Fujitsu to Transfer Hard Disk Drive Business to Toshiba
Toshiba Corporation (TOKYO:6502) and Fujitsu Limited (TOKYO:6702) announced that they have concluded a definitive agreement on the transfer of Fujitsu’s hard disk drive (HDD) business to Toshiba. The agreement follows a memorandum of understanding (MOU) signed by the companies on February 17, 2009. The companies will now seek to complete the business transfer by the target date of July 1st, 2009.
SYSGO, Vector Software Team on Safety Critical Applications
SYSGO announced a partner agreement with Vector Software. SYSGO is a leading supplier of software solutions for the world’s most demanding safety and security applications. Vector Software is a leading provider of software test tools for embedded systems. The partnership will allow DO-178B certifiable PikeOS developers to use leading software testing and code coverage from Vector Software as part of the certification process of their applications.
Universal Powerline Association Plug into Profit Conference
The Universal Powerline Association (UPA) announces a top-level speaker line up and a new date for its Inaugural Technology Conference and Exhibition – September 1-2, 2009. The UPA “Plug into Profit 2009″ Conference to be held in San Diego, CA. USA, includes technical, application and business presentations from leading companies on the role of Powerline technology in Smart Grid, Energy Efficiency, Home Area Networks, IPTV, HDTV, Internet Connectivity and Consumer Applications.
Tokyo Ohka Kogyo Joins SEMATECH Resist Materials and Development Center
SEMATECH, a global consortium of chipmakers, and Tokyo Ohka Kogyo Co., Ltd. (TOK), a leading manufacturer of photoresists, announced that TOK has joined SEMATECH’s Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany. The RMDC’s mission is to develop resist and materials for 22 nm patterning technologies and beyond, and consists of both extreme ultraviolet (EUV) exposure capability and a portfolio of sponsored university research programs. TOK will team with researchers at SEMATECH to develop and demonstrate EUV materials and resists for use at the 22 nm node and beyond.
Integrated Silicon Solution Acquires Enable Semiconductor
Integrated Silicon Solution, Inc (Nasdaq: ISSI), a leader in advanced memory solutions, announced it has acquired Enable Semiconductor Corporation, a private Taiwan and Korea based company, formerly a subsidiary of Nanoamp Solutions, Inc. For ISSI, the acquisition adds both ultra low power Single Data Rate (SDR) and Double Data Rate (DDR) SDRAMs, and ultra low power Pseudo SRAMs in Known Good Die (KGD) and package format targeted at the portable consumer products market.
Toshiba, Nakaya, Amkor Team on Joint System LSI Assembly, Test Service
Nakaya Microdevices Corporation (NMD), Amkor Technology, Inc. (Nasdaq: AMKR) and Toshiba Corporation (TOKYO: 6502) announced that they have signed a non-binding memorandum of understanding expressing their intent to form a joint venture in Japan that will provide system LSI assembly and testing services. The structure, terms and amounts of each party’s contributions and other support for the joint venture have not yet been determined. The commencement of joint venture operations is targeted for October 1, 2009 but is subject to the negotiation of definitive agreements, due diligence and the receipt of any necessary government approval.
NEC Electronics, Renesas to Integrate Business Operations in July
NEC Electronics Corporation (NEC Electronics; TSE: 6723), Renesas Technology Corp. (Renesas), NEC Corporation (NEC; TSE: 6701), Hitachi, Ltd. (Hitachi; TSE: 6501 / NYSE: HIT), and Mitsubishi Electric Corporation (Mitsubishi Electric; TSE: 6503) agreed to enter into negotiations to integrate business operations at NEC Electronics and Renesas.
Integrated Device Technology Makes Offer to Acquire Tundra Semiconductor
Tundra Semiconductor Corporation (TSX:TUN) (“Tundra”) announced the receipt of an acquisition proposal from Integrated Device Technology, Inc. (NASDAQ:IDTI ) (“IDT”) for the acquisition of all of the issued and outstanding common shares of Tundra by way of a statutory plan of arrangement at a cash price of Cdn $6.25 per share, or an aggregate purchase price of approximately Cdn $120.8 million (the “IDT Offer”). The IDT Offer is not subject to any due diligence condition, and IDT has indicated that the purchase price payable under its offer will be funded from IDT’s cash balance.
RMI Introduces Home Media Player Application Development Kit
RMI Corporation, a leading provider of high-performance processors for communication and media-rich applications, announced the availability of its Home Media Player® Application Development Kit (ADK) challenging the television and the PC for multimedia consumption in the home. The ADK is an open development system and includes a complete software Board Support Package (BSP) for customers and original design manufacturers (ODMs) targeting media-based applications such as wireless Digital Photo Frames (DPFs), Mobile Internet Devices (MIDs), Digital Signage, Information Dashboards and other home networking and consumer devices.
78K Primer Kit for NEC Microcontrollers
Gleichmann Electronics now offers the 78K Primer Kit, a complete learning packet, for just 120 Euros. The 78K Primer Kit is designed to help and educate engineers and students that want to learn more about NEC Electronics’ popular 78K 8-bit and 16-bit microcontroller families. In addition to two evaluation boards – one equipped with an 8-bit 78K0/KF2 and the other with a 16-bit 78K0R/KG3 microcontroller – the learning packet also includes a photodiode, a thermal sensor and a buzzer. A circuit diagram, complete with ready-to-use sample program, makes it easy for users of the “78K Primer Kit” to program the respective peripheral units.
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