Emerson Network Power Rolls Out ATC250 Bus Converter for AdvancedTCA
Emerson Network Power, a business of Emerson (NYSE:EMR) and the global leader in enabling Business-Critical Continuity, enhanced its industry-leading dc-dc bus converter portfolio with the release of the ATC250 at the AdvancedTCA® Summit 2009. The high-density, dual-input converter offers board manufacturers a ruggedized, compact solution for generating on-board power in high-density AdvancedTCA (ATCA®) environments and other space-constrained systems that typically employ distributed power architectures.
STMicroelectronics STDP8028 Combines DisplayPort 1.1a, HDMI 1.3 Receiver
STMicroelectronics (NYSE: STM), a world leader in consumer ICs, is the first to combine a DisplayPort 1.1a and HDMI 1.3 receiver to support full high-definition sources, such as Blu-Ray, while providing comprehensive analog-video and audio connectivity. The new STDP8028 SoC from ST simplifies the design of high-end Full-HD multimedia displays with its unique integration of video inputs, advanced video quality and usability features such as Picture-In-Picture (PIP) and Picture-By-Picture (PBP). The SoC is being designed into multi-function monitors and public displays by leading OEMs around the world.
MIPS Releases Optimized ActionScript VM to Tamarin Open Source Project
MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, announced it has released a MIPS®-optimized version of the ActionScript[TM] virtual machine (VM) that is used in compelling Web-connected technologies such as Adobe® Flash® Player. The ActionScript VM is accessible via the Tamarin open source project, and is a key component in optimizing Adobe Flash Player for running on the MIPS architecture.
Intel, Numonyx Team on Stacked, Cross Point Phase Change Memory
Intel Corporation and Numonyx B.V. announced a key breakthrough in the research of phase change memory (PCM), a new non-volatile memory technology that combines many of the benefits of today’s various memory types. For the first time, researchers have demonstrated a 64Mb test chip that enables the ability to stack, or place, multiple layers of PCM arrays within a single die. These findings pave the way for building memory devices with greater capacity, lower power consumption and optimal space savings for random access non-volatile memory and storage applications.
Avago Debuts ACPL-M71T, ACPL-M72T R2Couplers for Hybrid Electric Vehicles
Avago Technologies (Nasdaq:AVGO), a leading supplier of analog interface components for communications, industrial and consumer applications, announced a pair of automotive-grade high speed, low power, digital CMOS optocouplers for use in Hybrid Electric Vehicles. The ACPL-M71T single channel high speed 15MBd and ACPL-M72T low power LED drive optocouplers are the latest additions to Avago’s R2Coupler[TM] digital family. Both of these high temperature, low power optocouplers, which are available in small outline IC-5 (SOIC-5) packages, are ideal for use in controller area network bus (CANBus) interfaces and microcontroller interfaces applications.
Laird Debuts Three EMI Sentry Form-In-Place Gaskets for EMI Shielding
Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, announced the addition of three new products to its EMI Sentry[tm] Form-In-Place gasket family. This top-of-the-line Form-In-Place gasket family provides EMI shielding while offering heat and humidity resistance, excellent adhesion strength, and a minimal compression set. These qualities improve reliability by increasing the durability and longevity of assemblies. In addition, fast handling and rapid curing speed up productivity, while increased softness offers the cost saving advantage of volume dispensing.
EVE ZeBu-Server Supports Verification Components Catalog
EVE, the leader in hardware/software co-verification, announced that ZeBu-Server, its a scalable emulation system capable of handling up to one-billion application specific integrated circuit (ASIC) gates, supports a wide range of verification components. EVE’s comprehensive catalog of ZeBu verification intellectual property (VIP) includes transactors, memory models and speed bridges. These verification components set a new standard in performance and affordability, helping to give ZeBu-Server the lowest cost of emulation ownership in the industry.
AMD Opteron Processors Improve ATCA Blade Servers
AMD (NYSE: AMD) is demonstrating its latest advancements for helping improve the network performance capability of industry-standard Advanced Telecommunications Computing Architecture (ATCA) blade servers at the ATCA Summit. Quad-Core AMD Opteron[tm] processors, at 50 and 71W TDP, provide a high-performance, low-power platform for the networking and telecommunications market. The new AMD server chipset featuring PCI® Express 2.0 and HyperTransport[tm] 3 technology provides a complete solution with improved I/O capabilities to increase performance over previous-generation platforms.
Cadence Debuts Allegro 16.3 System-in-Package, IC Packaging Software
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that package designers will be able to play a greater role in co-design and design chain collaboration with the latest release of its system-in-package (SiP) and IC packaging software. The Cadence Allegro 16.3 release features SiP Layout XL, a new product that puts co-design directly in the package design environment. The new co-design technology enables the optimization of designs between packaging and IC design teams without requiring packaging designers to learn IC design tools. Design chain collaboration is further enhanced through new SiP Finishing technology available with Allegro Package Designer (APD).
NI Creates New Version of Graphical Software for LEGO MINDSTORMS NXT 2.0
National Instruments announced a new version of its intuitive drag-and-drop software that powers the LEGO MINDSTORMS NXT 2.0 robotics kits for retail and education. With this system, children as young as 9 years old can design their own robots using new features such as color recognition, Bluetooth support and additional robot models that offer children more options to express their creativity. The software, which will be included with all LEGO MINDSTORMS NXT 2.0 kits, is based on the widely adopted NI LabVIEW graphical programming software, which provides children easy-to-use, drag-and-drop functionality to program their robotic creations. With this software, students simply drag and drop icons that are representative of the various tasks they want their robots to perform, similar to how professional engineers and scientists control today’s latest robotics with LabVIEW.
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