Category Archives: Research

R&D, studies, surveys

White Paper: RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design

AWR published a new white paper about the design flow and its essential features for most PA design projects. The article presents a design of a simple, Class A GaAs pHEMT monolithic microwave integrated circuit (MMIC) PA using AWR’s Microwave Office high-frequency design software. The title of the technical paper is RF/Microwave EDA Software Design Flow Considerations for PA MMIC Design.

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Ormiston Wire Publishes Heat Exchange Efficiency White Paper

Heat Exchange Efficiency White Paper

Ormiston Wire recently published a white paper on heat exchange efficiency. The article looks at the mechanics of heat exchange technology, its uses in industry and the advancements that Ormiston itself has achieved. The technical paper helps engineers in the selection and specification of heat transfer components. The white paper will benefit engineers in refrigeration, power plants, petrochemical and sewage treatments and beyond.

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eBook: Faster Firmware Debug with Intel Embedded Trace Tools

Faster Firmware Debug with Intel Embedded Trace Tools eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication discusses how hardware-assisted debugging tools are able to tap into the embedded trace resources in Intel processors to methodically and quickly track bugs through the interrelated web of software, firmware and hardware. The title of the paper is: Faster Firmware Debug with Intel Embedded Trace Tools.

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Elsevier Publishes New Electrical Engineering and Communications Books

Optical Fiber Telecommunications Volume VIA

Elsevier recently published seven new titles in the area of Electrical Engineering and Communications. The titles of the books are Optical Fiber Telecommunications Volume VIA, Optical Fiber Telecommunications Volume VIB, Electromagnetic Surface Waves: A Modern Perspective, Op Amps for Everyone, Intelligent Systems for Security Informatics, Advances in Analog and RF IC Design for Wireless Communication Systems, and System Parameter Identification: Information Criteria and Algorithms.

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CUI Publishes App Notes on IEC 60601-1 3rd Edition, Power Factor Correction

CUI published two application notes. The first app note is titled: IEC 60601-1 Medical Design Standards-3rd Edition. The technical paper looks at the IEC 60601-1 3rd edition standard and its implications for engineers specifying power supplies for medical devices. The second app note is titled: Power Factor and Power Factor Correction. It explains power factor and its implications in today’s power systems.

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New eBook: Testing DDR3 Memory Boundary Scan JTAG

Testing DDR3 Memory Boundary Scan JTAG eBook | ASSET InterTech

ASSET InterTech published a new eBook. The publication explains how to test DDR memory with non-intrusive JTAG or boundary-scan (IEEE 1149.1) methods. The title of the paper is Testing DDR3 Memory Boundary Scan JTAG. The paper was written by Kent Zetterberg, product manager, ASSET InterTech.

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AWR Publishes Millimeter-Wave Wireless System Application Note

AWR recently published a news application note: Design of a Full ETSI E-band Circuit for a Millimeter-Wave Wireless System. The article explains how to use Microwave Office circuit design software to develop a Q- to E-band doubler and a K- to E-band quadrupler circuit (including a medium E-band power amplifier) for millimeter-wave wireless systems. The design effort resulted in an increase in gain as well as output power, two critical criteria for E-band systems.

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RF Electronics: Design and Simulation eBook

AWR recently published a new eBook. The book describes the use of AWR’s Microwave Office and AXIEM software to design RF electronic devices for applications such as amplifiers, radar, mobile phones, Bluetooth, and WLAN. It was written by C. J. (Keith) Kikkert, an adjunct associate professor of James Cook University (JCU) School of Engineering and Physical Sciences, Townsville, Queensland, Australia. The title of the publication is RF Electronics: Design and Simulation.

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Researchers Enable III-V Technology for High Volume Manufacturing

Researchers have made significant advances in post-epitaxial growth backside clean processing. The research will prepare III-V technology for high-volume manufacturing. The research leading to these accomplishments was conducted at SEMATECH’s facilities at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York.

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