Bond Meister MWB-12-ST 300mm Wafer Bonding Machine Produces 3D LSI Circuits at Room Temperature
The Bond Meister MWB-12-ST, from Mitsubishi Heavy Industries Ltd (MHI), is the world’s first fully automated 12-inch (300 millimeters) wafer bonding machine that can produce 3-dimensionally integrated LSI (large-scale integration) circuits at room temperature. The wafer bonding machine is able to undertake continuous bonding of up to five 12-inch wafers and can perform wafer transfer and alignment for automatic bonding. The HI system is also capable of preliminarily setting the bonding conditions for each wafer individually, to accommodate production of various types in small lots.
Surrey NanoSystems Launches NanoGrowth-Catalyst Growth Platform
Surrey NanoSystems sets a new benchmark for the production of nanomaterials with the launch of an automated and exceptionally versatile growth platform, NanoGrowth-Catalyst. Incorporating nine advanced nanomaterial processing techniques, the platform can synthesize an exceptional variety of nanomaterials including graphene, nanowires and carbon nanotubes.
FlashRunner Programmer Supports Freescale 56800E Microcontrollers
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now fully supports Freescale 56800E microcontrollers. FlashRunner is a high-performance, standalone in-system programmer specific for Flash-based microcontrollers and serial memories. FlashRunner is targeted at production environments, easily integrates into your programming system or Automatic Test Equipment (ATE), and can work either in full standalone mode or controlled by a host system.
SMH Technologies Debuts FlashRunner Quattro In-System Gang Programmer
SMH Technologies announces the development of a high-performance, standalone in-system gang programming system (FlashRunner Quattro). FlashRunner Quattro is based on the FlashRunner patented technology and is designed for programming multi-PCB panel assemblies. FlashRunner Quattro offers:
Eco-Snow Announces Precision Clean 1000 for Cleaning Image Sensors
Eco-Snow Systems[tm], an affiliate of The Linde Group, has introduced a new, automated technology for cleaning image sensors. Eco-Snow Systems is the leading supplier of automated, carbon dioxide (CO2) snow based cleaning tools and processes to the micro-electronics industry. During the manufacturing process for these sensors, which are used in camera phones, PC cameras and, of course, video and still cameras, microscopic particles can settle on the lens, impacting picture quality. And as pixel size continues to decrease in order to achieve higher image resolution, the size of problematic particles on these lenses also continues to shrink.
Berkeley Nucleonics Debuts Model 725 Multi-Trigger Digital Delay Generator
Berkeley Nucleonics, (San Rafael, CA), introduced the Model 725 Multi-Trigger Digital Delay Generator. The Model 725 addresses researcher’s and system integrator’s needs for extremely complex timing sequences. These timing requirements range from controls and diagnostics to signal quality monitoring and data acquisition. A wide range of signal filters, timing pulses, digital delay generation and cabling links can be accomplished with the Model 725. With its logic and timing capabilities, this is akin to a PLC (programmable logic controller) with precise timing.
FlashRunner In-System Programmer Supports Over 2500 Devices
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now supports more than 2500 different devices. FlashRunner is the first professional-grade in-system programmer supporting such a vast array of devices, making it the top choice for serious programming needs.
IMEC to Use S.E.T. FC300 for 3D Chip Integration Research
S.E.T. Smart Equipment Technology, a wholly-owned subsidiary of Replisaurus Technologies and a leading supplier of high accuracy die-to-die (D2D), die-to-wafer (D2W) bonding and nanoimprint lithography solutions, announced that they will collaborate with IMEC, one of Europe’s leading independent nanoelectronics research institutes, on the development of die pick-and-place and bonding processes for 3D chip integration, using S.E.T.’s Flip Chip bonder equipment.
FlashRunner Programmer Features Expanded Data Encryption Capabilities
The universal, standalone in-system programmer specifically designed for the production environment (FlashRunner) now features expanded data encryption capabilities that extend the previously released security features and allows for secure programming outsurcing. With this software update, freely available for all users who purchased the FlashRunner security pack, binary files and other data can now be encrypted before being sent over a public communication line. The new encryption capabilities allow the programming engineer, for example, to safely send password-encrypted data (binary files, projects, etc.) to remote FlashRunenr units via public channels (e.g. as e-mail attachment or directly through a TCP/IP connection). Upon reception, the encrypted files can be copied to the FlashRunner’s SD card. FlashRunner will then internally and automatically decrypt their contents.
RPM MPQ-Z8 Programmer Supports Zilog ZLF645 Crimzon Microcontrollers
RPM Systems Corporation announces programming support for Zilog’s ZLF645 Crimzon wireless remote-control microcontrollers. Available immediately, the MPQ-Z8 programmer provides in-circuit programming of all flash-based devices in the ZLF645 Crimzon family. The new Crimzon support is in addition to existing Zilog Z8 Encore! and ZMC motor-control microcontrollers already supported by MPQ-Z8.
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