How to Debug Dead Boards in Production eBook
ASSET InterTech published a new ebook: How to Debug Dead Boards in Production. The new publication is a case study that will help circuit board manufacturers who want to recover their investment in assembled boards that won’t boot so called dead boards and still maintain the tight production deadlines that constantly reduce the time they can spend on board debug.
White Paper: Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?
SOR recently published a white paper about selecting the right instrumentation for the job. The article presents three questions to help the engineers determine the best instrumentation for the application. The technical paper is titled, Weigh Your Instrumentation Options, Switch, Transmitter or Hybrid?
White Paper: Making Industrial Touch A Reality
Avnet Electronics Marketing published a white paper about how to make industrial touch screen a reality. The technical paper provides design engineers with the information that they need to take industrial touch solutions from fantasy to reality. The article encapsulates that background for the design engineers who are incorporating touch screens into industrial applications. The title of the white paper is Making Industrial Touch A Reality.
Ebook: Functional Test on I2C and SPI System Monitors with JTAG
ASSET InterTech published an ebook about JTAG. The article describes how the structural test methodology based on the IEEE 1149.1 boundary scan standard can apply functional tests to I2C and SPI system monitors during prototype board bring-up and later during production of the circuit board. The title of the technical paper is: Functional Test on I2C and SPI System Monitors with JTAG.
White Paper: Interplay Between Statistical Reliability and Variability
According to a new white paper, the interplay between the effects of statistical reliability and variability could adversely affect 20nm CMOS SRAM yield. The study also defined a new reliability simulation framework to predict variability and reliability impact that enhances yield. The article was published by Gold Standard Simulations (GSS) and the University of Glasgow Device Modelling Group at the International Physics Reliability Symposium in Monterey, CA.
Origin of 1/f Noise in Graphene Multilayers Could Shrink Electronics
A team of researchers at the University of California, Riverside recently published a paper that could help downscale the size of electronic devices even more. The research, which was published in the Applied Physics Letters journal, is titled: Origin of 1/f noise in graphene multilayers: Surface vs. volume. The potential solution is the result of research on an almost century-old problem.
Cache-as-RAM for Board Bring-up of Non-booting Circuit Boards
ASSET InterTech published a new e-book: Cache-as-RAM for Board Bring-up of Non-booting Circuit Boards. The technical paper takes a close look at how run-control tools can employ a processor’s on-chip cache memory instead of on-board RAM memory to boot non-booting prototype circuit boards. The technical publication is available now.
Multicore Association Publishes Multicore Programming Practices Guide
The Multicore Association published a guide for developers. The e-book explains how to migrate applications to multicore platforms and shares industry-proven techniques that help reduce development costs. The publication also includes best practices for writing multicore-ready embedded software. The title of the developer guide is Multicore Programming Practices Guide. The MPP Guide is available for download.
ASSET InterTech eBook Explains How to Avoid Poor Serdes Performance
ASSET InterTech published an ebook about the defects caused by process variances and how they can be detected with minimum effects on the manufacturing line. Manufacturing variances can degrade serdes performance and are all too common. Now embedded instrumentation offers a number of solutions for detecting process variances with minimal impact on product throughput. The title of the ebook is: How to avoid poor serdes performance caused by circuit board manufacturing variances.
Five Things to Consider Before Buying Spiral Bevel Gear Drives White Paper
Lampin recently published a white paper about spiral bevel gear. The technical paper guides engineers through the specification process. It discusses variables such as lead times, costs, reliability, ordering ease, applications expertise, and customized solutions. The article is titled, Five Things To Consider Before Buying Spiral Bevel Gear Drives.
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