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Archive for June 2009

Real-time Operating System Market to Contract

Posted by Ken Cheung in Research,RTOS on Monday, June 22, 2009

A recently published report by VDC Research indicates that embedded system manufacturers’ requirements and end-consumers’ expectations continue to drive substantial investment in embedded software and development tools. The embedded and real-time operating system market, in particular, has faired better than many other sectors of the broader embedded market, with 2008 revenue demonstrating 9% growth over 2007. However, even this achievement is qualified with the expectation of the first industry contraction in 2009 since 2002.

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DAFCA, Carnegie Mellon Advanced Chip Test Laboratory Team on Research

Posted by Ken Cheung in Research on Monday, June 22, 2009

DAFCA, Inc., the premier provider of programmable IP, embedded security for system and device assurance, and software solutions that automate and accelerate ASIC and FPGA validation, announced that it has partnered with the Advanced Chip Test Laboratory (ACTL) at Carnegie Mellon University to conduct instrumentation-enhanced failure analysis for IC yield improvement. Under the leadership of the ACTL’s founder and head Professor Shawn Blanton, researchers will explore the synergies between DAFCA’s ClearBlue[tm] on-chip instrumentation technology and ACTL’s test-data mining research in the areas of failure analysis, diagnosis and yield.

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NEC Creates Architecture for Miniaturized Analog Circuit

Posted by Ken Cheung in Components,Research on Thursday, June 18, 2009

NEC Electronics Corporation announced the successful development of a new architecture that can be used to provide both the miniaturization and the high accuracy to the analog circuits, including analog-to-digital (AD) and digital-to-analog (DA) converters. Advances in LSI miniaturization have brought about a system-on-chip (SoC), with a single SoC requiring a mixture of digital and analog circuits, increasing the numbers of embedded devices to shrink. As the SoCs scale down, overall power consumption decreases through lowered voltage and current, causing the poor matching characteristics between devices to increase relatively.

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MAZeT Introduces Spectral Sensors for Process Analytics

Posted by Ken Cheung in Components on Thursday, June 18, 2009

MAZeT presents its multi-range spectral sensors that MAZeT uses as basis for developing and supplying application-specific sensor modules for its customers. The sensors can be adapted to the particular application both in regard to the number of spectral channels and the spectral transmission characteristics of each channel. The first sensor presented in this design has six spectral channels, whose filters from 400 nm to 700 nm overlap one another and are uniformly distributed over this range.

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Vishay Unveils SiZ700DT Asymmetric Power MOSFET in PowerPAIR Package

Posted by Ken Cheung in Components on Wednesday, June 17, 2009

Vishay Intertechnology, Inc. (NYSE: VSH) introduced the first device in a series of copackaged, asymmetric power MOSFET pairs that reduces the space required for the high- and low-side power MOSFETs in dc-to-dc converters. The industry-first SiZ700DT in the new PowerPAIR[tm] package, which measures 6-mm by 3.7-mm, combines a low-side and high-side MOSFET in one compact device while still obtaining low on-resistance and high maximum current, saving space over using two discrete solutions. The height of PowerPAIR is 0.75 mm typical, or 28 % thinner than the PowerPAK® 1212-8 and PowerPAK SO-8, which both have a 1.04-mm profile.

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TelcoBridges Launches Tdev TMP800 Multi-Service Development Platform

Posted by Ken Cheung in Networking on Tuesday, June 16, 2009

TelcoBridges[tm], the preferred hardware and software supplier for telecom system integrators, solution developers and service providers, announced the launch of the Tdev TMP800[tm] Multi-Service Development Platform, a base addition to the award-winning Tdev family of development platforms, which help solutions developers build and deploy telecommunications services for their customers. TelcoBridges will present this new offering, as well as the recently announced TMG800 media gateway, this week at CommunicAsia in booth # 5D4-01.

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Agilent Technologies Announces Digital Measurement Forum

Posted by Ken Cheung in Events, Training,Test Solution on Tuesday, June 16, 2009

Agilent Technologies Inc. (NYSE:A) kicked off its Agilent Digital Measurement Forum (ADMF) in Seoul, Korea. The annual forum, which brings together local and global industry leaders to address all digital-related measurement solutions from consumer electronics to high-speed digital design, will be held in six countries in the Asia-Pacific region from June 18 to July 16. Partners and collaborators such as Xilinx, The MathWorks and Microchip Technology are participating in the forum.

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Aeroflex Unveils 3021C, 3026C Signal Generators for RF Component Test

Posted by Ken Cheung in Test Solution on Monday, June 15, 2009

Aeroflex has announced it has expanded its flexible PXI modular test platform with the addition of two new 3020 Series high-power and compact RF signal generators. The 3020 Series are compact, high-precision PXI modular RF signal generators with integrated dual-channel arbitrary waveform generators ideally suited for R&D manufacturing and design verification of RF components and systems. The addition of the 3021C and 3026C extend the output power range of the 3020 Series to +17dBm for frequencies up to 3GHz and 6GHz respectively.

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MontaVista Supports Freescale VortiQa Software, Multicore Processors

Posted by Ken Cheung in Networking,RTOS on Monday, June 15, 2009

MontaVista® Software, Inc., the leader in embedded Linux® commercialization, announced its support for Freescale VortiQa software and its continued support for Freescale multicore processors. VortiQa software is production-ready and delivers integrated security and networking functionality to products built on QorIQ[tm] platforms and PowerQUICC® processors. MontaVista was the first commercial Linux vendor to provide support for the Freescale QorIQ platforms.

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Duolog Socrates Chip Integration Platform Integrates with Arteris NoC

Posted by Ken Cheung in Design Flow,IP Cores on Monday, June 15, 2009

Arteris Inc., the leading developer of Network on Chip (NoC) solutions, and Duolog, a provider of SoC integration tools, announced the integration of Duolog design tools with Arteris’ NoC solution to provide designers a more streamlined and efficient way to integrate multiple semiconductor intellectual property (IP) blocks on a single system on chip (SoC) device. The integration leverages Arteris’ NoC solution for enabling high-performance on-chip interconnect and communications, and Duolog’s Socrates[tm] Chip Integration Platform, which is a suite of tools for capturing, viewing and validating various elements of the infrastructure of complex SoCs.

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