure graphene can be ideal for many practical applications.
New Research Could Lead to Graphene Cooling Electronics in the Future »
Q3 2011 EDA Revenue Grew by 18.1% to $1,543.9 Million
The Electronic Design Automation (EDA) industry revenue increased to $1,543.9 million for Q3 2011. This is an 18.1% increase compared to $1,307.0 million in Q3 2010. Sequential EDA revenue for Q3 2011 increased 7.4% compared to Q2 2011, and the four-quarters moving average increased by 17.8%. The four-quarters moving average compares the most recent four quarters to the prior four quarters. This data was presented in the latest Market Statistics Service (MSS) report by the EDA Consortium (EDAC).
Mentor Graphics Targets CAE Market by Acquiring Flowmaster Group
The Flowmaster Group has been acquired by Mentor Graphics. Flowmaster is a leader in 1D Computational Fluid Dynamics (CFD) simulation software for system design. The acquisition consolidates the position of Mentor Graphics as the first EDA company to move into the adjacent Computer-Aided Engineering (CAE) mechanical analysis space. The terms of the transaction were not disclosed.
Mentor Graphics Targets CAE Market by Acquiring Flowmaster Group »
Mindspeed Acquires Picochip for $51.8 Million Plus $25 Million Potential Earnout Payment
Mindspeed Technologies will acquire Picochip Limited for about $51.8 million. In addition, there is a potential earnout payment of up to $25 million payable in the first calendar quarter of 2013. The transaction has been approved by the boards of directors of Mindspeed and Picochip. The acquisition is subject to certain closing conditions, and is expected to close in the first calendar quarter of 2012. Picochip is a supplier of integrated system-on-chip (SoC) solutions for small cell base stations.
Mindspeed Acquires Picochip for $51.8 Million Plus $25 Million Potential Earnout Payment »
WonderMedia PRIZM WM8950 SoC Supports Android 4.0
WonderMedia Technologies introduced the PRIZM WM8950 SoC. The PRIZM WM8950 features a 800MHz ARM Cortex-A9 processor, ARM Mali-400 3D graphics processor, built-in Fast Ethernet MAC, interface with Wi-Fi, and 3+G and Bluetooth. The WonderMedia PRIZM WM8950 platform is ideal for Smart TV, SmartStream for wireless display and multimedia streaming, networked projectors, digital signage, and thin clients. The WonderMedia PRIZM WM8950 chip is sampling now. Volume shipment is expected in the first quarter of 2012.
MANA Researchers Develop Highest Performance Thin Film Capacitors
A research group at the International Center for Materials Nanoarchitectonics (MANA) have developed thin-film capacitors using a new high-permittivity (high-k) dielectric sheet with molecular-level thickness (~1 nm). The researchers were led by MANA scientist Dr. Minoru Osada and principal investigator Dr. Takayoshi Sasaki at the National Institute for Material Science (NIMS) in Japan.
MANA Researchers Develop Highest Performance Thin Film Capacitors »
SEMATECH 3D EC, SIA, SRC Team on 3D integration Technology
SEMATECH’s 3D Enablement Center (3D EC), the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC) have identified the top technical challenges for new killer applications to enable future development of heterogeneous 3D integration beyond mobile wide I/O DRAM. Addressing the common challenges of next generation applications is critical for acceleration of the broad adoption of 3D ICs. The goal of the three organizations is to fully realize 3D integration for semiconductor manufacturing and design.
SEMATECH 3D EC, SIA, SRC Team on 3D integration Technology »
Multi-core Smartphone Applications Processors Grow to 25% Share in Q3 2011
Manufacturers use multi-core processors for smartphone feature differentiation. As a result, multi-core smartphone applications processors gained strong traction in the third quarter of 2011. According to Strategy Analytics, part of this growth is because of strong holiday quarter demand for multi-core smartphones from major smartphone manufacturers.
Multi-core Smartphone Applications Processors Grow to 25% Share in Q3 2011 »
HDMI Device Shipments to Increase by 17%, DVI to Decrease by 9.4%
According to NPD In-Stat, HDMI has become the universal interface for nearly all advanced consumer electronic devices. DVI, on the other hand, will have serious competition from technologies like DisplayPort in PCs and PC monitors. There is no upgrade roadmap for DVI, and AMD will end DVI support in its chips by 2015. NPD In-Stat expects HDMI-enabled device shipments to grow to over 1 billion in 2014, while DVI-enabled shipments will decline by 9.4% annually through 2015.
HDMI Device Shipments to Increase by 17%, DVI to Decrease by 9.4% »
Imec Micromachined Harvester Achieves Record Output Power
Imec and Holst Centre have created a micromachined harvester for vibration energy. The harvester has a record output power of 489µW when the vibrations closely match the MEMS’ resonance vibration (1011Hz in this case). Based on measurements and simulation, the device is ideal for shock-induced energy harvesting in car tires, where it could power built-in sensors. In a tire, at 70km/h, the micromachined harvester can deliver a constant 42µW, which is enough to power a simple wireless sensor node.
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