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'EDA Tools' Category Archive

Cadence Design Systems Acquires Altos Design Automation

Posted by Ken Cheung in EDA Tools on Tuesday, May 10, 2011

Cadence Design Systems acquired Altos Design Automation. Terms of the acquisition were not disclosed. Altos is a leader in foundation IP enablement. The company has over 30 customers, including 11 of the top 20 semiconductor companies.

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Atego Gains DO-178B, DO-254 Solutions by Acquiring HighRely

Posted by Ken Cheung in EDA Tools on Wednesday, May 4, 2011

Atego has acquired HighRely, which is a provider of high reliability engineering solutions, services and tools for critical embedded product and systems development. Atego is a supplier of industrial-grade, collaborative development tools for engineering complex, mission-critical and safety-critical architectures, systems, software and hardware.

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ENSCO Acquires Quantum3D’s IData and IGL 178 Product Lines

Posted by Ken Cheung in EDA Tools on Monday, April 25, 2011

ENSCO has acquired Quantum3D’s IData Tool Suite and IGL 178 product lines. The acquisition includes supporting assets and staff. The embedded visual computing tools are now part of IData Visual Systems, which is a wholly owned subsidiary of ENSCO. The IData product line consists of a software development toolkit and application elements that provide a highly efficient development environment and high operational performance for digital display devices.

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ZMD ZIOL2411 Dual Channel IO-Link HV Line Driver

Posted by Ken Cheung in EDA Tools on Thursday, April 7, 2011

ZMDI introduced the ZIOL2411 line driver/level shifter IC. The ZIOL2411 features two independent HV1 I/O-channels, operating temperature of -40°C to +85°C, and a 4mm x 4mm QFN24 package. The configuration is stored in an on-chip EEPROM and automatically loaded into the IC’s control register during power up. The IC also provides status information, such as overload and over temperature. An implemented SPI interface supports access to configuration and status registers. The ZMD device is available now. Unit prices start at EUR 3.31 (1000-unit volume).

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Movea MotionPod Wireless Inertial Measurement Unit

Posted by Ken Cheung in EDA Tools on Friday, April 1, 2011

Movea introduced the MotionPod wireless Inertial Measurement Unit (IMU). The MotionPod features nine Degree-of-Freedom (DOF) motion, 3-axis accelerometer, 3-axis gyroscope, 3-axis magnetometer, and 2.4GHz wireless transmitter. The MotionPod measures only 33x22x15mm (1.3″x0.8″x0.6″) and weighs 14g (0.5 oz). A single MotionPod can provide information like range of motion, rotation, speed, and acceleration. Multiple MotionPods can be networked to gather information simultaneously from different parts of the body. It is ideal for fitness, gaming, and sports applications.

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Mentor Graphics Reveals 3D-IC Strategy

Posted by Ken Cheung in EDA Tools on Wednesday, March 30, 2011

Mentor Graphics revealed its 3D-IC strategy for designing, verifying, manufacturing and testing integrated circuit products using multi-die vertical stacking technology. Mentor also announced their 3D-IC testing solution, which includes multiple components of the Tessent design-for-test product line for integrated multi-die hierarchical scan and built-in self-test (BIST) methodologies. 3D-IC is an alternative to traditional scaling for achieving advances in performance, reduced power consumption, cost reduction, and increased functionality in a small package.

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Synopsys CODE V 10.3 Optical Design and Analysis Software

Posted by Ken Cheung in EDA Tools on Tuesday, March 15, 2011

Synopsys introduced version 10.3 of their CODE V optical design and analysis software. CODE V is an optical engineering and design software. It is used for the optimization, analysis, and tolerancing of image-forming optical systems and free-space photonic devices. CODE V 10.3 features new aspheric design tools. Aspheric surface shapes are used to help reduce or eliminate imperfect or blurred images in optical systems. An aspheric lens can be used to replace multiple spherical lenses. The CODE V 10.3 is available now.

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X-FAB Acquires 25.5% of MFI, Combines MEMS Foundry Resources

Posted by Ken Cheung in EDA Tools on Thursday, February 3, 2011

X-FAB has acquired 25.5% share of MEMS Foundry Itzehoe GmbH (MFI). X-FAB has the option to become the majority shareholder at a later date. The two companies will join forces to address the market for high-volume MEMS (Micro-Electro-Mechanical Systems) and will combine their existing MEMS foundry capabilities and resources. The joint cooperation we will close the gap between microelectronics and pure MEMS foundry services. With combined resources, X-FAB’s goal is to increase annual MEMS revenue to over $50 million in the next five years.

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Mercury Computer Systems Acquires LNX Corporation for $31 Million

Posted by Ken Cheung in EDA Tools on Thursday, January 13, 2011

Mercury Computer Systems acquired LNX Corporation for an all-cash purchase price of $31.0 million. There is also an earn-out of up to $5.0 million payable upon the achievement of financial targets in calendar years 2011 and 2012. The acquisition was funded with cash on hand. It is expected to be neutral to modestly accretive within the first year. LNX designs and builds next generation RF receivers for Signals Intelligence, Communications Intelligence as well as Electronic Attack applications.

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Laird Debuts Outdoor Thermoelectric Cooler Series with Bi-Polar Control

Posted by Ken Cheung in EDA Tools on Wednesday, December 22, 2010

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of its new Outdoor Thermoelectric Cooler Series with Bi-Polar Thermostatic Control. The AA Outdoor Cooler Series is a ruggedized Air-Air Thermoelectric Assembly (TEA) that uses impingement flow to transfer heat. It offers dependable, compact performance by cooling or heating enclosures via convection. A bi-polar thermostatic controller with predetermined set points is integrated inside the TEA to maintain its tight form factor.

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