The small Computer-on-Modules form factor nanoETXexpress (84 mm x 55 mm), originally initiated by Kontron, is gaining momentum and acceptance in the market. The embedded Computer-on-Modules vendors Aaeon, Adlink and Advantech together with Kontron have jointly released revision 1.0 of the nanoETXexpress specification, which now includes SDVO support. They will present the nanoETXexpress form factor to the PICMG consortium for incorporation into one of the next COM Express releases under the proposed neutral name “Ultra.”
Future-proof design, maximum reliability and longevity are just some of many high quality features of the nanoETXexpress form factor that have inspired Aaeon, Adlink, Advantech and Kontron to work together on revision 1.0 and push for its incorporation as “Ultra” – along with the slightly larger “Compact” module (95 x 95mm) – into the COM Express specification. Currently, the COM Express specification includes only the “Basic” (95 x 125mm) and “Extended” (110 x 155mm) form factors.
“We support the “Ultra” form factor because it fits perfectly into our product portfolio. We have already implemented the Intel Atom processor on our COM-U15 COM Express Computer-on-Module. The step to implementing the nanoCOM-U15 was therefore easy”, explains Peter Yang, AAEON Product Manager ECD, responsible for Computer-on-Modules at AAEON.
“In the market for Computer-on-Modules oriented designs we have seen how customers have shown a clear preference towards a single open standard: PICMG’s COM Express. By proposing this new “Ultra” small form factor that remains fully pin and signal compatible with PICMG’s COM Express Type 1, we can leverage COM Express success and use its existing design ecosystem and collateral. The COM Express compatible connectors, with their higher EMC, inherently make “Ultra” a future proof design for the small form factor Computer-on-Modules market, says Henk van Bremen, Product Director for ADLINK’s Embedded Division.
“Since it is based 100 percent on the pinouts and connector locations used in the already established and proven COM Express Type 1 specification, developing a small form factor Computer-on-Module in accordance with the COM Express specification is the securest long-term investment,” says Aaron Su, Product Manager of Advantech.
“The support of these three other major Computer-on-Modules vendors underlines the fact that nanoETXexpress is a safe investment . In addition, the market for the COM Express Type 1 interconnects is very strong with an expected CAGR of 70% up to 2010 according to VDC. This is why we expect the “Ultra” small Computer-on-Module specification to become the de facto standard for small form factor designs based on Computer-on-Modules,” says Dirk Finstel, CTO of Kontron.
SDVO now available on nanoETXexpress Computer-on-Modules
The small nanoETXexpress Computer-on-Modules offer maximum graphic flexibility as reflected in the new SDVO support. Moreover, they achieve this at a very low cost. Revision 1.0 of the nanoETXexpress Computer-on-Modules specification enables SDVO signal transport via a separate flat foil connector. The LVDS output on the COM Express connector can therefore also be retained and used alongside DVI, giving designers the possibility of designing-in extra graphic interfaces on the carrier board to enable dual display solutions.
Revision 1.0 of the nanoETXexpress specification can be downloaded from www.nanoetxexpress.com/.
Further embedded computer manufacturers are invited to develop Computer-on-Modules in accordance with the proposed COM Express “Ultra” specification. Further details are available at www.nanoetxexpress.com/specs/specs.php.
AAEON Technology, established in 1992, develops, manufactures and markets a wide range of industrial computer solutions, embedded computer systems, BOX PCs, PC/104, Computer-on-Modules, medical PCs and more. AAEON has approx. 450 employees working in several offices around the world, including the USA, Europe, China and Singapore. We are committed to providing our customers with reliable, high quality embedded motherboards, panel PCs, medical PCs, industrial PCs, Computer-on-Modules and the necessary accessories for turnkey systems. Our tailor made OEM/ODM solutions are valued by our long-term and renowned customers who receive exactly the right custom-designed IPC solution for their projects. Our large OEM/ODM customers thereby play a central role in our worldwide growth.
ADLINK Technology provides a wide range of embedded computing products and services to the test & measurement, automation & process control, gaming, communications, medical, network security, and transportation industries. ADLINK products include PCI Express-based data acquisition and I/O; vision and motion control; and AdvancedTCA, CompactPCI, and Computer-on-Modules (COMs) for industrial computing. With the acquisition of Ampro Computers, Inc., ADLINK also provides a wide range of Extreme Rugged and Rugged Single Board Computers, Computer-on-Modules and Systems under the brand name Ampro by ADLINK. ADLINK strives to minimize the total cost of ownership (TCO) of its customers by providing customization and system integration services, maintaining low manufacturing costs, and extending the lifecycle of its products. ADLINK is a global company with headquarters and manufacturing in Taiwan; R&D and integration in Taiwan, China, and the US; and an extensive network of worldwide sales and support offices.
Founded in 1983, Advantech delivers visionary and trustworthy industrial computing solutions that empower businesses. We cooperate closely with solution partners to provide complete solutions for a wide array of applications in diverse industries, offering products and solutions in three business categories: Embedded ePlatform, eServices & Applied Computing, and Industrial Automation groups. With more than 3,400 dedicated employees, Advantech operates an extensive support, sales and marketing network in 18 countries and 39 major cities to deliver fast time-to-market services to our worldwide customers. Advantech is a Premier Member of the Intel Embedded and Communications Alliance, a community of embedded and communications developers and solution providers.
Kontron designs and manufactures embedded and communications standards-based, rugged COTS and custom solutions for OEMs, systems integrators, and application providers in a variety of markets. Kontron engineering and manufacturing facilities, located throughout Europe, North America, and Asia-Pacific, work together with streamlined global sales and support services to help customers reduce their time-to-market and gain a competitive advantage. Kontron’s diverse product portfolio includes: boards & mezzanines, Computer-on-Modules, HMIs & displays, systems & platforms, and rugged & custom capabilities. Kontron is a Premier member of the Intel® Embedded and Communications Alliance and has been a VDC Platinum Vendor for Embedded Computer Boards 5 years running. Kontron is listed on the German TecDAX stock exchange under the symbol “KBC”.
Kontron is a trademark or registered trademark of Kontron AG. DIMM-PC, PISA, ETX, ETXexpress, microETXexpress, X-board, DIMM-IO and DIMM-BUS are trademarks or registered trademarks of Kontron Embedded Modules GmbH. Intel and Intel Atom are trademarks of Intel Corporation in the US and other countries.