Telepath, Infineon, SMIC Power Mobile TV Devices for Beijing Olympics
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), the leading integrated silicon-manufacturing foundry in China, announced that Telepath Technologies Co., Ltd. a fabless IC company that provides solutions based on the China Multimedia Mobile Broadcasting (CMMB) standard, successfully integrated its demodulator chip, TP3001, in a majority of mobile TV phones distributed at the 2008 Beijing Olympics.
Rubicon Produces 8" Sapphire Wafers for Peregrine UltraCMOS SOS RFICs
Peregrine Semiconductor Corporation, a leading supplier of high-performance RF CMOS and mixed-signal communications ICs and Rubicon Technology, a leading manufacturer of sapphire substrates and other advanced technology materials, announced that Rubicon has begun initial production of 8" sapphire wafers for supply to Peregrine for its UltraCMOS[tm] Silicon-on-Sapphire (SOS) semiconductor processing.
UMC Decides to Join SEMATECH
SEMATECH, the international consortium of semiconductor manufacturers that conducts and sponsors cooperative research and development of advanced semiconductor technology, and UMC, (NYSE: UMC, TSE: 2303) a leading global semiconductor foundry, announced UMC's decision to join SEMATECH. The relationship will focus on research and development for exploratory technologies on 300mm wafers, including 22nm and beyond process generations.
SVTC Technologies, Infineon, Maxim, Anadigics Join Fab Owners Association
The Fab Owners Association (FOA), the association of semiconductor / MEMS manufacturing executives and suppliers, has announced the addition of it newest device-maker members: SVTC Technologies, Infineon, Maxim, Anadigics.
Sarnoff Debuts Ultra-Sense Back-Thinning for Image Sensor Fabrication
Sarnoff Corporation introduced Ultra-Sense[tm], a complete wafer processing solution that reduces the manufacturing costs of high-performance back-illuminated image sensors. Ultra-Sense is an innovative solution that combines patented Silicon-on-Insulator (SOI) wafer technology with low-cost, scalable fabrication techniques to provide manufacturable back-illuminated image sensors. Sensor designers and manufacturers can use this novel approach to achieve higher resolution, smaller pixel size, higher quantum efficiency (QE) and maximized system performance without incurring additional costs.
Cypress, Tower Announce .18-Micron Stitched CMOS Image Sensor Device
Cypress Semiconductor Corp. (NYSE:CY), a leading developer and manufacturer of programmable mixed-signal solutions and CMOS Image Sensor (CIS) components, and Tower Semiconductor, Ltd. (Nasdaq:TSEM) (TASE:TSEM), an independent specialty foundry, announced the successful completion of Cypress's first 0.18-micron stitched large-format CIS device. The product is to be manufactured using Tower Semiconductor's latest generation of stitching technology at Tower's 200-mm Fab 2 in Migdal Ha'emek, Israel.
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