ActiveVideo, Videon Central Team on CE Video Devices
ActiveVideo Networks[tm], the global leader in cloud-based interactive television solutions, and Videon Central, Inc., a leading provider of digital video solutions and Blu-ray Disc (BD) middleware, announced a joint initiative that is intended to dramatically speed adoption of the next generation of CE video devices. The two companies announced that they will work together to leverage the combined strengths of Videon Central (Videon) core middleware technologies and ActiveVideo® processing in the network “cloud” to significantly expand the reach and availability of rich, Web-based user experiences that are redefining interactive television (iTV 2.0). ActiveVideo anticipates that a joint solution would be available on Web-connected televisions, BD and DVD players, and other devices in millions of homes by year end, 2010.
TSMC Reference Flow 10.0 Features Mentor Graphics Low Power Solution
Mentor Graphics Corporation (NASDAQ:MENT) announced that its low power RTL-to-GDSII tool flow has been included in Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC) Reference Flow 10.0. TSMC and Mentor worked together nearly a year to validate and deliver a robust set of tools with proven support for the Unified Power Format (UPF). “In addition to expanding the Mentor reference flow to add both functional verification and implementation technologies, Mentor is addressing new challenges such as low power,” said S.T. Juang, senior director of Design Infrastructure Marketing at TSMC.
Kontron Acquires DIGITAL-LOGIC
Kontron, one of the leading companies of Embedded Computer Technology, further extends its global market position with the acquisition of the non-public DIGITAL-LOGIC AG, headquartered near Solothurn, Switzerland. Kontron takes over a 78 percent majority of DIGITAL-LOGIC AG, which is specialized on highly reliable and compact rugged embedded computer boards and systems since 1992. Kontron intends to increase its ownership of the company with 15 million EUR revenue and 100 employees to 100%.
IBM Prototypes Densest, Fastest On-Chip Dynamic Memory in 32nm, SOI
IBM (NYSE: IBM) has successfully developed a prototype of the semiconductor industry’s smallest, densest and fastest on-chip dynamic memory device in next-generation, 32-nanometer, silicon-on-insulator (SOI) technology that can offer improved speed, power savings and reliability for products ranging from servers to consumer electronics.
Datasound Laboratories Rolls Out ACS-2663 Embedded System
A new, low power, fanless computing platform from Datasound Laboratories is designed to withstand the rigours of industrial applications while providing extensive computer power. Packaged in a heavy duty steel chassis with aluminium flutes which act as a heatsink and brackets for wall/bulkhead mounting, the ACS-2663 uses the 1.6GHz Intel Atom N270 processor supported by up to 2GB DDR memory.
Wind River Linux 3.0 for MIPS Complies with Carrier Grade Linux 4.0
Wind River announced that Wind River Linux 3.0 for MIPS® architectures complies with the Carrier Grade Linux (CGL) 4.0 specification from the Linux Foundation, a critical requirement for the telecommunications and high-end data networking markets. This includes MIPS-based multicore processors from Cavium Networks and RMI Corporation, and also extends existing CGL 4.0 support for PowerPC and x86 architecture-based processors from Freescale and Intel.
Tektronix Introduces RSA6120A Spectrum Analyzers
Tektronix, Inc., a leading worldwide provider of test, measurement, and monitoring instrumentation, announced it has expanded the RSA6000 series to include the RSA6120A spectrum analyzer, which extends all of the industry-leading capabilities of the RSA6000 Series out to 20GHz, allowing designers to apply the spectrum analyzer’s market-leading capabilities throughout the entire Ku band.
ZeroG, Micrium Team on Wi-Fi Solutions for Embedded Designs
ZeroG Wireless, an innovator in low-power embedded Wi-Fi design, and Micrium, a leading provider of embedded middleware, announced that the companies have partnered to bring Wi-Fi solutions to leading microcontroller platforms. The resulting solutions represent an easy method for design engineers to address the rapidly growing Wi-Fi demand, moving beyond Ethernet for their 32-bit embedded designs. First demonstration of the combined solution will be at the Embedded Systems Conference in Boston, September 21-22, in STMicroelectronics booth #209.
Aeroflex Announces LTE Measurement Capabilities to PXI 3000 Platform
Aeroflex, the leading global provider of Long Term Evolution (LTE) test equipment, has announced it has added new LTE measurement capabilities to its flexible, modular PXI 3000 platform. This latest addition enables production test engineers to achieve faster time-to-volume for RF components and LTE user equipment. The new solution leverages itself on Aeroflex’s track record in LTE testing for R&D and the proven yield and throughput benefits of the PXI 3000 Series platform in mobile handset manufacturing.
Tensilica, Micrium Announce Expanded Support for uC/OS-II RTOS
Tensilica®, Inc. and Micrium announced expanded support for Micrium’s popular uC/OS-II RTOS (real-time operating system) available directly from Micrium. The RTOS port has been enhanced to take full advantage of all configuration options on Tensilica’s Xtensa® customizable dataplane processors (DPUs) as well as Tensilica’s standard DPUs and Diamond controller cores.
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