In-Stat Publishes Global Wi-Fi Chipset Forecast and Analysis Research
With growth rates well over 100% in 2010, shipments of Wi-Fi Chipsets based on the draft n/802.11n will surge ahead of those based on 802.11g, reports In-Stat. 802.11n is ahead in nearly every equipment category, but unit volume is being driven by shipment growth in mobile handsets and notebook PCs. “802.11n chipset revenue will surpass that of 802.11g this year as a result of higher Average Selling Prices (ASPs),” says Victoria Fodale, In-Stat analyst. “ASPs for draft n/802.11n chipsets are complex, as there are more options that can impact prices. These options include support for the 5GHz spectrum and the number of data streams, which can range from 1 to 4.”
iSuppli Comments on Consumer Microelectromechanical Systems Market
Defying the downturn in the overall electronics industry, the market for Microelectromechanical Systems (MEMS) used in consumer electronics and wireless products is expected to generate 6.4 percent growth in 2009, according to iSuppli Corp. Global consumer and wireless MEMS revenue will amount to $1.24 billion in 2009, up from $1.17 billion in 2008. This contrasts sharply with the 23 percent decline in overall semiconductor revenue expected in 2009. It also flies in the face of the predicted 8.2 percent and 13.1 percent drops in consumer electronics and wireless equipment revenue in 2009.
Lynguent Debuts Radiation Hardened By Design, BSIM4 Compact Model Toolkits
Lynguent®, Inc., announced two new toolkits for its ModLyng[tm] Integrated Modeling Environment (IME): Radiation Hardened By Design (RHBD) Toolkit and BSIM4 Compact Model Toolkit. The RHBD Toolkit includes models and tools which provide a modeling and analysis capability for Single Event Upset (SEU) behaviors in deep sub-micro processes. The BSIM4 Compact Model Toolkit includes a high fidelity BSIM4 model which provides more flexibility than has ever been available for adding new effects to existing processes built upon the BSIM foundation. These toolkits, when used with the ModLyng IME, enable semiconductor and systems companies to easily enhance their IC design flows with radiation SEU capability and thus save weeks in qualifying their designs and cell libraries for radiation hardness.
Electronic Design Automation Industry Revenue Declines in Q1 2009
The EDA Consortium (EDAC) Market Statistics Service (MSS) announced that the electronic design automation (EDA) industry revenue for Q1 2009 declined 10.7 percent to $1192.1 million, compared to $1334.2 million in Q1 2008, driven primarily by an accounting shift at one major EDA company. The four-quarter moving average declined 11.3 percent.
IEEE 1450.6.1 Standard for On-Chip Scan Compression Receives Approval
The IEEE has approved a new standard, IEEE 1450.6.1[TM], “Standard for Describing On-Chip Scan Compression.” This important standard for Integrated Circuit (IC) test is also known as the Open Compression Interface (OCI). It was initially created within the Accellera standards-setting organization and was transferred to the IEEE following Accellera’s ratification.
MontaVista Announces One Second Linux Boot Time in Industrial Applications
MontaVista Software, Inc., the leader in embedded Linux commercialization, announced the achievement of ultra-fast boot times on MontaVista Linux for embedded industrial applications. At the Virtual Freescale Technology Forum this week, MontaVista will be demonstrating a sample dashboard application fully operational in one second from cold boot, achieving a level of previously unmatched performance on any embedded Linux.
Satin IP, Toppan, XYALIS Improve Design for Mask Manufacturing
Satin IP Technologies SAS, Toppan Photomasks France SAS, and XYALIS SaRL have collaborated within the Crystal partnership program to significantly improve design for mask manufacturing (DFMM) by breaking the barriers that have traditionally separated integrated chip (IC) designers from mask shop engineers. Crystal is a European collaborative R&D program sponsored by the Cluster for Application and Technology Research in Europe on NanoElectronics (CATRENE). Other participants include Atmel and CEA-LETI. While the old design rule checkers (DRC) developed into sophisticated and pro-active design for manufacturing (DFM) tool suites, the mask rules checks are still implemented at the final phase when the GDSII data is released. Resolution enhancement techniques (RET) and optical proximity correction (OPC) further restrict the ability to revise the design or even to take into account the mask manufacturability issues for an additional design cycle.
Chartered Announces Single-Chip 65nm RF Platform
Chartered Semiconductor Manufacturing (Nasdaq:CHRT) (SGX:CHARTEREDSC), one of the world’s top dedicated foundries, announced a robust 65-nanometer (nm) RF platform specifically geared for developers of single-chip RF products. The Chartered process offering, jointly developed with IBM, is based on Chartered’s enhanced 65nm low-power process (65nm LPe), and includes an IBM RF physical design kit (PDK) available from Chartered. This RF Platform comes with broad RF design enablement from leading analog IP suppliers and the Wireless SoC Platform Alliance (WISPA) consortium.
Conformiq Debuts Qtronic Multi-Core, Parallel, Distributed Test Solution
Conformiq Inc., a worldwide provider of software test design solutions, announced the availability of the latest version of Conformiq Qtronic, now utilizing the power of multi-core, distributed and parallel computing for faster automatic test case generation. This scalability breakthrough paves the way for deploying Conformiq’s automated test design technology in grids and on cloud computing platforms. By distributing the computations on multi-cores or across clustered computer systems, Conformiq Qtronic customers can speed their test case generation process and reduce costs.
Future Horizons Comments on Second Quarter Chip Market Growth
Following hot on the heels of April’s 16 percent month-on-month sales growth, May grew a further 0.9 percent sequentially, putting June on track to break through the US$20 billion barrier, for the first time since the chip market collapsed last September. “Psychologically this will give everyone a shot in the arm”, commented Malcolm Penn, Chairman & CEO at the UK-based research firm, Future Horizons, “Second quarter growth is usually pretty pathetic … there have been only three historical precedents when such a spurt has happened. The big question now is: Is this the start of the chip market recovery or is it merely a blip on the statistics radar screen?”
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