The latest EDA Consortium’s Market Statistics Service (MSS) report indicates EDA revenues increased 6.8 percent in Q3 2013 over Q3 2012. CAE and SIP were the big revenue categories both years in the Americas and APAC, but all areas listed in the report showed growth.
The complex assembly of many solid objects (such as PCBs, electronics packages and devices, cabling, fans, and heatsinks) inside electronics equipment means air flow is confined within narrow regions between these solid objects. Electronics products pose a unique set of challenges for thermal simulation because of this complexity.
Cadence Design Systems introduced its Encounter RTL Compiler version 13.1 that can deliver up to 15 percent improvements in power, performance, and area with a new suite of physically aware RTL synthesis capabilities. The production-ready physical synthesis engine enables designers to use physical-aware techniques at earlier synthesis phases for better results in silicon. The new RTL Compiler inserts physical awareness into stages of synthesis that have previously been logic only.
At 28 nm and below, it’s difficult for designers to get optimal timing and closer as interconnect characteristics change. Cadence’s RTL compiler helps these complex and advanced chip designs deal with their timing and congestion challenges, and deal with them sooner. Addressing these problems earlier in the design process helps achieve faster timing closure and improve power, performance, and area.
Encounter RTL Compiler capabilities:
Physically aware structuring
Multi-bit cell inferencing
Design for test
More than 10 percent performance improvement from physically aware structuring and mapping
More than 15 percent area improvement on complex SoCs from pin and register placement considerations when choosing which microarchitecture to synthesize to and how to balance them
10 percent or more power decrease from physically aware multi-bit cell inferencing by merging single registers into clock-sharing multi-bit registers
Fujitsu Semiconductor collaborated with Cadence and used the new RTL compiler on several production design developments. As a result, they were able to improve timing and area by more than 10 percent, which allowed them to be able to make smaller chips for their customers.
Real Intent’s Ascent and Meridian early verification and advanced sign-off solutions will be presented by Director of Strategic Accounts Dr. Roger Hughes at the November 18, 2013 SemIsrael Expo 2013. Dr. Hughes will focus on formal verification’s role in Clock-Domain Crossing (CDC) in the presentation “Formal is Normal: Automatically Refine Your CDC Checking.”
Microchip Technology introduced the MGC3130 Hillstar Development Kit for 3D gesturing systems. The MGC3130 Hillstar Development Kit enables engineers to integrate an advanced 3D hand-position and gesturing user interface to virtually any electronic product. The Hillstar Development Kit (part #DM160218) is available for now for $179. The MGC3130 Configurable 3D Gesture Controller is shipping in production volumes.
Microchip Technology announced a cloud development platform. The service is available on the Amazon Web Services (AWS) Marketplace and enables embedded engineers to quickly learn cloud based communication. Microchip’s Cloud Development Platform is available now. As part of this platform, their Wi-Fi Client Module Development Kit is available for purchase for $99.
Microchip Technology has expanded their Arduino compatible chipKIT platform ecosystem. This includes the chipKIT Pi Expansion Board, which is a new Raspberry Pi tool that it co-developed with element14. The chipKIT Pi’s advanced features simplify Arduino based application development for the Raspberry Pi.The new expansion board also adds large memory space, fast performance and integrated peripherals for human-interface, audio-processing and advanced-control applications. The chipKIT Pi Expansion Board is priced at $28. Boards are expected to become available in the final week of September.
Texas Instruments introduced their MSP430 USB LaunchPad Evaluation Kit and supporting ecosystem of software and support for TI’s USB microcontrollers. The TI MSP-EXP430F5529LP LaunchPad is based on the ultra-low power MSP430F5529 microcontroller (MCU). It provides engineers and makers of all experience levels more connectivity, memory and performance options for a variety of low-power consumer, industrial, medical and wireless connectivity applications. The new MSP430 USB LaunchPad evaluation kit is available now for $12.99.
AWR recently published a news application note: Design of a Full ETSI E-band Circuit for a Millimeter-Wave Wireless System. The article explains how to use Microwave Office circuit design software to develop a Q- to E-band doubler and a K- to E-band quadrupler circuit (including a medium E-band power amplifier) for millimeter-wave wireless systems. The design effort resulted in an increase in gain as well as output power, two critical criteria for E-band systems.
Texas Instruments launched the Hercules LaunchPad, which is the latest member to their microcontroller LaunchPad ecosystem. The Hercules LaunchPad is an entry-level option that helps developers gain familiarity with TI Hercules MCUs and evaluate the MCUs performance and safety features. The TI Hercules TMS570LS04 MCU LaunchPad (LAUNCHXL-TMS57004) and Hercules RM42x MCU LaunchPad (LAUNCHXL-RM42) are available for $19.99. They are the lowest cost evaluation platforms for Hercules MCUs.