'Components' Category Archive

Freescale Unveils MC34845 LED Driver with High-Speed Pulse-Width Modulator

Posted by EDA Geek News Staff in Components on Tuesday, June 30, 2009

Enabling slimmer laptops with brighter screens and extended battery life, light-emitting diodes (LEDs) are rapidly replacing cold cathode fluorescent lamps (CCFL) as the dominant backlighting technology for liquid crystal displays (LCDs) used in notebook PCs and industrial and medical displays. However, use of LEDs in notebook LCDs presents technical challenges, such as the generation of audible noise and visual artifacts that can diminish the end-user experience.

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IDT Introduces VersaClock III Programmable Clock Generator

Posted by EDA Geek News Staff in Components on Tuesday, June 30, 2009

IDT® (Integrated Device Technology, Inc.; NASDAQ: IDTI), a leading provider of essential mixed signal semiconductor solutions that enrich the digital media experience, announced the newest members of its VersaClock[tm] family of timing devices. VersaClock III devices are programmable clock generators specifically designed for use in high-performance consumer, telecommunications, networking and data communications applications and are more versatile alternatives to using multiple crystals and oscillators. These programmable timing solutions are critical in reducing board space and maintaining power efficiency where volumes may not allow full custom solutions. Multiple systems, with widely varying requirements, can consolidate to fewer of these programmable devices improving inventory management.

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Samsung, Numonyx to Develop Phase Change Memory Specifications

Posted by EDA Geek News Staff in Components on Tuesday, June 23, 2009

Samsung Electronics Co., Ltd. and Numonyx B.V. announced they are jointly developing market specifications for Phase Change Memory (PCM) products, a next generation memory technology that will help enable makers of feature-rich handsets and mobile applications, embedded systems* and high-end computing devices to meet the increasing performance and power demands for platforms loaded with content and data. Creating common hardware and software compatibility for PCM products should help simplify designs and shorten development time, enabling manufacturers to quickly transition to high-performance, low-power PCM products from both companies.

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NEC Creates Architecture for Miniaturized Analog Circuit

Posted by EDA Geek News Staff in Components, Research on Thursday, June 18, 2009

NEC Electronics Corporation announced the successful development of a new architecture that can be used to provide both the miniaturization and the high accuracy to the analog circuits, including analog-to-digital (AD) and digital-to-analog (DA) converters. Advances in LSI miniaturization have brought about a system-on-chip (SoC), with a single SoC requiring a mixture of digital and analog circuits, increasing the numbers of embedded devices to shrink. As the SoCs scale down, overall power consumption decreases through lowered voltage and current, causing the poor matching characteristics between devices to increase relatively.

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MAZeT Introduces Spectral Sensors for Process Analytics

Posted by EDA Geek News Staff in Components on Thursday, June 18, 2009

MAZeT presents its multi-range spectral sensors that MAZeT uses as basis for developing and supplying application-specific sensor modules for its customers. The sensors can be adapted to the particular application both in regard to the number of spectral channels and the spectral transmission characteristics of each channel. The first sensor presented in this design has six spectral channels, whose filters from 400 nm to 700 nm overlap one another and are uniformly distributed over this range.

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Vishay Unveils SiZ700DT Asymmetric Power MOSFET in PowerPAIR Package

Posted by EDA Geek News Staff in Components on Wednesday, June 17, 2009

Vishay Intertechnology, Inc. (NYSE: VSH) introduced the first device in a series of copackaged, asymmetric power MOSFET pairs that reduces the space required for the high- and low-side power MOSFETs in dc-to-dc converters. The industry-first SiZ700DT in the new PowerPAIR[tm] package, which measures 6-mm by 3.7-mm, combines a low-side and high-side MOSFET in one compact device while still obtaining low on-resistance and high maximum current, saving space over using two discrete solutions. The height of PowerPAIR is 0.75 mm typical, or 28 % thinner than the PowerPAK® 1212-8 and PowerPAK SO-8, which both have a 1.04-mm profile.

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