EDA News - electronic design automation, semiconductor

Share/BookmarkSubscribe
'Wireless' Category Archive

In-Stat Research: The Worldwide Emergence of Low-Cost Android Smartphones

Posted by Ken Cheung in Research,RTOS,Wireless on Friday, October 28, 2011

In-Stat expects unit shipments for low-cost Android smartphones to reach almost 340 million worldwide in 2015. According to In-Stat, low-cost Android handset segment will cause some fragmentation in the Android platform. Low-cost Android smartphones will most likely be released with Android 2.2 or 2.3 because these versions offer a good blend of features with modest memory and processor usage. The Ice Cream Sandwich (Android 4.0) release requires more memory and processor demands, which makes the new version less attractive for low-cost Android devices.

Read more »

Imec and Holst Centre Develop Ultralow Power IR-UWB Solution

Posted by Ken Cheung in Research,Wireless on Wednesday, October 12, 2011

Imec and Holst Centre developed a fully chip-integrated ultralow-power impulse-radio ultra-wideband (IR-UWB) solution for the 6-10GHz band, which is available worldwide. The radio features fade-resilient and interference-free operation. Imec and Holst Centre’s solution for the 6-10GHz band makes UWB communication available for battery-operated applications in the area of personal area networks and positioning sensors worldwide. Examples include short-range video streaming or around-the-body audio streaming (e.g. between a headset and a smartphone).

Read more »

Sensor Fusion to Power iPhone, iPad, and Android Devices

Posted by Ken Cheung in Research,Wireless on Tuesday, September 27, 2011

According to a IHS iSuppli report, sensor fusion will eventually power the next generation of iPhone and iPad devices. A fused signal combines the outputs of three types of Microelectromechanical system (MEMS) motion sensors (gyroscopes, accelerometers and compasses) to improve the motion-based interface. Sensor fusion could enhance interfaces of any tablet or smartphone that uses a combination of a 3-axis accelerometer, 3-axis compass and 3-axis gyroscope to provide 9-axis sensor fusion.

Read more »

u-blox Enters Embedded CDMA Wireless Market by Acquiring Fusion Wireless

Posted by Ken Cheung in Wireless on Tuesday, September 20, 2011

u-blox has acquired Fusion Wireless for $900,000 in cash, plus existing debt of $2.1 million. Fusion Wireless is a provider of CDMA wireless modules for consumer and M2M applications in North America. In addition to gaining Fusion Wireless’ wireless module products, the acquisition will give u-blox access to the embedded CDMA market in North America for both consumer and M2M applications.

Read more »

octoScope octoBox Wireless Testing System

Posted by Ken Cheung in Test Solution,Wireless on Wednesday, August 3, 2011

octoScope introduced their octoBox wireless testing system. octoBox is a tool for the OTA testing of conventional and MIMO wireless devices. It features a customizable refrigerator sized anechoic (non-echoing) enclosure that replaces expensive walk-in anechoic chambers and facilitates test setup. octoBox can be used to design, test and verify multi-radio devices such as smartphones and USB dongles. octoBox is available now.

Read more »

Digi XBee Wi-Fi Embedded RF Module

Posted by Ken Cheung in Boards, Busses,Wireless on Friday, July 29, 2011

Digi International announced their XBee Wi-Fi embedded RF module. The XBee Wi-Fi delivers serial to IEEE 802.11 connectivity. With the new Digi module, engineers can create a single board design for wireless products that supports 802.15.4, ZigBee, ZigBee Smart Energy, 2.4 GHz, 900 and 868 MHz, Wi-Fi and proprietary DigiMesh protocols. It is ideal for energy management, process and factory automation, wireless sensor networks, and intelligent asset management. XBee Wi-Fi development kits are available now for $149.

Read more »

Connect One Nano WiReach SMT WiFi Module

Posted by Ken Cheung in Wireless on Thursday, July 14, 2011

Connect One rolled out their Nano WiReach SMT, which is a secure embedded Wireless LAN module that easily connects embedded devices to 802.11b/g Wireless LAN, 10/100BaseT wired LAN and cellular WAN. The WiFi module features iChip CO2144 IP Communication Controller chip, Marvell 88W8686 WiFi chipset, multiple hardware interfaces, extensive firmware functionality, 3G routing, WiFi client and access-point capabilities. It supports secure Internet protocols for up to eight WiFi users in its router or access point mode. Nano WiReach SMT is now available at $26 for high-volume projects.

Read more »

White Paper: Moving Beyond Zigbee for Star Networks

Posted by Ken Cheung in Research,Wireless on Monday, June 13, 2011

Laird Technologies published a new white paper, Moving Beyond Zigbee for Star Networks. The technical paper addresses the requirements of star networks, and the need of finding the correct wireless solution beyond traditional means. The white paper details the data flow through a network, and how most networks that are point-to-multipoint (or multipoint-to-point, depending on the perspective) form a star topology. The technical paper also presents possible solutions and features a model comparison of some of the key attributes of a Laird Technologies LT2510 100 mW transceiver versus a typical Zigbee 10 mW transceiver.

Read more »

NVIDIA Acquires Icera, 3G and 4G Baseband Processors

Posted by Ken Cheung in Microcontrollers,Wireless on Tuesday, May 10, 2011

NVIDIA will acquire Icera for $367 million in cash. Icera is one of the few remaining independent baseband processor providers for both 3G and 4G cellular phones, data modems, and tablets. The remaining independent suppliers are specialized in either 3G or 4G (but not both 3G and 4G). The acquisition has been approved by both companies’ boards of directors and is expected to be completed, subject to customary closing conditions, in about 30 days.

Read more »

Texas Instruments bq51013 Wireless Power Receiver

Posted by Ken Cheung in Components,Wireless on Monday, April 18, 2011

Texas Instruments announced the bq51013 receiver integrated circuit (IC) for wireless charging. The TI chip combines voltage conditioning and full wireless power control in a small 1.9-mm x 3-mm WCSP package. The bq51013 wireless power receiver supports up to 5 W of output power, provides up to 93% efficient AC/DC power conversion and is the only IC required between the receiver coil and system. The Qi compliant IC is available now in a 1.9mm x 3mm WCSP package. It is priced at $3.50 (quantities of 1,000).

Read more »

« Newer Posts || Older Posts »

Custom Search

EDA Geek Newsletter
Don't have time to visit EDA Geek everyday? Then sign up for our free newsletter. We'll send you an email when we have something to share with you. Your email address will be kept confidential and we will not share, sell, or rent it to anyone. You can unsubscribe at any time by clicking a link in the email.

Enter your email address to sign up for our free newsletter:  

If you are familiar with RSS feeds, you can also sign up for our free news feed. Our RSS feed is updated in real-time while our newsletter is updated daily.