Apple iPhone 4 Smart Phone Teardown

Chipworks, the world’s leader in reverse engineering and patent infringement analysis for semiconductors and microelectronic systems, has done a silicon level teardown on the Apple iPhone 4. This teardown goes beyond just the package markings of the chips found inside and includes a consumer-level description of what makes the chips inside the Apple iPhone 4 so amazing. It also includes die photos and die markings where necessary to show the manufacturer of unmarked chips.

Apple iPhone 4 Smart Phone - Teardown to the Silicon by Chipworks

Key design win findings:

  • The Apple A4 remains unchanged from the iPad
  • TI has won the touch screen controller
  • OmniVision is the suspected main image sensor – more analysis to follow
  • STMicroelectronics scored two big inertial sensor wins for the accelerometer and gyroscope
  • AKM has updated the magnetic sensor with a new device that promises better performance
  • Broadcom continues to have success with Apple with its low power 802.11n with Bluetooth solution

For semiconductor companies looking for more in-depth analysis, a full suite of reverse engineering reports is available on many of the key chips.

More information: Apple iPhone 4 Smart Phone – Teardown to the Silicon

About Chipworks
Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company’s ability to analyze the circuitry and physical composition of these systems makes it a key partner in the success of the world’s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation – earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches.