SMH Technologies Announces FlashRunner FR01AT0 In-System Programmer
FlashRunner FR01AT0, the new member of the FlashRunner series of in-system production programmers, is now available. FlashRunner FR01AT0 is specifically designed for easy integration with all in-circuit and functional test systems (ATEs), like Agilent, Teradyne, SPEA, TRI and others. FlashRunner FR01AT0 is based on the programming engine common to all members of the FlashRunner series, with the addition of new hardware features.
CCS Debuts Load-n-Go Handheld Programmer, PRIME8 In-Circuit Programmer
CCS is excited to introduce the latest additions to the CCS programmer product line: Load-n-Go Handheld Programmer and PRIME8 In-Circuit Gang Production Programmer. The exploding popularity of Microchip PIC®MCUs used in a variety of small electronics products has driven the need for an easy to use, low-cost, flexible production grade programmer. CCS has developed a ICSP[tm] handheld programmer, Load-n-Go and PRIME8 a production In-Circuit Serial Programmer[tm] for PIC10, PIC12, PIC14, PIC16, PIC18 and PIC24 MCUs as well as dsPIC® DSCs.
Altatech Launches AltaCVD Chemical Vapor, Atomic Layer Deposition Tool
Altatech Semiconductor, a global provider of advanced processes and manufacturing equipments for the semiconductor industry announced the launch of AltaCVD®, an advanced materials CVD (Chemical vapor deposition) and ALD (Atomic layer deposition) tool. Based on Altatech’s breakthrough vaporizing technology enabling the deposition from new, viscous and non-volatiles precursors, AltaCVD® offers unique new capabilities to R&D facilities and pilot productions lines.
ASML Reveals Roadmap at Symposium on Extreme Ultraviolet Lithography
ASML Holding NV (ASML) presents at the 2008 International Symposium on Extreme Ultraviolet Lithography (EUV) on recent achievements in its EUV lithography program and unveils a production system roadmap that supports cost-effective chip manufacturing to at least 11 nanometers (nm). The NXE series of lithography machines will be built on an evolved TWINSCAN[tm] platform. Design of the first production system is complete, the supply chain is fully engaged and system manufacturing has started. ASML currently has orders for five of these systems from Memory and Logic customers on three continents.
FlashRunner Programmer Supports Freescale MPC5000 PowerPC Devices
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now fully supports Freescale MPC5000 microcontrollers. FlashRunner is a high-performance, standalone in-system programmer specific for Flash-based microcontrollers and serial memories. FlashRunner is targeted at production environments, easily integrates into your programming system or Automatic Test Equipment (ATE), and can work either in full standalone mode or controlled by a host system.
KLA-Tencor Debuts Surfscan SP2XP Monitor Wafer Defect Inspection System
KLA-Tencor Corporation (NASDAQ:KLAC) introduced the Surfscan® SP2XP, a new monitor-wafer inspection system for the integrated circuit (IC) market that builds upon the success of its sister tool with the same name, introduced last year for the wafer manufacturing market. The new Surfscan SP2XP features improved sensitivity to defects on silicon, poly and metal films and enhanced ability to sort defects by type and size, compared with its predecessor, the industry-leading Surfscan SP2. It also features vacuum handling and best-in-class throughput. These capabilities are designed to enable chipmakers to bring their leading-edge (=4Xnm) devices to market faster by delivering superior process tool monitoring throughout the fab. The new system also introduces an ultra-high sensitivity operating mode to accelerate fabs’ development of 3Xnm and 2Xnm next-generation devices.
FlashRunner Fully Supports Silicon Labs 8051F Microcontrollers
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now fully supports Silicon Labs 8051F microcontrollers, via JTAG or C2 protocol. FlashRunner is a high-performance, standalone in-system programmer specific for Flash-based microcontrollers and serial memories. FlashRunner is targeted at production environments, easily integrates into your programming system or Automatic Test Equipment (ATE), and can work either in full standalone mode or controlled by a host system.
KLA-Tencor to Acquire MIE Business Unit of Vistec Semiconductor
KLA-Tencor (NASDAQ: KLAC) announced that it has entered into an agreement to acquire the Microelectronic Inspection Equipment (MIE) business unit of Vistec Semiconductor Systems, which is wholly owned by Golden Gate Capital, a San Francisco-based private equity firm. The MIE business unit of Vistec is headquartered in Weilburg, Germany and provides advanced semiconductor mask and wafer manufacturing systems. Financial terms of the transaction were not disclosed.
Eco-Snow Systems Develops Automated Cleaning Technology for MEMS
Eco-Snow Systems, an affiliate of The Linde Group, has developed automated cleaning technology for the Micro Electrical Mechanical Systems (MEMS) industry that helps reduce defect rates and increase device reliability. Eco-Snow Systems is the leading supplier of automated, carbon dioxide (CO2)-based wafer cleaning tools and processes to the semiconductor industry. Two major U.S. MEMS manufacturers have installed the Eco-Snow VersaClean[tm] system for packaging component cleaning and the Eco-Snow WaferClean[tm] system for released device level cleaning prior to wafer dicing.
Aviza Technology Unveils Versalis fxP for 3D-IC Manufacturing
Aviza Technology, Inc. (NASDAQ:AVZA), a supplier of advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets, announced the introduction of the Versalis fxP, a 200/300 mm cluster system targeted for 3D-IC manufacturing using through silicon via (TSV) technology. Aviza is at the forefront of developing this unique integrated process solution for research and development (R&D) that encompasses multiple steps, including Etch, PVD and CVD, in order to deliver functional 3D-IC packages and accelerate time-to-market for such products.
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