Laird Technologies Publishes Thermal Management Application Notes
Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, announced the release of its newest application note titled “Thermoelectric Assemblies for Food and Beverage Applications”. This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.
Savant Seeking Sponsors, Speakers for System-on-Chip Conference 2010
Savant Company Inc. announced a call for sponsors and speaker presentations for the 8th International System-on-Chip (SoC) Conference, which will be held at the Hilton Irvine/Orange County Airport, California, on Wednesday, November 3rd, and Thursday, November 4th, 2010. In 7 years, Savant’s highly targeted International SoC Conferences have become the premier event for the engineering communities that are involved in SoC, ASIC, CSSP, ASSP, and FPGA-based designs or are working with Foundry Services on a worldwide basis.
Texas Instruments Announces TI-Nspire Navigator Wireless Classroom
Math and science educators can bring a powerful level of learning energy and excitement to their classroom as the TI-Nspire[tm] Navigator[tm] wireless classroom network system becomes available to schools across the nation. The TI-Nspire Navigator system empowers teachers and students alike with a flexible new learning experience that encourages an interactive, collaborative classroom.
Samsung Develops 64-gigabyte moviNAND, 32GB microSD Memory Cards
Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, announced two high-density memory solutions for mobile devices. The new storage solutions – a 64-gigabyte (GB) moviNAND memory device and a 32GB micro secure digital (microSD) memory card – satisfy mobile handset designers’ requirements for advanced compact high-density memory.
Calibre PERC Protects ON Semiconductor, Faraday Technology
Mentor Graphics Corporation (NASDAQ: MENT) announced that its Calibre® PERC product, the industry’s most complete programmable electrical rule checker (PERC) for integrated circuits (ICs), is being employed at ON Semiconductor (NASDAQ: ONNN) and Faraday Technology Corporation. The product, which automates electrical checks based on user-defined rules, is designed to address customers’ need to improve reliability by identifying areas of vulnerability to catastrophic electrical failures in ICs during factory test, transport, and field operation.
Essensium Receives Patent for Wide Over Narrowband RF Implementation
Essensium N.V., an innovative developer of Real Time Location System products, announced that the European Patent Office published a key patent granted to Essensium regarding the ranging method which enables Essensium’s unique and industry-leading combination of high accuracy and long range in their wireless RTLS products.
Open-Silicon Acquires Silicon Logic Engineering
Open-Silicon, Inc., a leading SoC design and semiconductor manufacturing company, announced the acquisition of Silicon Logic Engineering (SLE) to enhance the company’s derivative IC design capabilities. The SLE team, based in Eau Claire, Wis., joined Open-Silicon effective December 7, 2009. SLE was founded in 1996 from senior engineers formerly with supercomputer company Cray Research.
IEI Technology Unveils PCIE-Q57 PICMG 1.3 Full-size CPU Card
IEI Technology Corp. (IEI), the global industrial PC innovator, announces the launch of the PCIE-Q57, a PICMG 1.3 Full-size CPU card with support for the Intel® Core[tm] i3/i5/i7 processors with the Intel® Q57 chipset. It is suited to high performance applications for gaming, digital video editing, workstations and network computing where security and reduced system downtime are critical.
Freescale Semiconductor, Mentor Graphics Leverage Design Flow
Mentor Graphics Corporation (NASDAQ:MENT) announced that Freescale Semiconductor (NYSE:FSL) (NYSE:FSL.B) has selected Mentor as an ideal partner in the silicon test, yield analysis, physical verification and DFM technology areas. The collaboration enables Freescale’s deployment of Mentor’s Tessent[tm] and Calibre® technologies covering design for test (DFT), physical verification and analysis, advanced resolution enhancement technologies (RET), and pre- and post-tapeout design for fabrication and manufacturability (DFM).
87% of Wi-Fi Enabled Smartphones to Feature 802.11n
Although 802.11n Wi-Fi technology was found in less than 1% of Wi-Fi-enabled smartphones last year, in 2014 at least 87% of Wi-Fi-capable smartphones will feature this latest of the 802.11 protocols. However, users of these phones shouldn’t expect laptop-like performance, at least not initially. “Driven by chip-makers more than by handset vendors, 802.11n is making its official debut in higher-end smartphones in 2010,” says ABI Research industry analyst Michael Morgan. “802.11n is arriving in the handset just at the right time. We had to wait for consumers to switch over to 802.11n access points, and we’re just now reaching that tipping point. Something like 50% of the Wi-Fi access points on offer are now 11n. Consumers are becoming aware of what it can do.”
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