Research Team Discovers Insulator Property of Bilayer Graphene
A team of researchers have found that when the number of electrons on a bilayer graphene (BLG) sheet is close to zero, the material becomes insulating (resists flow of electrical current). This finding suggests that multi-layer graphene might be suitable as an electronic material in the semiconductor and electronics industries. Their research was published recently in Nature Nanotechnology. The research was supported by grants from the National Science Foundation, Office of Naval Research, FENA Focus Center, and other agencies.
Research Team Discovers Insulator Property of Bilayer Graphene »
Synopsys Purchases ExpertIO, Gains Storage VIP Portfolio
Synopsys, Inc. (Nasdaq: SNPS) has acquired ExpertIO, Inc. Synopsys is a provider of software tools and IP used in the design, verification and manufacture of electronic components and systems. ExpertIO is a privately held company that develops verification IP (VIP) for industry standard protocols. The terms of the deal were not disclosed.
New Sony image sensors Feature RGBW Coding and HDR Movie Functions
Sony introduced two CMOS image sensors. The new stacked CMOS image sensors feature RGBW Coding and High Dynamic Range (HDR) Movie functions. RGBW Coding function enables images to be captured with low noise and high picture quality even in low-light conditions. HDR Movie function enables brilliant color to be captured across a broad dynamic range of low-light to bright-light conditions. In addition, Sony has also developed a model with built-in signal processing functionality, an element that usually requires external embedment.
New Sony image sensors Feature RGBW Coding and HDR Movie Functions »
ZMD ZSSC3016 16-bit Sensor Signal Conditioning IC
ZMD AG introduced their ZSSC3016 16-bit sensor signal conditioning IC (SSC) for calibrated resistive sensor modules. The ZSSC3016 features high accuracy amplification, 16-bit precision analog-to-digital conversion, and an 18-bit DSP for linearization and calibration functions. The chip is ideal for use in mobile phones, sport watches or outdoor GPS tracking systems. The ZMD ZSSC3016 is available as die for wafer bonding. Parts are priced at 0.78 Euro (US$1.09) in volumes of 10k. Samples and wafer material are available now.
Maxim Sells Timing, Synchronization and Synthesis Business to Microsemi
Microsemi Corporation has acquired the telecom clock generation, synchronization, packet timing and synthesis business from Maxim Integrated Products, Inc. (Nasdaq: MXIM). The acquired business unit complements the synchronization and timing products Microsemi obtained in the Zarlink acquisition. The terms of the transaction were not disclosed.
Maxim Sells Timing, Synchronization and Synthesis Business to Microsemi »
MIT Researchers Speed Up Fast Fourier Transform
A team of MIT researchers have developed a new algorithm that improves on the fast Fourier transform (FFT). The Fourier transform is a method for representing an irregular signal as a combination of pure frequencies. The new MIT algorithm is up to ten times faster than the traditional FFT algorithm. The MIT algorithm is useful for image compression and can enable smart phones to wirelessly transmit large video files without draining batteries or consuming monthly bandwidth allotments. The new MIT algorithm will be presented this week at the Association for Computing Machinery’s Symposium on Discrete Algorithms (SODA).
Microchip HID-class MCP2210 USB to SPI Protocol Converter
Microchip Technology introduced their HID-class MCP2210 USB to SPI protocol converter. The MCP2210 is a simple, small-footprint and cost-effective option for adding USB connectivity to SPI-based systems. The Microchip MCP2210 is available in a 20-pin SSOP package for $1.40 each, and a 20-pin 5×5 mm QFN package for $1.52 each, in 5,000-unit quantities. Samples and volume-production orders are available now. A MCP2210 evaluation kit is available for $29.99.
Bond Meister MWB-12-ST 300mm Wafer Bonding Machine Produces 3D LSI Circuits at Room Temperature
The Bond Meister MWB-12-ST, from Mitsubishi Heavy Industries Ltd (MHI), is the world’s first fully automated 12-inch (300 millimeters) wafer bonding machine that can produce 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The wafer bonding machine is able to undertake continuous bonding of up to five 12-inch wafers and can perform wafer transfer and alignment for automatic bonding. The HI system is also capable of preliminarily setting the bonding conditions for each wafer individually, to accommodate production of various types in small lots.
Bond Meister MWB-12-ST 300mm Wafer Bonding Machine Produces 3D LSI Circuits at Room Temperature »
Conexant CX93610 DIFT JPEG Encoder, and CX20752 and CX20754 HD Audio Codecs
Conexant Systems introduced the CX93610 DIFT JPEG encoder, and CX20752 and CX20754 HD audio codecs. The CX93610 is a monolithic mixed signal ASSP that features a 656 camera interface, optional microphone input, low cost, low power and high image compression capability. The CX20752 and CX20754 features integrated stereo filterless class-D amplifier with patented Common Mode Scrambling technology capable of driving 2W-rms per channel at 1% THD+N into 4 ohm load. The CX93610 is priced at $5.00 each (in 1000 unit quantities). Pricing for the CX20752 and CX20754 start at $1.24 and $1.54, respectively (in 10 K quantities).
Conexant CX93610 DIFT JPEG Encoder, and CX20752 and CX20754 HD Audio Codecs »
Fresco Microchip Unveils FM5150ARF Silicon Tuner for Global Hybrid Television
Fresco Microchip introduced the FM5150A silicon tuner for global hybrid terrestrial and cable television. The FM5150A seamlessly interfaces to TV SoCs to optimize tuner CAN and on-board designs. Samples of the Fresco FM5150A are available now for selected customers. The chip is the latest addition to Fresco’s silicon tuner product family.
Fresco Microchip Unveils FM5150ARF Silicon Tuner for Global Hybrid Television »
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