ZMD ZSSC3016 16-bit Sensor Signal Conditioning IC
ZMD AG introduced their ZSSC3016 16-bit sensor signal conditioning IC (SSC) for calibrated resistive sensor modules. The ZSSC3016 features high accuracy amplification, 16-bit precision analog-to-digital conversion, and an 18-bit DSP for linearization and calibration functions. The chip is ideal for use in mobile phones, sport watches or outdoor GPS tracking systems. The ZMD ZSSC3016 is available as die for wafer bonding. Parts are priced at 0.78 Euro (US$1.09) in volumes of 10k. Samples and wafer material are available now.
The ZSSC3016 sensor signal conditioning IC features an internal sensor supply regulator with a power supply rejection ratio (PSRR) that eliminates the need of an external buffer cap. In addition, it offers an altitude resolution of less than 15cm at sea level. It is accurate enough for barometric altitude measurement for portable navigation or emergency call systems, altitude measurement for car navigation, inside hard disk pressure measurement, and weather forecasting equipment.
The ZSSC3016 SSC operates at a temperature range from -40°C to +85°C. Accuracy is less than ±0.10% FSO over the full temperature range. The ZSSC3016 can perform offset, span, and first and second order temperature compensation of the measured signal. The ZMD ZSSC3016 can provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C or SPI.
ZSSC3016 SSC Features
- Flexible, programmable analog front-end design
- Up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
- Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
- Internal auto-compensated temperature sensor
- Digital compensation of individual sensor offset; 1st and 2nd order digital compensation of sensor gain
- Digital compensation of 1st and 2nd order temperature gain and offset drift
- Intelligent power management unit
- Layout customized for die-die bonding with sensor for high-density chip-on-board assembly
- Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 85 °C
- Supply voltage range: 1.8 to 3.6V
- Current consumption: 1mA (operating mode)
- Sleep State current <250nA (25°C)
- Temperature resolution: <0.003K/LSB
- Small die size: 1.5mm2
- Delivery options: die for wafer bonding
- Integrated 18-bit calibration math DSP
- Fully corrected signal at digital output
- Minimize calibration costs through the one-pass calibration concept
- No external trimming components required
- Highly integrated CMOS design
- Ideal for low-voltage and low-power battery applications
More info: Zentrum Mikroelektronik Dresden AG (ZMDI)
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