X-FAB Silicon Foundries introduced their XU035 process. The new X-FAB process provides low specific on-resistance 700V power devices and the lowest mask count in the foundry industry. The XU035 CMOS-based process will be available for tape-ins of prototypes and risk production next month. The process is ideal for ultra-high-voltage consumer applications such as AC LED lighting, chargers with no-load power consumption and other power conversion and control applications.
The new X-FAB XU035 process includes multiple cost-efficiency features such as a single poly and single 5V gate oxide architecture, 8-inch bulk starting material, optional third routing and power metals and optional MIM capacitors. It also includes a depletion transistor and a high-resistive poly module. Depending on the process module combination chosen, the total mask count range of 13 to 18 is the foundry industry’s lowest.
The XU035 process features 700V N&PMOS, DMOS and depletion transistors with RDSon as low as 15 Ohm*mm2 and 20V and 40V devices with floating high-side capabilities. With the new process, users can select from a wide spectrum of analog passive devices, such as UHV resistors, MOS and MIM capacitors and protection diodes, to match their specific application needs.
XU035 includes comprehensive X-FAB design support. This includes PDKs for all major design environments, precise Spectre and H-Spice models, digital libraries and 2kV ESD support.
More info: X-FAB