X-FAB Silicon Foundries Introduces XU035 CMOS-based Process
X-FAB Silicon Foundries introduced their XU035 process. The new X-FAB process provides low specific on-resistance 700V power devices and the lowest mask count in the foundry industry. The XU035 CMOS-based process will be available for tape-ins of prototypes and risk production next month. The process is ideal for ultra-high-voltage consumer applications such as AC LED lighting, chargers with no-load power consumption and other power conversion and control applications.
UMC Certifies Synopsys StarRC Parasitic Extraction Solution for 28nm Process
UMC has certified Synopsys’ StarRC parasitic extraction solution for their latest 28-nanometer (nm) process technologies. UMC’s validation of StarRC extends the benefits of Synopsys’ state-of-the-art process modeling and extraction technology to UMC’s 28-nanometer customers. This enables engineers to deliver high-performance 28-nanometer devices to market with increased confidence.
X-FAB Silicon Foundries Introduces XH018 HT Extension for High Temperatures
X-FAB Silicon Foundries launched the XH018 HT, which is a new module that adds high-temperature capability to its XH018 technology family. The XH018 HT extension is available now for tape-ins. Engineers can start their designs now and submit their prototypes for production. The combination of embedded Flash IP blocks, TrimOTP, and NVRAM compiler and high-temperature capability up to 175 degrees will become available next quarter. Designers have the choice of using X-FAB’s ready-to-use blocks or their own memory design.
SMIC Introduces UHD Library for 0.11um Copper Back End of Line Process
Semiconductor Manufacturing International Corporation (SMIC) introduced an ultra high density (UHD) library solution for their 0.11um Cu-BEoL (Copper Back End of Line) manufacturing platform, which can reduce chip size by an average of 31%. SMIC’s 0.11um ultra high density IP solution helps companies lower manufacturing costs and increase market competitiveness.
Bond Meister MWB-12-ST 300mm Wafer Bonding Machine Produces 3D LSI Circuits at Room Temperature
The Bond Meister MWB-12-ST, from Mitsubishi Heavy Industries Ltd (MHI), is the world’s first fully automated 12-inch (300 millimeters) wafer bonding machine that can produce 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The wafer bonding machine is able to undertake continuous bonding of up to five 12-inch wafers and can perform wafer transfer and alignment for automatic bonding. The HI system is also capable of preliminarily setting the bonding conditions for each wafer individually, to accommodate production of various types in small lots.
X-FAB XP018 Technology Platform
X-FAB Silicon Foundries introduced their XP018 technology platform. The foundry process features the industry’s lowest mask count for the modular combination of digital, analog and high-voltage features with embedded Flash. The X-FAB XP018 technology is available now for tape-ins. It includes pre-released IP for the memory options. Full qualification will follow in 2012.
First-Pass Silicon Success: Synopsys DesignWare 96 dB Hi-Fi Audio IP
Synopsys’ DesignWare 96 dB Hi-Fi Audio IP has achieved first-pass silicon success in 65-nanometer (nm) and 55-nm process technologies for multiple foundries. The silicon-proven audio IP is ideal for consumer electronic system-on-chip (SoC) applications such as portable media players, smart phones, CD/DVD/ Blu-Ray Disc players/recorders, digital TV and digital cameras. The Synopsys DesignWare 96 dB Hi-Fi Audio IP in 65-nm and 55-nm processes is available now for multiple foundries.
D2S TrueMask DS Mask Wafer Double Simulation Accelerated Workstation
D2S launched the TrueMask DS mask-wafer double simulation accelerated workstation. It can help mask shops and wafer fabs with qualifying and optimizing 20nm node and below designs. TrueMask is ideal for R&D exploration, bit-cell design, hot-spot analysis and mask-defect categorization that comprehends overlapping eBeam shots and dose modulation. D2S TrueMask DS is available now.
X-FAB Silicon Foundries Extends High Temperature XA035 Foundry Process
X-FAB Silicon Foundries has added 28 new devices to their enhanced XA035 high-temperature 0.35 micrometer foundry process. The XA035 technology for high-temperature applications with its new primitive devices and additional options is available now for tape-ins. The process is ideal for charge balancing applications such as in batteries for hybrid and electric vehicles. The extended temperature range also makes it ideal for control devices inside the combustion or electric engine housing. The technology can be used for motor control and power management or power conversion applications for a wide range of voltages in industrial, medical or consumer systems.
HHNEC-Synopsys 130nm Reference Flow 3.0
Synopsys and Shanghai Hua Hong NEC Electronics Company teamed on a 130-nanomter (nm) reference flow. The HHNEC-Synopsys Reference Flow 3.0 features the Synopsys Eclypse Low Power Solution. The reference design flow is available now from HHNEC. With the latest foundry flow, designers can leverage Synopsys’s strength in low power design and HHNEC’s manufacturing expertise.
If you are familiar with RSS feeds, you can also sign up for our free news feed. Our RSS feed is updated in real-time while our newsletter is updated daily.
