In-Stat Comments on Intel’s Acquisition of Infineon Wireless Business
In its efforts to complete the wireless puzzle, Intel announced that it has acquired the wireless assets from German semiconductor vendor Infineon, a group Intel has partnered with in mobile solutions for several years. With the acquisition, Intel acquires roughly 3,400 staff, the existing cellular modem business, as well as the research investment in future products, including 4G (LTE) modem technology. This is another piece of valuable intellectual property that can be integrated or included in a silicon solution for consumer electronics (CE) products. This is Intel’s third acquisition in as many weeks targeting technology for CE devices that also includes the cable modem assets from Texas Instruments and the complete acquisition of security software vendor McAfee. More than the products that will likely result from these acquisitions, these purchases clearly signal Intel’s intention to develop products for CE markets over the next five years.
Intel Acquires Wireless Solutions Business from Infineon Technologies
Infineon Technologies AG and Intel Corporation have entered into a definitive agreement to transfer Infineon’s Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately $1.4 billion. WLS, a leading provider of cellular platforms to top tier global phone makers, will operate as a standalone business serving its existing customers. WLS will also contribute to Intel’s strategy to make connected computing ubiquitous from smartphones to laptops to embedded computing.
SYSGO Virtualization PikeOS Supports LEON Processor, RTEMS OS
SYSGO, leading supplier of software solutions for the world’s most demanding safety and security applications, announced the availability of its flagship product PikeOS for the LEON processor based platforms. RTEMS applications can run concurrently with PikeOS native, ARINC-653 and POSIX applications thanks to the safe and secure virtualization technology provided by PikeOS.
STMicroelectronics Unveils FLI7525 TV System-on-Chip IC for 3DTV
STMicroelectronics (NYSE: STM), one of the world’s largest semiconductor companies and a leader in chips for set-top boxes and digital TVs, announced a new TV System-on-Chip (SoC) IC offering 3DTV support and advanced 120Hz MEMC (motion estimation, motion compensation). Designed for next – generation 1080p full-high-definition (FHD) integrated Digital TVs (iDTVs), ST’s new FLI7525 SoC enables a new class of mid-range, 3DTV-enabled, 120Hz Internet TVs.
Mentor Graphics, GLOBALFOUNDRIES Publish Graphical Design Rule Manual
Mentor Graphics Corporation (NASDAQ: MENT) announced it has collaborated with GLOBALFOUNDRIES to create a facility called Graphical Design Rule Manual (GDRM) that helps IC designers rapidly debug layout design rule violations by integrating the Calibre® RVE[TM] results viewing environment with GLOBALFOUNDRIES’ electronic design rule manuals. With GDRM, designers using the Calibre RVE tool to correct DRC hotspots can automatically access detailed GLOBALFOUNDRIES textual and graphical reference information about the specific rules generating the violations. By providing instant access to relevant information, the solution allows designers to fix errors more quickly and reduce time to signoff.
Synopsys Introduces DesignWare MIPI M-PHY IP
Synopsys, Inc. (Nasdaq: SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, announced immediate availability of the DesignWare® MIPI M-PHY® IP for next-generation high-speed interfaces based on the newly ratified MIPI® Alliance M-PHY specification. With this latest addition to the DesignWare MIPI IP portfolio, Synopsys is the first provider to offer a comprehensive solution of a controller and PHY IP for both the MIPI DigRF(SM) v3 (2.5G/3.0G) and v4 (4G) standards. Incorporating both standards in a mobile device brings the benefit of the faster 4G standards while preserving broad coverage by using 2.5G/3.0G as a fallback mode. The configurable MIPI DigRF V4 Master Controller and M-PHY hard macro are compliant to the MIPI Alliance specifications. Utilizing a single-vendor solution enables designers to lower the risk and cost of integrating these MIPI interfaces into baseband and application processor integrated circuits (ICs), speeding time-to-market of advanced semiconductor solutions for LTE and Mobile WiMAX.
OCP-IP, CircuitSutra, Imperas Announce Virtual Platform Demo
Open Core Protocol International Partnership (OCP-IP), the organization delivering a common standard for intellectual property core interfaces that facilitate “plug and play” SoC design, and CircuitSutra, experts in SystemC modeling and embedded software development, along with Imperas, the company providing the infrastructure for the future of software virtual platforms and enabling the next generation of embedded software development, announced the availability of a Virtual Platform Demo created utilizing OCP-IP’s advanced Modeling Kit. This example platform acts as a guide to OCP-IP members enabling them to quick-start their ESL activities using the OCP-IP TLM Modeling Kit; which is fully compatible with OSCI’s TLM 2.0.1. Both the kit and Virtual Platform examples are free to both OCP-IP members and non-members.
Magma Quartz iPOP Improves Productivity, Operability, Performance
Magma® Design Automation Inc. (Nasdaq: LAVA), a provider of chip design software, launched Quartz iPOP, the “improved Productivity, Operability and Performance” initiative to facilitate designers’ adoption of the Quartz[tm] DRC and Quartz LVS software for designs targeted at 65 nanometers (nm) and below. Magma’s Quartz products, the first truly scalable physical verification solutions, handle larger designs and provide turnaround time up to an order of magnitude faster than traditional solutions – without sacrificing accuracy or requiring additional hardware. These unique capabilities provide the improved productivity and performance necessary to cope with the higher verification burden for designs at 65 nm and smaller without increasing the physical verification budget.
Marvell Acquires Powerline Communications Solutions, Assets of DS2
Marvell (Nasdaq: MRVL), a worldwide leader in integrated silicon solutions, announced it has acquired the intellectual property and assets of Diseno de Sistemas en Silicio S.A. (“DS2″), a supplier of high speed semiconductor solutions for powerline communications. Powerline technology converts any existing electrical power wiring into an intelligent, high-speed networking medium, enabling consumers to quickly and affordably create a “connected home” that can stream virtually any personal or subscription-based digital content to and from any room at high speeds. Terms of the deal were not disclosed.
SanDisk Develops Smallest Embedded 64GB Solid State Drive
SanDisk Corporation (NASDAQ:SNDK), the global leader in flash memory cards, announced the first product in a new category of embedded solid state drives (SSD) that are smaller than a postage stamp and offer higher capacities and performance than existing storage solutions. The SanDisk® integrated SSD (iSSD), the first high-capacity product within this new category, is designed for use in fast-growing mobile computing platforms such as tablet PCs and ultra-thin notebooks.
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