The Design and Verification Conference, which is sponsored by Accellera Systems Initiative, has issued a call for papers. DVCon 2014 is seeking abstracts that are highly technical and reflect real life experiences using languages, standards, methods and EDA tools. The conference will take place March 3-6, 2014. However, abstracts are due by August 27th, 2013.
Avnet Embedded announced the Open Compute Project (OCP) Innovation Labs. OCP Innovation Labs serve as both technology showcases and development labs for users, developers and partners to design, deliver and integrate cost-effective, power-efficient compute, storage and networking solutions. The initial lab will be located in Eden Prairie, Minnesota. Additional sites are planned for Arizona, California, Massachusetts, New York, Beijing, Shanghai and Hong Kong.
Texas Instruments and Mouser Electronics announced the TI MCU BoosterPack Design Challenge. Three winners will be selected. The grand prize is a round-trip flight to San Jose, California and an opportunity to be featured in the TI booth at DESIGN West. The deadline to submit an original BoosterPack design is March 1, 2013. Winners may also have the opportunity to have their original BoosterPack plug-in module designs considered for manufacture by CircuitCo Electronics.
Cadence Design Systems has issued a call for papers for the CDNLive Silicon Valley 2013 Users Conference. Cadence is seeking presentations and papers on design topics that illustrate users’ experiences with Cadence products, solutions, flows, methodologies, and techniques. The deadline for paper submission is December 4, 2012. Selected papers will be presented at CDNLive Silicon Valley. The event runs March 12-13, 2013 at the Hyatt Regency in Santa Clara, California.
Imec and Holst Centre will present at the International Solid-State Circuits Conference next week in San Francisco, California. They will present fourteen papers on low power design for wireless communication and wireless sensor networks, and organic electronics. In addition, imec and Holst Centre will also reveal other important breakthroughs in wireless communication and wireless sensor networks, and organic electronics.
Cadence Design Systems has issued a call for papers for their 2012 CDNLive! Users Conference. Papers considered should address new technologies and methodologies for realizing next generation systems, silicon, and differentiated IP. The deadline to submit a paper is November 11, 2011. The CDNLive! Users Conference helps design engineers stay on the competitive edge by sharing knowledge with top designers and executives. The event will take place March 13-14, 2012 in San Jose, California.
SAME 2011 Conference will take place October 12 and 13, 2011 in Sophia Antipolis, France. The main focus of this year’s Sophia Antipolis Conference on MicroElectronics is: Digital Mobility: AnyTime, AnyWhere, Any Device, Any Content. The European microelectronics event features technical seminars, forums, tutorials, panel discussions, and exhibits.
The 2012 Design Automation Conference has issued a call for submissions. This includes user track submissions, wild and crazy ideas (WACI) submissions, special session, panel and tutorial proposals and co-located events. There are different deadlines for the various categories. The first deadline is November 2, 2011. DAC 2012 will take place June 3-7, 2012 at the Moscone Convention Center in San Francisco, California.
Mentor Graphics is seeking entries to their PCB Technology Leadership Awards competition. The contest honors engineers and CAD designers who use Mentor Graphics PCB solutions (including the Board Station, Expedition Enterprise and PADS design flows) to address today’s complex PCB systems design challenges and produce industry-leading products. The deadline for engineers and designers to submit their design is September 30, 2011.
Freescale Semiconductor is holding a design contest called Make It Challenge. There are two tracks in the competition: (1) Mechatronics Robot Track and (2) Tower System Track. Each track will award one prize each to first, second and third place winning contestants. A Grand Prize winning contestant will also be selected from the two first prize winners. The grand prize is a Freescale Motorsports VIP Weekend package. First place winners will receive $3,000; second place will win $2,000, and third place will receive $1,000.