X-FAB Silicon Foundries has developed an open-platform 3-axis inertial sensor process. It is the first open-platform MEMS 3D inertial sensor process available directly from a high-volume pure-play foundry. The technology is available now for engineering services and early access prototyping. Full qualification and complete design rule access will be available in early 2013.
As a result of the new 3D inertial sensor process, fabless and other companies will be able to apply their own design or use X-FAB’s design partner, and immediately run wafer volumes without long and costly process development. X-FAB’s open-platform process decreases time to market and secures high-quality manufacturing for inertial sensors.
One-axis and 2-axis designs can be produced with the same process. In addition, accelerometer and gyroscope designs can be placed side by side on a single chip made with the same process, enabling the manufacture of 6DoF IMU.
X-FAB’s new technology features robust, single-crystal silicon for inertial masses and drive-combs, proprietary buried contact technology that supports complex metal interconnects using a single metal layer, low parasitic capacitance and EMI protection. The 3D inertial sensor process complements X-FAB’s established 1D/2D inertial sensor, pressure sensor and infra-red thermopile open-platform processes, and its ready-made IP blocks for 2G, 10G and 100G accelerometers. The new 3D inertial sensor technology was developed using X-FAB’s step-by-step qualification procedures to ensure the process is characterized, stable, and high-yielding. All X-FAB manufacturing sites are ISO 9001 and ISO TS16949 qualified.
The new open-platform MEMS 3D inertial sensor process is ideal for mobile devices, consumer goods, games and toys, automotive, robotics, industrial and medical equipment that use 3D accelerometers or gyroscopes.
More info: X-FAB