Bruker introduced the Photoconductive Module for the Dimension Icon Atomic Force Microscope (AFM). The Photoconductive Atomic Force Microscopy (pcAFM) enables sample illumination while performing nanoscale electrical characterization. Bruker’s pcAFM accessory transforms the Dimension Icon AFM into a solution for dedicated nanoscale organic photoelectric material research.
Bruker introduced three new 450mm X-Ray and AFM semiconductor metrology products: InSight-450 3DAFM, D8 FABLINE and S8 FABLINE-T X-ray systems. The three metrology systems are designed to meet the industry roadmap challenges at future technology nodes on the larger 450mm wafer size. They enable both greater product capability and reliability for semi development and production facilities.
The Bond Meister MWB-12-ST, from Mitsubishi Heavy Industries Ltd (MHI), is the world’s first fully automated 12-inch (300 millimeters) wafer bonding machine that can produce 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The wafer bonding machine is able to undertake continuous bonding of up to five 12-inch wafers and can perform wafer transfer and alignment for automatic bonding. The HI system is also capable of preliminarily setting the bonding conditions for each wafer individually, to accommodate production of various types in small lots.
Surrey NanoSystems sets a new benchmark for the production of nanomaterials with the launch of an automated and exceptionally versatile growth platform, NanoGrowth-Catalyst. Incorporating nine advanced nanomaterial processing techniques, the platform can synthesize an exceptional variety of nanomaterials including graphene, nanowires and carbon nanotubes.
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now fully supports Freescale 56800E microcontrollers. FlashRunner is a high-performance, standalone in-system programmer specific for Flash-based microcontrollers and serial memories. FlashRunner is targeted at production environments, easily integrates into your programming system or Automatic Test Equipment (ATE), and can work either in full standalone mode or controlled by a host system.
SMH Technologies announces the development of a high-performance, standalone in-system gang programming system (FlashRunner Quattro). FlashRunner Quattro is based on the FlashRunner patented technology and is designed for programming multi-PCB panel assemblies. FlashRunner Quattro offers:
Eco-Snow Systems[tm], an affiliate of The Linde Group, has introduced a new, automated technology for cleaning image sensors. Eco-Snow Systems is the leading supplier of automated, carbon dioxide (CO2) snow based cleaning tools and processes to the micro-electronics industry. During the manufacturing process for these sensors, which are used in camera phones, PC cameras and, of course, video and still cameras, microscopic particles can settle on the lens, impacting picture quality. And as pixel size continues to decrease in order to achieve higher image resolution, the size of problematic particles on these lenses also continues to shrink.
Berkeley Nucleonics, (San Rafael, CA), introduced the Model 725 Multi-Trigger Digital Delay Generator. The Model 725 addresses researcher’s and system integrator’s needs for extremely complex timing sequences. These timing requirements range from controls and diagnostics to signal quality monitoring and data acquisition. A wide range of signal filters, timing pulses, digital delay generation and cabling links can be accomplished with the Model 725. With its logic and timing capabilities, this is akin to a PLC (programmable logic controller) with precise timing.
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now supports more than 2500 different devices. FlashRunner is the first professional-grade in-system programmer supporting such a vast array of devices, making it the top choice for serious programming needs.
S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced that they will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.’s Flip Chip bonder equipment.