All Flex Acquisitions to Present Flexible Circuits at Electronica
All Flex Acquisitions, LLC, a manufacturer of flex circuits and flex circuit assemblies, will present the product line including flexible circuits that are single sided, double sided, and multilayer up to six layers at the International electronics trade show "electronica" on November 11 to 14, 2008, in Munich (Germany). At booth 252 in hall C3 the enterprise, with headquarters and manufacturing site in Northfield, MN, US, presents flexible heaters - the new product highlight. All Flex announces a new capability in producing custom Flexible Heater Circuits. Flexible Heater Circuits are thin, lightweight and flexible substrates that can provide heat to selected areas of instrumentation, electronic systems, equipment, and a variety of other applications.
TDK Creates 1005-size Thin-Film Band-Pass Filter for Mobile Devices
TDK Corporation announced that it developed a 1005-size thin-film band-pass filter that is just 0.3 mm thick, making it the world's smallest filter of its kind. TDK applied the thin-film technologies it developed through the manufacture of HDD magnetic heads, which are among TDK's leading products, to create a filter that is substantially low-profile and smaller than earlier 2012-sized products with just one-twelfth the volume.
Analog Devices Unveils ADP120, ADP121, ADP130 LDO Linear Regulators
Analog Devices, Inc. (ADI), a global leader in high-performance semiconductors for signal-processing applications, has introduced a family of high-performance LDO (low dropout) regulators that generates the low noise, low voltage supply rails and extended battery life required for superior performance in mobile handsets and other battery-powered devices. The ADP120 and ADP121 LDOs are available in the industry's smallest wafer-level chip scale package (WLCSP), as well as a standard TSOT option, offering design flexibility for high-performance, small form factor handsets. Leveraging ADI's more than 40 years of experience in analog design, the ADP120, ADP121 and ADP130 LDOs achieve very low levels of noise and power consumption, providing portable electronics designers with a power management solution optimized for their application needs.
MultiMediaCard Association, JEDEC Solid State Technology Association Merge
MultiMediaCard Association (MMCA) and JEDEC Solid State Technology Association (JEDEC) announced plans to merge certain MMCA assets, including embedded MMC (e-MMC) and miCARD specifications, trademarks and Intellectual Property rights, into JEDEC effective September 22, 2008. The merger follows a successful partnership forged during the development of the e-MMCv4.2 and v4.3 specifications.
TI Debuts TPS65920, TPS65930, TPS65950 Devices for OMAP35x Designs
Building on its power management portfolio targeting embedded processor designs, Texas Instruments Incorporated (TI) (NYSE: TXN) introduced three fully integrated power management and signal chain companion chips to support all system power requirements of an OMAP35x processor-based design. Combining leading power management circuits with TI's low-power embedded processors results in optimized power and performance, leading to longer battery life and system run-time.
Ramtron Introduces FM25V10 1-megabit Serial F-RAM
Ramtron International Corporation (Nasdaq: RMTR), a leading developer and supplier of nonvolatile ferroelectric random access memory (F-RAM) and integrated semiconductor products, has announced the first device in a family of new F-RAM products that offer high-speed read/write performance, low voltage operation, and optional device features. The first device in Ramtron's V-Family of F-RAM products is the FM25V10, a 1-megabit (Mb), 2.0 to 3.6-volt, serial peripheral interface (SPI) nonvolatile RAM in an 8-pin SOIC package that features fast access, NoDelay[tm] writes, 1E14 read/write cycles, and low power consumption. The FM25V10 is an ideal alternative to 1Mb serial Flash and serial EEPROM memory in industrial control, metering, medical, automotive, military, gaming, and computing applications, among others. Additional SPI, I2C, and parallel interface V-Family F-RAM products are planned for introduction in 2008.
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