Wireless M2M Connections to Grow by 25.6%
According to a new research report from the analyst firm Berg Insight, 1.4 percent of the mobile network connections worldwide were used for wireless machine-to-machine (M2M) communication at the end of 2009. The shares in the EU and the US were 2.4 percent and 4.3 percent respectively. In the next five years, the total number of wireless M2M connections is forecasted to grow at a compound annual growth rate (CAGR) of 25.6 percent to reach 187.1 million connections in 2014. By the same year M2M as a share of the total number of cellular connections is projected to reach 3.1 percent.
Agilent Debuts Stereo Viewer for Momentum G2 Element, FEM EM Simulators
Agilent Technologies Inc. (NYSE:A) announced a stereo 3D viewer capability for the Momentum G2 Element and FEM Element electromagnetic (EM) simulators in its Advanced Design System (ADS) EDA platform. The new stereo 3D viewer leverages NVIDIA Quadro graphics processing units (GPUs) and NVIDIA’s unique 3D Vision quad buffered stereo technology, originally designed for immersive mechanical design, digital content creation and video games, to render electric and magnetic fields and currents for scientists and engineers in crisp, vivid, high-resolution 3D.
Si2′s Low Power Coalition Welcomes Magma Design Automation
Silicon Integration Initiative (Si2) announced that Magma® Design Automation has joined Si2′s Low Power Coalition (LPC), an open industry group focused on advancing low-power design flow capability through open standards. Magma products are used for both digital and analog/mixed-signal IC design and implementation including, analysis, physical verification, circuit simulation and characterization. The addition of Magma to the LPC raises the total number of corporate members to 13.
Toshiba Develops 64 Gigabyte Embedded NAND Flash Memory Module
Toshiba Corp. (Toshiba) and Toshiba America Electronic Components, Inc. (TAEC), its subsidiary in the Americas, announced the launch of a 64 gigabyte (GB) embedded NAND flash memory module, the highest capacity yet achieved in the industry. The chip is the flagship device in a line-up of six new embedded NAND flash memory modules that offer full compliance with the latest e-MMC(TM) standard, and that are designed for application in a wide range of digital consumer products, including Smartphones, mobile phones, netbooks and digital video cameras. Samples of the 64GB module are availablenow, and mass production will start in the first quarter of 2010.
Microchip ZigBee RF4CE Compliant Platform Receives Certification
Microchip Technology Inc., a leading provider of microcontroller and analog semiconductors, announced that it has achieved certification for its ZigBee® RF4CE Compliant Platform, which enables the next generation of RF remote controls and consumer electronics. The platform consists of Microchip’s nanoWatt XLP eXtreme Low Power PIC® microcontrollers, the MRF24J40 IEEE 802.15.4 transceivers and FCC-certified modules, and the industry’s smallest memory footprint ZigBee RF4CE certified protocol stack.
TI MSP430 Microcontroller Powers Swimovate Pool-Mate Sports Watch
Innovating advanced swim training aids for the fitness industry, Swimovate Ltd leveraged Texas Instruments Incorporated’s (TI) (NYSE: TXN) ultra-low power MSP430[tm] microcontroller (MCU) to drive its cutting-edge Pool-Mate sports watch, the first fully automatic lap and stroke counter on the market. Based on a single MSP430 MCU, Swimovate’s intelligent Pool-Mate allows swimmers to automatically count strokes and laps as well as calculate speed, distance, calories and efficiency.
Zoran Tapes Out Complex, Mixed-Signal Chip with Cadence Virtuoso
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that Zoran Corp., a leading provider of digital solutions in the digital entertainment and imaging markets, taped out a complex, advanced technology mixed-signal chip using the Cadence® Virtuoso® suite of design and simulation products. Zoran adopted the Virtuoso technology to address the growing complexities and challenges its engineers faced moving to advanced nodes.
ARM Solution Center for Android Welcomes CoWare
CoWare®, Inc., the leading supplier of Electronic System Virtualization[tm] software and services and a member of the ARM® Connected Community[tm], announced it is participating in the ARM Solution Center for Android, a collaborative resource for designers and developers of ARM technology-based products running on Android, the open source platform from the Open Handset Alliance[tm]. CoWare provides virtual platform solutions for Android-based product prototyping and software development. Comprehensive debug, analysis and test solutions are available for the full Android software stack running at real-time speed on the virtual board.
Kontron Selects Mentor Graphics HyperLynx for Signal, Power Integrity
Mentor Graphics Corporation, (NASDAQ:MENT) announced that Kontron AG, headquartered in Eching, Germany, has expanded its Expedition[TM] Enterprise PCB installation from Mentor Graphics, with worldwide usage of the Mentor Graphics HyperLynx® solution for signal and power integrity. Kontron selected the HyperLynx signal and power integrity product for its accurate analysis and simulation capabilities, ease-of-use, and quick setup time, ideal for today’s high-performance/density/pin-count ICs that require multiple PCB power and ground structures. Combined with the Expedition Enterprise platform and the Mentor Graphics DMS (Data Management System), the HyperLynx product formulates a comprehensive solution for high-performance electronic product design that reduces design cycle times, prototypes, manufacturing re-spins and overall product performance and development costs.
Fairchild Semiconductor Signs Multi-Year Agreement with Cadence
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that Fairchild Semiconductor, a leading global provider of energy-efficient semiconductor technology, has named Cadence as its primary EDA partner following the signing of a multi-year agreement for key Cadence mixed-signal technology. Fairchild selected Cadence for its proven ability to provide an interoperable, mixed-signal design and verification solution using Cadence Virtuoso, Encounter, Incisive and Allegro technologies. A key technology for Fairchild is the Virtuoso Accelerated Parallel Simulator combined with Virtuoso AMS Designer, both part of the Virtuoso Multi-Mode Simulation suite. These technologies accelerate full-chip verification, leading to higher quality products and faster time to market.
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