White Paper: Solving the Problem of Diminishing Test Coverage from In-circuit Test

Solving the problem of diminishing test coverage from in-circuit test (ICT) white paper ~ ASSET InterTech

ASSET InterTech released a new white paper that explains why test coverage from intrusive, probe-based in-circuit testers with their bed-of-nails fixtures is diminishing. The technical paper is titled, Solving the problem of diminishing test coverage from in-circuit test (ICT). The ebook was written by Adam Ley, chief technologist of non-intrusive board test for ASSET.

The ASSET InterTech white paper describes software-based non-intrusive methodologies that test from the inside out and eliminate the need to physically probe chips and circuit boards during prototype board bring-up, volume manufacturing and troubleshooting in the field.

In-circuit Test Coverage White Paper Topics

  • Why access is diminishing
  • What ICT cannot test
  • How fixtures can damage circuits
  • What is non-intrusive board test

Solving the problem of diminishing test coverage from in-circuit test (ICT)

In-circuit test (ICT) seemed ideal for simplifying test generation and execution when it was first introduced. But device package changes, device complexity, board layout density and increased circuit speeds have eroded usability and test coverage of ICT ever since. Many advances have been made to keep ICT relevant, but those advances haven’t kept pace with the erosion of test access. Fortunately, new test access standards and software-driven tools offer alternatives to probe-based testing.

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