Category Archives: Foundry

Cadence, ARM Team on Cortex-A57 64-bit Processor for TSMC 16nm FinFET Process

ARM and Cadence Design Systems teamed on the first ARM Cortex-A57 processor for TSMC’s 16-nanometer (nm) FinFET manufacturing process. The test chip was implemented using the complete Cadence RTL-to-signoff flow, Cadence Virtuoso custom design platform, ARM Artisan standard cell libraries and TSMC’s memory macros. Their joint innovations will enable engineers to accelerate product development cycles and take advantage of leading-edge processes and IP.

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X-FAB Silicon Foundries Acquires MEMS Foundry Itzehoe

X-FAB Silicon Foundries recently made two announcements. First, the company has increased its share in the German-based MEMS Foundry Itzehoe GmbH. X-FAB Silicon Foundries now owns 51% of MFI. It’s previous stake was 25.5%. X-FAB also announced it renamed MFI to X-FAB MEMS Foundry Itzehoe.

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SMIC Announces 1.2V Low-Power Embedded EEPROM Platform

The 1.2-volt Low-Power Embedded EEPROM Platform is now available from Semiconductor Manufacturing International Corporation. It is fully compatible with SMIC’s 0.13-micron (um) low-leakage (LL) process. The process- and IP-qualified platform reduces power consumption, chip size, and cost, while increasing data security. The process is ideal for dual-interface IC cards and contactless smart cards.

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X-FAB Silicon Foundries Debuts Open-Platform MEMS 3D Inertial Sensor Process

X-FAB Silicon Foundries has developed an open-platform 3-axis inertial sensor process. It is the first open-platform MEMS 3D inertial sensor process available directly from a high-volume pure-play foundry. The technology is available now for engineering services and early access prototyping. Full qualification and complete design rule access will be available in early 2013.

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X-FAB Silicon Foundries Introduces XU035 CMOS-based Process

X-FAB Silicon Foundries introduced their XU035 process. The new X-FAB process provides low specific on-resistance 700V power devices and the lowest mask count in the foundry industry. The XU035 CMOS-based process will be available for tape-ins of prototypes and risk production next month. The process is ideal for ultra-high-voltage consumer applications such as AC LED lighting, chargers with no-load power consumption and other power conversion and control applications.

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UMC Certifies Synopsys StarRC Parasitic Extraction Solution for 28nm Process

UMC has certified Synopsys’ StarRC parasitic extraction solution for their latest 28-nanometer (nm) process technologies. UMC’s validation of StarRC extends the benefits of Synopsys’ state-of-the-art process modeling and extraction technology to UMC’s 28-nanometer customers. This enables engineers to deliver high-performance 28-nanometer devices to market with increased confidence.

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X-FAB Silicon Foundries Introduces XH018 HT Extension for High Temperatures

X-FAB Silicon Foundries launched the XH018 HT, which is a new module that adds high-temperature capability to its XH018 technology family. The XH018 HT extension is available now for tape-ins. Engineers can start their designs now and submit their prototypes for production. The combination of embedded Flash IP blocks, TrimOTP, and NVRAM compiler and high-temperature capability up to 175 degrees will become available next quarter. Designers have the choice of using X-FAB’s ready-to-use blocks or their own memory design.

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SMIC Introduces UHD Library for 0.11um Copper Back End of Line Process

Semiconductor Manufacturing International Corporation (SMIC) introduced an ultra high density (UHD) library solution for their 0.11um Cu-BEoL (Copper Back End of Line) manufacturing platform, which can reduce chip size by an average of 31%. SMIC’s 0.11um ultra high density IP solution helps companies lower manufacturing costs and increase market competitiveness.

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Bond Meister MWB-12-ST 300mm Wafer Bonding Machine Produces 3D LSI Circuits at Room Temperature

The Bond Meister MWB-12-ST, from Mitsubishi Heavy Industries Ltd (MHI), is the world’s first fully automated 12-inch (300 millimeters) wafer bonding machine that can produce 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The wafer bonding machine is able to undertake continuous bonding of up to five 12-inch wafers and can perform wafer transfer and alignment for automatic bonding. The HI system is also capable of preliminarily setting the bonding conditions for each wafer individually, to accommodate production of various types in small lots.

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X-FAB XP018 Technology Platform

X-FAB Silicon Foundries introduced their XP018 technology platform. The foundry process features the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash. The X-FAB XP018 technology is available now for tape-ins. It includes pre-released IP for the memory options. Full qualification will follow in 2012.

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