McObject Supports Perst Embedded Database for Microsoft Windows Phone 7
In a classic example of the market driving the direction of a software product, McObject® announced it is offering support for its Perst[tm] object-oriented, open source embedded database on Microsoft’s Windows Phone 7 (WP7) smartphone platform, after Windows mobile software experts in the UK ported Perst (along with McObject’s related Silverlight demo) to WP7, and a Microsoft executive guiding WP7 developer relations described the port as “epic.”
TSMC Reference Flow 11 Features XtractIM, OrbitIO Planner, OptimizePI
Sigrity, Inc., the market leader in signal and power integrity solutions, announced that TSMC has included three Sigrity chip, package and system co-design products – XtractIM, OrbitIO Planner and OptimizePI – in its new TSMC Reference Flow 11.0. Companies that rely on TSMC flow support now can benefit from streamlined IC package assessment, package model extraction, chip/system IO planning, and power delivery system optimization.
Vishay Rolls Out TSOP4038, TSOP58038, TSOP5038 Infrared Sensors
Vishay Intertechnology, Inc. (NYSE: VSH) is adding to its Optoelectronics portfolio with a family of mid-range infrared (IR) sensors featuring digital and analog outputs in three package types. With a fast response time of 300 µs and low supply current of 0.85 mA, the industry-best detectors have a range of up to 30 meters when used as part of an interrupter design and a range of up to three meters when used as part of a reflective sensor.
Quadrant Debuts Duratron D7000 PI, Semitron MP370 Machinable Polymers
Quadrant is launching Duratron® D7000 PI and Semitron® MP370 (a modified PEEK) at the Semicon West 2010 trade show on July 13, 2010. These two new materials will help engineers and designers fill performance gaps with machinable polymers that not only offer excellent performance – but real value.
Dolby Approves Tensilica HiFi Audio DSP for MS10 Multistream Decoder
Tensilica,® Inc. announced that it is the first IP (intellectual property) company with an audio core for system-on-chip (SOC) designs approved for using the Dolby® MS10 Multistream Decoder, a multi-format audio decoding technology that supports Dolby Digital Plus and Dolby Pulse in a single package for next-generation HDTVs (high-definition televisions), STBs (set-top boxes) and DMPs (digital media players).
Apple iPhone 4 Mobile Handset Teardown
In advance of iSuppli Corp.’s planned teardown analysis of Apple Inc.’s iPhone 4, iSuppli Corp. is issuing several fast facts. The latest member of the iPhone line illustrates Apple’s new User Interface (UI)-oriented approach to product design, first seen in the iPad.
“Apple in the past has always doubled the amount of NAND flash memory in the newest version of its iPhone line,” said Andrew Rassweiler, director and principal analyst, teardown services, for iSuppli. “However, with the iPhone 4, Apple is standing pat at the 32Gbyte level. This shows that the iPhone has reached the point where data-storage memory is no longer one of the most critical features. Instead, the focus has shifted to the UI, with the major innovations of the iPhone 4 occurring in areas including the retina display, as well as the use of gyroscope-based control.”
VDC Research Publishes Embedded Software Development Tools Report
In a recently published report analyzing the markets for embedded software and system engineering solutions, VDC Research estimates that the market for software development tools in 2009 reached over $290 million. While this represents a market contraction of greater than 10% from 2008, VDC expects the embedded software development tools market will recover and grow cautiously in 2010 with incrementally higher growth rates through 2012.
Apple iPhone 4 Smart Phone Teardown
Chipworks, the world’s leader in reverse engineering and patent infringement analysis for semiconductors and microelectronic systems, has done a silicon level teardown on the Apple iPhone 4. This teardown goes beyond just the package markings of the chips found inside and includes a consumer-level description of what makes the chips inside the Apple iPhone 4 so amazing. It also includes die photos and die markings where necessary to show the manufacturer of unmarked chips.
IAR Embedded Workbench Integrates with Freescale MQX Software Solutions
IAR Systems announced that Freescale MQX Software Solutions has been integrated together with IAR Embedded Workbench, to provide a reliable and powerful development tool suite for embedded applications running on Freescale’s ColdFire devices. The integration allows developers of embedded systems built on ColdFire MCUs to benefit from the rich set of features provided by the Freescale MQX Software Solution, and to quickly add working communication capabilities, file system and a number of operating system utilities to their designs. Freescale MQX Software Solutions is a full-featured solution for embedded systems running on ColdFire devices. It comprises an RTOS, a file system, USB host and device stacks, and a TCP/IP communication stack.
Femto Forum White Paper: Offloading Mobile Data with Femtocells
The Femto Forum, the independent industry association that supports femtocell deployment worldwide, outlined the case for offload using femtocells in a publicly available white paper. The paper outlines how femtocells significantly increase mobile network capacity and efficiency while also lowering operators’ costs and providing an improved user experience for both indoor and outdoor users.
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