IEEE Council on Electronic Design Automation Forms Design Technology Committee

The IEEE Council on Electronic Design Automation (CEDA) announced the formation of the Design Technology Committee. This newly formed group under CEDA will focus on the viewpoint of the major EDA users in identifying future needs of the system and semiconductor communities toward the EDA industry. It is further anticipated that this new group will coordinate closely with existing standards development organizations, such as Accellera, the IEEE DA Standards Committee, and the Silicon Integration Initiative (Si2).

“The Design Technology Committee consists of leaders exclusively from semiconductor and systems companies who use EDA tools and will cooperate with other groups inside and outside the IEEE on future EDA standards and other initiatives to advance the availability of interoperable tools to meet the industry’s needs,” states Leon Stok, IBM’s vice president of EDA and chair of the new Design Technology Committee. “The group will also discuss and share best practices on EDA related topics.”

The founding members of the Design Technology Committee are:

  • Clive Bittlestone, Texas Instruments Fellow and Architecture Manager
  • David Crohn, Senior Engineering Director at Broadcom Corporation
  • Martin Foltin, Systems VLSI Lab of HP
  • Rahul Goyal, Director of EDA Business at Intel
  • Thomas Harms, Director of EDA Alliance Management from Infineon Technologies (Vice Chair)
  • Uday Kapoor, Director of Corporate CAD at Sun Microsystems
  • Jan-Olof Kismalm, Director of Microelectronics Strategy from Ericsson AB
  • Sudhakar Sabada, Vice President of Design Engineering and Technology at LSI Logic
  • Leon Stok, Vice President of EDA at IBM Corporation (Chair)
  • Ward Vercruysse, Director and CAD/AMD Fellow of Silicon Design Engineering at AMD
  • Indavong Vongsavady, CAD Director from ST microelectronics

Nominations for new members are actively being solicited. For more information, contact Thomas Harms, the Design Technology Committee Vice Chair (Thomas.Harms@infineon.com).

The Design Technology Committee will identify emerging design challenges and capability gaps of common interest. These will be primarily focused but not limited to the use models and the interoperability of EDA tools, the standards used in EDA models to communicate with each other, and the best practices and business models through which we access design tools and design flows.

“The IEEE and CEDA are delighted to have this new group to advise CEDA activities and to bring together the multiple EDA standards groups inside and outside the IEEE,” says John Darringer, CEDA president.

“Si2 looks forward to a healthy and vibrant exchange among leading users of EDA technology, which will further advance alignment on tangible actions involving critical standardization requirements,” states Steve Schulz, president and CEO of Si2. “This new group has the opportunity to engage a broad cross-section of industry decision-makers, and I am confident that their success will only further enhance Si2’s success with our user-driven initiatives.”

“The Design Automation Standards Committee (DASC) of the IEEE welcomes the formation of the DTC,” adds Victor Berman, chairman of the DASC. “As the Sponsor for EDA related standards in the IEEE, DASC looks forward to a productive relationship with DTC as the voice of the user in EDA.”

About the IEEE Council on EDA
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across six IEEE societies (Antennas and Propagation; Circuits and Systems; Computer; Electron Devices; Microwave Theory and Techniques; and Solid State Circuits). It sponsors more than 12 conferences, including the Design Automation Conference and Design Automation and Test in Europe. CEDA publishes IEEE Transactions on CAD and the IEEE Embedded Systems Letters. CEDA is increasingly involved in recognizing its leaders via the A. Richard Newton Award, Early Career Award and Phil Kaufmann Award. CEDA welcomes volunteers and local chapters.