Intel, Micron Develop 25nm 3-Bit-Per-Cell NAND Flash Memory
Intel Corporation and Micron Technology Inc. announced the delivery of 3-bit-per-cell (3bpc) NAND flash memory on 25-nanometer (nm) process technology, producing the industry’s highest capacity, smallest NAND device. The companies have sent initial product samples to select customers. Intel and Micron expect to be in full production by the end of the year.
Power Management Semiconductors Market to Grow by 40%
Fueled by gains in both the commercial and industrial sectors, the power management semiconductor industry will finish 2010 on a high note that will be unmatched over the next few years, according to the market research firm iSuppli Corp. Comprising integrated circuits and discretes, power management semiconductors will generate $31.4 billion in 2010, up a sizable 39.9 percent from $22.4 billion in 2009. This year’s expansion not only will reverse the losses of 2009 — when revenue declined by 15.8 percent — it also will be unequaled during the next four years, none of which will enjoy growth higher than 13 percent.
Altran Praxis, AdaCore Team on Skein Algorithm Reference Implementation
Altran Praxis and AdaCore announced a new reference implementation of the Skein algorithm, written and verified using the GPL 2010 Edition of the SPARK language and toolset. Skein is a cryptographic hash function and an entrant in the National Institute of Standards and Technology (NIST) hash function competition to design what will become the new Secure Hash Algorithm (SHA-3) standard. Such hash functions are used to compute short “digests” of long messages, and are one of the key building blocks of digital communication and cryptographic systems. Altran Praxis and AdaCore have open sourced the SPARKSkein reference implementation and made it available to the developer community via the Skein website. This is in time for the second SHA-3 candidate conference taking place at the Crypto 2010 conference, Santa Barbara, California, USA, from 23-24 August 2010.
New Killer Products Drive Consumer MEMS Market
Cell phones and a slew of emerging devices will power the market for consumer electronics and cell phone Microelectromechanical (MEMS) sensors toward solid, uninterrupted growth in 2010 and beyond, according to the market research firm iSuppli Corp. Revenue for MEMS sensors and actuators used in consumer electronics and mobile handsets is projected to reach $1.5 billion in 2010, up a solid 22.9 percent from $1.3 billion last year. “Unlike most industries, the consumer and mobile MEMS market did not suffer a decline last year—even at the height of the global economic downturn—and growth ranging from 17 percent to as much as 28 percent will continue during the next four years,” said Jérémie Bouchaud, principal analyst for MEMS and sensors at iSuppli.
Synopsys Creates DesignWare USB Software Alliance Program
Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design and manufacturing, announced the launch of the DesignWare® USB Software Alliance Program with leading USB software providers emsys, Jungo, MCCI and MicroDigital as inaugural members. This alliance program establishes an ecosystem of qualified USB software providers for drivers, firmware and stacks which have proven interoperability with Synopsys’ DesignWare USB 2.0 and SuperSpeed USB 3.0 IP. Synopsys and its DesignWare USB Software Alliance Program members can help designers to quickly incorporate USB connectivity into their system-on-chips (SoCs) with less risk and provide consumers with the plug-and-play functionality required for PCs, peripherals, mobile devices and consumer electronic products.
Power.org Reveals Power Architecture Silicon Roadmap
Power.org, the open collaborative organization that enables, develops and promotes standards for Power Architecture® technology, unveiled its new Power Architecture Silicon Roadmap, the heart of the Power Architecture ecosystem, and released data from IMS Research showing that Power Architecture technology remains the worldwide market leader.
Wireless Innovation Forum Approves Plans, Objectives for 2011
The Wireless Innovation Forum announced the approval of its 2011 Operations plan by its membership. The Plan includes eight top level objectives in support of the Forum’s Strategic Plan:
- Deliver Relevant Work Products
- Establish a Certification Capability
- Define New Initiatives
- Increase End User Participation
- Publish a “Top 10 Most Wanted Wireless Innovations” List
- Strengthen the Forum’s Brand
- Improve Regional Support
- Grow Participation
EDA Virtual Conference to Take Place October 14
OpenSystems Media is proud to announce the first EDA Virtual Conference, entitled EDA: The Next Big Things. Engineers from around the world are invited to learn about Analog and Mixed Signal, System-on-Chip, High-Level Design, and Verification. Each session will also include a special “Ask the Experts” panel for attendees to ask their questions and network with vendors.
Elma Bustronic Announces 3U VPX Backplane with RF Connectors
Elma Bustronic Corporation, an industry leading designer and manufacturer of high performance backplanes, has announced a new 3U VPX Backplane with connector for Radio Frequency (RF) and analog signals. The use of RF interconnects is expected to be an important issue for many Mil/Aero applications where the VITA 46/65 specifications for VPX are highly targeted.
Laird Rolls Out Enhanced Cascade Series Thermoelectric Assemblies
Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, announced the release of its enhanced Cascade Series Thermoelectric Assemblies (TEAs). The Cascade Series TEAs are custom designed cooling assemblies that use multistage Thermoelectric Modules (TEMs) to achieve a high temperature differential from ambient. This product series can produce up to a 40% higher cooling capacity at cold temperatures, surpassing standard product offerings with similar form factors.
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