Mattson Technology Announces Alpine Photoresist Strip for BEOL, FEOL
Mattson Technology, Inc. (Nasdaq: MTSN), a leading supplier of advanced semiconductor process equipment used to manufacture Integrated Circuits (or ICs), announced the release of the Alpine(TM) system, the Company's newest innovation targeted to meet the stringent requirements of advanced low temperature photoresist strip processes on back-end-of-line (BEOL) and front-end-of-line (FEOL) applications for future technology nodes with a single tool. The latest addition to Mattson's complete family of dry strip products, Alpine was developed to address the challenges of advanced low-k and other complex materials required to manufacture today's and future ICs. Alpine builds and expands on Mattson's latest production proven platform, the Suprema(TM); and is designed for reliable, high-productivity, low-cost-of-ownership (COO) manufacturing for 65 nanometers and below. The Company noted that it has shipped its initial Alpine system to a major semiconductor manufacturer in Taiwan.
Nanometrics Acquires Tevet Process Control Technologies Assets
Nanometrics Incorporated (Nasdaq:NANO), a leading supplier of advanced process control metrology equipment, announced that it has acquired Tevet Process Control Technologies, Ltd. ("Tevet") through an all-cash asset purchase transaction. Tevet is an integrated metrology ("IM") company serving the worldwide semiconductor and solar manufacturing industry.
KLA-Tencor Develops Wafer Plane Inspection Technology
KLA-Tencor (NASDAQ:KLAC) introduced its latest mask inspection technology, called Wafer Plane Inspection (WPI), a unique mask inspection technology that, for the first time in the industry, provides the versatility in a single system to find all defects on a mask and also shows the defects that will print on the wafer. Besides overcoming yield-critical 32nm mask defect challenges, WPI also operates up to 40% faster than previous inspection systems, potentially reducing the percentage of total mask manufacturing time devoted to inspection.
Ricor Cryogenic Acquires InnerSense, Smart Wafer Technology
Ricor Cryogenic & Vacuum Systems, a manufacturer of semiconductor manufacturing equipment, announced the acquisition of InnerSense Ltd. Ricor thus expands its activities from cryogenic equipment and purging solutions to diagnostic systems. InnerSense has developed the "Smart Wafer" technology that provides engineers the means to record the forces acting on a wafer as it is handled by wafer fabrication equipment. This approach delivers a significant yield boost as it provides a statistical monitoring method for abnormal mechanical events in IC manufacturing and can be used as a cornerstone of an intelligent maintenance program (High Precision Maintenance) by routinely measuring equipment wear in a non invasive approach.
InnoMax Launches ESE-Thin Next Generation Spin Etcher
After years of success with their first generation Enhanced Spin Etcher (ESE(tm)), InnoMax, a leading Korean single-wafer spin etch systems, recently launched their next generation product, ESE(tm)-Thin, to meet the emerging thin wafer processing market. Innomax has filled their first order at one of the major semiconductor manufacturers in Korea.
Rudolph Technologies Announces AXi 940 Macro Defect Inspection Module
Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced the availability of the AXi 940 macro defect inspection module. The new AXi 940 module will perform wafer frontside inspection as part of the all-surface Explorer(tm) Inspection Cluster—a multi-surface inspection system designed to deliver fast, accurate and reliable macro inspection at a low cost-of-ownership. The new module is featured at this week's semiconductor manufacturing industry trade show, SEMICON® Korea, in Seoul.
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