ARM Adds Multi Drop Support to CoreSight Serial Wire Debug Solution
ARM (LSE:ARM) (Nasdaq:ARMH) has introduced multi-drop support into the ARM CoreSight Serial Wire Debug (SWD) solution, enabling simultaneous connection to multiple devices from a single debug host. This latest version of SWD with multi-drop support brings a high performance and low cost 2-pin debug solution to complex, multi-core, multi-chip products such as mobile devices, making debug implementation more affordable in the end product.
NEC, Option Team on Reference Design for Intel Moorestown Platform
NEC Electronics America, Inc. announced the availability of a robust and easy-to-implement reference design blueprint for Intel’s next generation Mobile Internet Device (MID) and Smart Phone platforms, codenamed “Moorestown.” Using NEC Electronics’ power management IC (PMIC) solution (codenamed “Briertown”) and global wireless technology leader Option’s GTM501L wireless module, the companies worked closely together to develop and validate the industry’s first solution that will help to accelerate PMIC and 2G/3G communications module integration in Moorestown MID designs. In support of the reference design blueprint, the companies will provide extensive design assistance and collateral to support customers developing MIDs with the Moorestown platform.
IC Nexus Introduces NXC2620 Embedded DVK4.0 Development Kit
IC Nexus Co. Ltd, announces the NXC2620 Embedded DVK4.0, a Development Kit with a 4.3 inch TFT color LCD module at 480×272 resolutions and 4-wire resistive touch screen. The Emb_DVK40 is a compact-sized computer board with a rich set of features. Its hardware comprises a NXC2620 CPU Card, a baseboard, a USB1.1 hub card and a TFT color LCD display. 5.7-inch (640×480) and 7-inch (800×480) optional LCD sizes are also available. Each Emb_DVK40 is pre-installed with either Windows CE 6.0 or Linux 2.6 OS for instant evaluation.
Numonyx Rolls Out eMMC for Automotive Infotainment Applications
In an industry address at the Embedded Systems Conference, the head of the embedded business for Numonyx B.V. pressed the industry to look to the memory subsystem for ways to simplify and speed their designs. Doing so would help provide a critical cost and time advantage, and stimulate further innovation in the embedded segment. Also, Numonyx reaffirmed its commitment to embedded customers with the introduction of a new product designed to bring flexible, high-quality, standardized and reliable flash memory solutions to the growing market segment for auto infotainment applications.
AllGo Systems, Kat Digital Join Android on MIPS Initiative Program
MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores for digital consumer, home networking, wireless, communications and business applications, welcomed two new companies to the ecosystem supporting its initiative to drive the revolutionary Android[tm] platform into a broad range of consumer electronic devices including set-top boxes, DTV, home media players, VoIP solutions and mobile internet devices (MIDs). Kat Digital Corp. (KatDC) and AllGo Systems are bringing unique multimedia technologies and expertise to bear on these efforts.
GE Fanuc, Cavium Networks Team on Multicore for Military-Aerospace
GE Fanuc Intelligent Platforms, a unit of GE Enterprise Solutions, announced that it has initiated a collaborative effort with Cavium Networks in which the two companies will facilitate high-performance compute technology using low power multicore processor architectures in military/aerospace applications. The initiative takes advantage of GE Fanuc’s strength in the military/aerospace industry and in the deployment of low power multicore solutions in the telecommunications industry, as well as Cavium Networks’ leadership in the design and development of industry-leading embedded multicore processors. The collaboration is expected to lead to the development of new solutions designed for military/aerospace applications that are based on multicore technology.
Intel Creates First Working Chips Built on 22nm Process Technology
At the Intel Developer Forum, Intel President and CEO Paul Otellini displayed a silicon wafer containing the world’s first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory as well as logic circuits to be used in future Intel microprocessors. The 22nm wafer displayed by Otellini is made up of individual die containing 364 million bits of SRAM memory and has more than 2.9 billion transistors packed into an area the size of a fingernail. The chips contain the smallest SRAM cell used in working circuits ever reported at .092 square microns. The devices rely on a third-generation high-k metal gate transistor technology for improved performance and lower leakage power.
Samplify Systems Unveils Ultrasound Reference Design for SAM1600 ADC
Samplify Systems, Inc., a next generation mixed-signal semiconductor company, announces availability of a reference design, for the ultrasound market, based on the company’s award-winning SAM1600 family of analog-to-digital converters, (ADCs) and the company’s Prism(TM) compression technology. SAM1600 compressing ADCs enable OEMs to reduce data bottlenecks in sophisticated ultrasound machines and more quickly, and cost effectively develop both basic black and white, as well as advanced color mode equipment.
SATA-IO to Develop mini-SATA Interface Connector Specification
Serial ATA International Organization (SATA-IO), the consortium dedicated to sustaining the quality, integrity and dissemination of serial ATA (SATA[tm]) technology, announced it is developing a specification for a mini-SATA (mSATA[tm]) interface connector. This new low-profile connector will enable more effective SATA integration in small form factor applications. mSATA will support 1.5 Gb/s and 3.0 Gb/s transfer rates.
Innovative Silicon Founder, CTO to Present Memory Core at SSDM2009
Innovative Silicon, Inc. (ISi), developer of the Z-RAM® zero-capacitor, floating body (FB) memory technology, announced that its founder and CTO, Dr. Pierre Fazan will be delivering a presentation titled “Overview and Future Challenges of Capacitor-less DRAM Technologies for High Density Memory Applications” at SSMD2009. Dr. Fazan will be speaking in the advanced memory core area, along with speakers from IMEC, Panasonic and Toshiba.
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