IBM Technology Alliance Develops 28nm HKMG Low-Power CMOS Process
In a move that signals a firm and ongoing commitment to advanced semiconductor technology leadership, IBM (NYSE: IBM), Chartered Semiconductor Manufacturing Ltd. (Nasdaq: CHRT and SGX-ST: Chartered), GLOBALFOUNDRIES, Infineon Technologies (FSE/NYSE: IFX), Samsung Electronics, Co., Ltd., and STMicroelectronics (NYSE: STM) have defined and are jointly developing a 28-nanometer (nm), high-k metal gate (HKMG), low-power bulk complementary metal oxide semiconductor (CMOS) process technology.
Synopsys Enhances DesignWare IP for ARM AMBA 3 AXI Interconnect
Synopsys, Inc., a world leader in software and IP for semiconductor design and manufacturing, announced that it has enhanced its DesignWare® IP for the ARM® AMBA® 3 AXI[tm] interconnect with the industry’s first hybrid architecture implementation, enabling dedicated high-performance and shared low-performance channels to be combined within a single AMBA 3 AXI on-chip interconnect. This new architecture, available in synthesizable source RTL, allows designers to configure the bus fabric to eliminate unnecessary logic within the design, thereby reducing area, power consumption, and overall routing congestion. The hybrid architecture is ideal for system-on-chip (SoC) designs that use a native AMBA 3 AXI interconnect. It also reduces the area impact for SoC designs transitioning from an AMBA 2.0 AHB[tm] to an AMBA 3 AXI-based architecture.
Jasper Introduces University Program for Formal Verification
Jasper Design Automation, provider of advanced formal technology solutions, announced the Jasper University Program, advancing the use and understanding of formal techniques in select universities worldwide. The three schools in the program are Portland State University, Portland, Oregon, United States; Chalmers University of Technology, Goteborg, Sweden; and the Universidade Federal de Minas Gerais, Minas Gerais, Brazil.
Atotech Joins SEMATECH 3D Interconnect Program at CNSE
SEMATECH, a global consortium of chip-makers, and global metallization technology provider, Atotech announced that Atotech has become a member of SEMATECH’s 3D Interconnect Program located at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. As a member of SEMATECH’s 3D program, Atotech will collaborate with SEMATECH in leading-edge research to enable the development of high yield, low cost copper electroplating solutions that will enable void-free filling of high density 3D through-silicon-vias (TSVs).
Cavium Networks OCTEON II Processors Feature MIPS64 Architecture
MIPS Technologies, Inc. (NasdaqGS: MIPS), a leading provider of industry-standard architectures, processors and analog IP for digital consumer, home networking, wireless, communications and business applications, announced that its ultra high-performance MIPS64® architecture is powering the new OCTEON[tm] II Internet Application Processors (IAP) introduced by Cavium Networks (NASDAQ: CAVM). The OCTEON II family with up to 32 MIPS64 cores is the latest in Cavium’s successful line of scalable multi-core OCTEON processors based on the MIPS64 architecture, and it sets a new record for the maximum number of MIPS64 processor cores in a single chip.
Kontron to Support Cavium Networks OCTEON II Multicore MIPS64 Processor
Kontron announced its intentions to design with the OCTEON II processors from Cavium Networks (NASDAQ: CAVM), a leading provider of semiconductor products that enable intelligent processing for networking, communications, storage, wireless, video and security applications. As a Cavium PACE (Partnership to Accelerate Customer End-solutions) member, Kontron will leverage the success of its AM42xx series of AdvancedMC Intelligent I/O modules that are designed with OCTEON Plus multi-core processors, and introduce its next generation modules using the OCTEON II processor family. Clients will be able to upgrade their systems with the highest packet processor performance, unprecedented scalability, and newly added virtualization functionalities, to support their multiple network infrastructure equipment such as media gateway and wireless base station type applications.
Robotics Trends Reveals Exhibitors for RoboBusiness Conference
Robotics Trends and EH Publishing announced the lineup of exhibiting companies for the 2009 RoboBusiness Conference & Exposition which takes place this week, April 15-16, at the Hynes Convention Center in Boston, Massachusetts. RoboBusiness Conference & Exposition is the international business development event for personal, service and mobile robotics industry.
DAFCA Licenses Technology from Stanford GPS Research Laboratory
DAFCA, Inc., the premier provider of software solutions that automate and accelerate post-silicon system-on-a-chip validation, announced a licensing/assignment agreement with Professor Per Enge and his colleagues Dr. Sherman Lo and Dr. David De Lorenzo of Stanford’s GPS Research Laboratory in the University’s Department of Aeronautics & Astronautics. Under the terms of the agreement, the Stanford-based team will issue DAFCA an assignment of intellectual property and an exclusive license to use its GPS signature-related technology to help secure the supply chain for integrated circuits. DAFCA contributed to the initial development of the technology, of which Chairman Jim Kelley is a named co-inventor, and will serve as a partner with Stanford University’s GPS lab for future research in this area.
MSC Vertriebs Announces CXB-A945M COM Express Starter Kit
MSC Vertriebs GmbH offers an complete starter kit for the evaluation and development of its Intel® Atom[tm] processor based COM Express[tm] platform CXB-A945M. The ready-to-use starter kit contains the industrial platform MSC CX-MB-IP1 integrating the COM Express[tm] module CXB-A945M and a bootable Linux and drivers for the Windows® XP operating system. The development package is also available in conjunction with a 15 inch TFT display including a cable for the onboard LVDS interface and a backlight inverter. The mini-ITX reference platform (170 x 170mm) can be used as complete solution in small series to build functional systems immediately.
Crossware ARM Development Suite Speeds Atmel AT91SAM Platform
Crossware, a leading embedded software tools developer, has enhanced its ARM® Development Suite to radically improve the speed of application development across Atmel’s family of AT91SAM chips. These enhancements are made possible by Crossware extending its Workspace Creation Technology, developed originally for the ColdFire MCF5249, to support the wide range of applications examples (Softpacks) available from Atmel to support developers using its SAM7 and SAM9 ARM-based microcontrollers.
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