D2S TrueMask DS Mask Wafer Double Simulation Accelerated Workstation
D2S launched the TrueMask DS mask-wafer double simulation accelerated workstation. It can help mask shops and wafer fabs with qualifying and optimizing 20nm node and below designs. TrueMask is ideal for R&D exploration, bit-cell design, hot-spot analysis and mask-defect categorization that comprehends overlapping eBeam shots and dose modulation. D2S TrueMask DS is available now.
TrueMask DS Features
- 0.1-nm resolution mask simulation up to 300×300 micron (mask dimensions), including overlapping shots and dose modulation
- Instantaneous eBeam simulation using hardware acceleration
- eBeam simulation of contours, contour differences, and DMs
- Mask process (develop, bake, and etch) simulation
- Advanced eBeam modeling with arbitrary point spread functions for exploration
- Fast, interactive aerial litho simulation from hardware acceleration
- Aerial lithography simulation of ArF with various light sources and EUV
- 5µm x 5µm (on wafer) interactive mask/wafer double simulation
- SEM interface for overlay analysis of pictures with simulations
- Inputs: GDSII and OASIS formats
- Outputs: GDSII, VSB/12 and JEOL formats
- TCL/based extension language for user customization
More info: D2S
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