SpringSoft, Inc. (TAIEX: 2473), a global supplier of specialized IC design software, announced that the Laker Custom Layout Automation System fully supports the industry’s first interoperable process design kit (iPDK) recently introduced by Taiwan Semiconductor Manufacturing Company, Ltd. (TSE: 2330) (NYSE: TSM) for its advanced 65-nanometer (nm) RF process technology. The Laker system running in the OpenAccess environment supported by the TSMC iPDK is currently installed at multiple beta sites and expected to be available for general release in early 2010.
SpringSoft is a founding member of the Interoperable PDK Alliance (IPL) and validation partner for the TSMC 65nm iPDK. The validation process involved extensive interoperability testing between Ciranova, Magma, SpringSoft, Synopsys, and TSMC. In addition, SpringSoft recently announced a multi-year agreement with TSMC to jointly develop and validate Laker PDKs for TSMC’s leading-edge chip manufacturing technologies beginning with 90nm, 65nm, and 40nm nodes, with immediate availability of the first TSMC foundry-certified Laker 65nm CMOS PDK.
The collaboration between the two companies is driven by their mutual support of interoperable PDKs as the long-term goal for providing custom chip designers with manufacturing flexibility, technology choice, and design productivity. “Delivery of the TSMC iPDK is an important milestone for the industry, and the realization of the standardization and interoperability goals established by the IPL Alliance. Now, not only can tools work on the same database without translation, but IC designers are able to reuse advanced PCell libraries across multiple design environments. This is a win for Laker users and the entire custom chip design ecosystem,” said Duncan McDonald, product marketing director for Laker Physical Design at SpringSoft.
Designers can learn more about the Laker Layout System and the TSMC iPDK at the 46th Design Automation Conference (DAC) in San Francisco, Calif., this week from July 27th through July 30th. SpringSoft presentations will take place in the TSMC Open Innovation Platform (OIP) Booth #822 and as part of the SpringSoft IC Design Automation Showcase in Booth #3367.
SpringSoft, Inc. is a global supplier of specialized automation technologies that accelerate engineers during the design, verification and debug of complex digital, analog and mixed-signal ICs, ASICs, microprocessors, and SoCs. Its award-winning product portfolio features the Novas Verification Enhancement and Laker Custom IC Design solutions used by more than 400 of today’s leading IDM and fabless semiconductor companies, foundries, and electronic systems OEMs. Headquartered in Hsinchu, Taiwan, and San Jose, California, SpringSoft is the largest company in Asia specializing in IC design software and a recognized industry leader in customer service with more than 400 employees located in multiple R&D sites and local support offices around the world.
Novas and Laker are trademarks of SpringSoft, Inc.