Open Handset Alliance Welcomes MIPS Technologies
MIPS Technologies, Inc. (Nasdaq: MIPS), a leading provider of industry-standard processor architectures and cores, announced it has joined the Open Handset Alliance[tm], a group of more than 45 technology and mobile companies working to offer consumers a richer, less expensive, and better mobile experience. The Open Handset Alliance developed Android, the first complete, open and free mobile platform. As a member of the Open Handset Alliance, MIPS Technologies will work with other members to contribute to continued development and success of the Android platform for mobile devices.
Cadence Physical Verification System Supports TSMC iDRC, iLVS for 40nm
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced that the Cadence Physical Verification System has adopted the new interoperable physical verification formats for 40-nanometer designs, consisting of iDRC for design rule checking and iLVS for layout vs. schematic checking, developed by Taiwan Semiconductor Manufacturing Company (TSMC). Cadence support of these new TSMC formats builds upon the previously announced Cadence QRC Parasitic Extraction support for the iRCX file format. This combination of physical verification and parasitic extraction and analysis capabilities ensures the continued availability of accurate and consistent manufacturing data to enhance silicon yield for Cadence customers using TSMC nanometer processes.
QNX to Certified Neutrino RTOS for IEC 61508 Safety Integrity Level 3
QNX Software Systems announced that it is pursuing IEC 61508 Safety Integrity Level 3 (SIL 3) certification for the QNX® Neutrino® RTOS, a fault-tolerant, high-performance operating system deployed in millions of mission-critical systems worldwide. SIL certification levels are defined by the International Electrotechnical Commission (IEC) 61508 standard; the higher the SIL level, the lower the risk of failure. SIL 3 is considered the highest level of risk reduction achievable on a single programmable electronic system.
Virage Logic Adds Production Proven Advanced Interface IP to SiPro
Virage Logic Corporation (NASDAQ:VIRL), the semiconductor industry’s trusted IP partner, announced new additions to its recently introduced SiPro[tm] product line of production-proven advanced interface IP. The expanded product line now includes complete standards-based solutions for PCI Express (PCIe) and Mobile Industry Processor Interface (MIPI®) as well as a unique multi-protocol IP solution for High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI) and DisplayPort interfaces. The Virage Logic SiPro product portfolio is the result of a collaboration with AMD (NYSE: AMD) that was announced in January 2009.
Cadence Design Systems Announces Expanded Multi-Core Support
Cadence Design Systems, Inc. (NASDAQ: CDNS), the leader in global electronic design innovation, announced the immediate availability of dramatically expanded support for multi-core processors across multiple technology domains. These new capabilities significantly improve performance and throughput of key products in the Cadence® Encounter® digital IC design, Incisive® verification, Virtuoso® custom IC, and Allegro® PCB and IC packaging platforms. These improvements represent the latest in Cadence’s ongoing initiatives to address the changing landscape of computing infrastructure by providing leading multi-core support for a wide range of products across all segments of the EDA industry.
Tower, Jazz Semiconductor Unveil Deep Silicon Via for 0.18um SiGe BiCMOS
Tower Semiconductor Ltd. (NASDAQ: TSEM) (TASE: TSEM) and its U.S. subsidiary, Jazz Semiconductor, announced the availability of its proprietary Deep-Silicon-Via[tm] (DSV) technology available in its 0.18-micron SiGe BiCMOS (SBC18). The new offering provides a simpler, more innovative way to create a low-inductance ground required to reduce power consumption of power amplifiers (PAs). Unlike older Through Wafer Vias used primarily with smaller wafer sizes in GaAs-based technology, the DSV is optimized for silicon 8-inch wafer manufacturing to significantly reduce the cost of the PA.
NXP TDA19997, TDA19998 Smart Switches Support HDMI 1.4
NXP Semiconductors unveiled intelligent switches supporting the new HDMI 1.4 specification released in June 2009. The NXP TDA19997 and TDA19998 smart switches support the Audio Return Channel (ARC) feature, a new option introduced in the HDMI 1.4 release, which reduces the number of cables required to deliver audio upstream for processing and playback. Building on the success of previous HDMI smart switches from NXP, the TDA19997 and TDA19998 also include support for all mandatory 3D over HDMI features. NXP is the one of the first semiconductor companies to deliver silicon supporting HDMI 1.4.
EVE ZeBu-Server Emulation System Emulates Design at 30 MHz
EVE, the leader in hardware/software co-verification, noted that its new emulation system ZeBu-Server can emulate a single design at a speed of up to 30 megahertz (MHz), based on recent benchmarks. Additional benchmarks proved that ZeBu-Server can emulate a one-billion gate design at a speed of one MHz, 100-million gates at speeds reaching five MHz and a 10-million gate design at a speed of 10MHz. It is able to communicate with multiple host PCs at up to three gigabits per second (Gbps) per machine. This enables a video transactor to display high-definition television images at multiple frames per second or to download the entire system-on-chip (SoC) software content in the emulator in a fraction of second.
In-Stat Publishes DisplayPort 2009: The New VGA or the New DVI?
Market research firm, In-Stat, expects DisplayPort to see significant adoption in mobile PCs, particularly as an internal interface between the motherboard and LCD panel. However, DisplayPort’s success in LCD monitors is much less certain, as LCD manufactures grapple with issues of backwards compatibility. The research, “DisplayPort 2009: The New VGA or the New DVI?” (#IN0904456MI), covers the worldwide market for DisplayPort and display interface technology.
Arithmatica Acquired by Forte Design Systems
Forte Design Systems announced that it has acquired Arithmatica, Ltd., provider of intellectual property (IP) and datapath synthesis based in the United Kingdom, to expand its product offerings and accelerate product development. Terms of the acquisition will not be disclosed. Forte will continue to develop and market Arithmatica’s CellMath[tm] products, including direct support for CellMath Designer[tm] (CMD) and support for CellMath Optimizer[tm] (CMO) through its relationship with Imagination Technologies. It will integrate Arithmatica’s patented technology and IP into its Cynthesizer[tm] SystemC high-level synthesis (HLS) software to enhance quality of results (QoR).
If you are familiar with RSS feeds, you can also sign up for our free news feed. Our RSS feed is updated in real-time while our newsletter is updated daily.