Elma Announces Extruded AdvancedTCA Front Panels
Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced AdvancedTCA (ATCA) front panels that offer a more precise and finished look that typical stamped sheet metal versions. Elma offers the extruded ATCA panels in two versions. The first version has a .5 mm deep channel for overlays (typically a printed lexan substrate with pressure-sensitive adhesive on the back side) to be placed. The other version is for silk-screening /painting and does not have a channel.
Hitec to Showcase Electronic Systems Enclosures at Embedded Masterclass
Cambridge metalworkers to the technology sector, Hitec, have announced that they have helped sponsor and will be exhibiting at the Embedded Masterclass technology developers conference to be held in London and Bristol on the 8th and 13th May. Hitec is an important supplier to European developers of hi-tech systems, in markets such as medical, communications, printing, electronic systems, environmental control and machinery.
Kontron Introduces OM6062 Industrial MicroTCA Integrated Platform
Kontron introduced the Kontron OM6062, a double-width industrial MicroTCA integrated platform that supports up to six AdvancedMC modules. This is Kontron's latest open modular solution; ideal for applications that demand processing power, high throughput and low latency. Target applications include, but are not limited to, image processing, motion control and process control in the industrial and medical markets.
Addonics Rolls Out Storage Rack Mount Chassis
Addonics Technologies announced its Storage Rack, a 4U rack mount storage chassis that is designed to fit into a standard computer rack for creating custom storage solutions with multi-terabyte capacity for video storage, video editing, data archiving, storage farms, or uninterruptible and redundant storage.
Elma Bustronic Rolls Out Pico-style MicroTCA Backplanes
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes has announced new MicroTCA backplanes in the Pico style format. The first Pico backplane has been designed for sister-company Elma Electronic's 1U MicroTCA enclosure solution. The Pico format for MicroTCA is typically in a horizontally mounted chassis. The compact size saves vertical rack space.
Elma Bustronic Develops Next Gen AdvancedTCA Backplanes
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes, has developed new 2nd generation AdvancedTCA (ATCA) backplanes. The new ATCA backplanes have routing implemented for radial Intelligent Platform Management Bus (IPMB) signals. Radial IPBM provides dual segment access to every IPM controller even when only one shelf manager is present or operational. This is an important option for ATCA systems to provide higher reliability and redundancy.
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