BSQUARE Creates Embedded CE BSP for ARM Cortex-A8, TI OMAP35x EVM
BSQUARE Corp. (Nasdaq:BSQR) announced that it is producing a production-quality board support package (BSP) for TI's new extensible OMAP35x(tm) Evaluation Module (EVM). The OMAP35x application processors are based on the new ARM® Cortex(tm)-A8 processor, which offers an unprecedented combination of laptop-like performance and superior power management for a wide range of applications, including digital set-top boxes, mobile Internet appliances, portable navigation devices, media players, and personal medical equipment. Together, the EVM and BSQUARE's BSP—the first Windows Embedded CE BSP to support the ARM Cortex-A8 processor—will give device designers everything they need to create next-generation Windows Embedded CE-powered devices using TI's new OMAP35x application processors.
3DLABS to Demonstrate Microsoft Windows CE BSP for DMS-02 Processor
3DLABS Semiconductor, a pioneer in media-rich application processors, announces that it will be demonstrating its Windows CE BSP (Board Support Package) at Embedded World, Nuremberg, Germany, 26-28th February. The BSP takes full advantage of the DMS-02's fully programmable media processing array and dual ARM architecture to deliver unrivalled application and media performance for embedded and low-power consumer electronics devices such as connected media players, portable navigation units, service terminals, smartphones and gaming devices.
Freescale Announces Integrated Linux BSP on Cellular Products
Freescale announced the support for the Linux® operating system on its cellular products. Freescale's Linux cellular platform is capable of supporting any Linux Application Framework, whether it is an industry standard or an OEM's proprietary solution.
SYSGO Rolls Out PikeOS Board Support Package for Kontron AM4100 AMC
SYSGO announced the availability of a PikeOS Board Support Package for Kontron's AM4100, an AdvancedMC (AMC) board using the MPC8641D dual-core processor based on the latest generation of Freescale's E600 core. The PikeOS BSP has been developed to be used in a multi-application system for an avionics equipment to be certified to DO178B.
Adeneo Releases Windows Embedded CE 6.0 BSP for NXP LPC3180 ARM9 MCU
Adeneo, a Microsoft Windows Embedded Gold Partner with facilities in Europe and in the USA, announced the full commercial release of the Windows Embedded CE 6.0 BSP for NXP LPC3180 ARM9(tm) processor-based microcontroller. This BSP targets the phyCORE LPC3180 board, a standard development platform from PHYTEC. It supports all key features of the LPC3180, including optimized power management, and ARM® Vector Floating Point (VFP) library for CE 6.0.
Atmel, Adeneo Debut Windows Embedded CE 6.0 Board Support Package
Atmel® Corporation (Nasdaq: ATML) and Adeneo announced the availability of a Microsoft® Windows® Embedded CE 6.0 Board Support Package (BSP) for Atmel's AT91CAP9A-STK® Starter Kit and AT91CAP9A-DK Development Kit. This BSP facilitates the development of Windows Embedded CE-based applications on Atmel's AT91CAP9 customizable microcontroller, built around the industry-standard ARM926EJ-S processor. The BSP consists of a fully supported Windows Embedded CE 6.0 kernel ported onto the AT91CAP9 architecture, with drivers for all the CAP peripherals and external interfaces. Drivers for the additional functional modules implemented in the CAP Metal Programmable (MP) Block can be seamlessly integrated.
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