Laker Custom Layout System Supports TSMC Interoperable Process Design Kit
SpringSoft, Inc. (TAIEX: 2473), a global supplier of specialized IC design software, announced that the Laker Custom Layout Automation System fully supports the industry’s first interoperable process design kit (iPDK) recently introduced by Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330) (NYSE: TSM) for its advanced 65-nanometer (nm) RF process technology. The Laker system running in the OpenAccess environment supported by the TSMC iPDK is currently installed at multiple beta sites and expected to be available for general release in early 2010.
Cirque Partners with Ocular on Crystal TouchT Display Screens
Cirque Corporation, the inventor of the first commercially successful capacitive touchpad and a subsidiary of ALPS Electric, has formed a strategic relationship with Ocular, Inc., the leader in advanced display-centric solutions. Cirque and Ocular are working together to advance the state-of-the-art of touch display screens. As a first step, Ocular has incorporated Cirque’s capacitive touch controller into its Crystal TouchT line of capacitive touch screens.
Real Intent Debuts Ascent Path-Based Verification for X-Robust Designs
Real Intent Inc., the innovator in automating the intelligence of formal techniques for design verification, announced that its early functional verification product family Ascent[TM] now includes the first commercially available automated solution to ensure X-robust designs, available through the Ascent Path-Based Verification (PBV) product.
Corelis Creates Solution Partner Program
Corelis, Inc., a leading supplier of high-performance boundary-scan tools, announced the inauguration of its Solution Partner Program. The Solution Partner Program was developed to form active partnerships with companies that have a high level of synergy and have sustained a long on-going business relationship with Corelis. Corelis advocates these partnerships to have active face-to-face communication which helps openly identify challenges and issues within the circuit board industry. This, in turn, provides direct input from third party sources which influences the development of more application-specific products designed to solve real world problems.
TSMC Debuts Unified Physical Verification Format for Advanced Process
Taiwan Semiconductor Manufacturing Company, Ltd. (TWSE: 2330, NYSE: TSM) unveiled interoperable design rule check (iDRC) and layout-versus-schematic (iLVS), two unified electronic design automation (EDA) data formats, for TSMC 40 nanometer (nm) process technology. TSMC iDRC and iLVS formats unify process design rules specification and technology file generation, simplify data delivery, and ensure data integrity and interpretation. Physical verification and analysis EDA applications, such as DRC and LVS tools, which support iDRC and iLVS formats, will be able to receive accurate design rules data from the iDRC and iLVS files developed and supported by TSMC.
Aeroflex Rolls Out TM500 TD-LTE Multi-UE for Multiple Handset Testing
Aeroflex has announced the TM500 TD-LTE Multi-UE, adding a multiple handset (multi-UE) capability to its market-leading test mobile range supporting TD-LTE infrastructure development. The TM500 TD-LTE Multi-UE enables TD-LTE infrastructure equipment vendors to test the performance of their TD-LTE basestations (e-NodeBs) under loaded conditions, accelerating the pace of infrastructure equipment development programmes. At the same time, Aeroflex has announced that it has already won a series of sales contracts for the TM500 TD-LTE Multi-UE.
AVIX-RT Launches AVIX RTOS Version 3.1
AVIX-RT releases version 3.1 of its AVIX RTOS offering a performance no competing product can meet. Building on the unmatched interrupt handling capabilities of its predecessor this new version 3.1 offers even more flexible integration between interrupt handlers and application threads. The ease with which AVIX allows interrupts to be integrated in your application is unmatched by any competing product.
G2 Launches G2C543 Wi-Fi SoC, G2M5437 Module, Icon Development Kit
Adding to its already successful low-power Wi-Fi Epsilon family of Wi-Fi RTLS chips, G2 Microsystems launched its new G2C543 low-power Wi-Fi SoC, G2M5437 module and Icon development kit that will make it easy for designers to connect consumer electronic devices directly to the Internet or to future Wi-Fi Personal Area Network systems.
Photovoltaic Equipment Industry Improves by 60% in Germany
The sales turnover of the manufacturers of equipment, machinery and plants for the photovoltaic industry in Germany for the first quarter of 2009 has exceeded the respective quarter of last year by 60 percent. The export ratio rose to 89 percent. The incoming orders significantly increased by 34 percent compared to the fourth quarter of 2008. This is the result of the current quarterly statistics that VDMA carries out specifically for this industry sector.
Accenture Acquires Nokia Symbian Professional Services
Nokia (NYSE: NOK) and Accenture have entered into an agreement for Accenture to acquire Nokia’s Symbian Professional Services unit responsible for Symbian OS customer engineering and customer support. The unit provides engineering consulting and product development services on a global basis to mobile phone manufacturers, as well as chip manufacturers and mobile operators.
« Newer Posts || Older Posts »
If you are familiar with RSS feeds, you can also sign up for our free news feed. Our RSS feed is updated in real-time while our newsletter is updated daily.
